I cant deal with my MoBo's two heatsinks around CPU, their temps are crazy

You should not have to do anything to those heatsinks. You should absolutely NOT be using silicon on ANYTHING. Silicon is in insulator. Or sticking things on those heatsinks. You either need better case cooling, the board is defective, or you set a voltage way to high.

Which raises a good question. What IS your voltage at? If it's 4.8V your CPU would be toast.

4.8v forrealz? if your board handles that with out dieing its deff military class forsure.... lol screenshots plx

You can always stick a little fan on them. I have one cooling my north bridge.

One of the very reasons I stopped using MSI products was the lousy job done in heat sink applications whether it be motherboard or graphics card usually a high heat can be contributed to improper heat sink installation.

You'll need to pull the heat sinks one at a time and inspect the contact under it, the one labeled Military Class is over the motherboards voltage regulators it will normally have a thermal pad under the heat sink.

What you are looking for is full coverage of the top of the VR with a good imprint indention or the foot print under the heat sink, you need full even coverage across all the VRs.

The thermal pad is a heat conductor transferring the heat from the VR module to the heat sink, you need the same imprint depth across the entire pad, if the imprint is deep at the screws but shallow in the middle, check the heat sink for flatness.

Be careful with any adjustments you make if you need to straighten the heat sink itself, if it is not making good even contact the area it isn't is not transferring the heat properly and under those circumstances the life of the motherboard will seriously be shortened.

The goal of this inspection is to make sure there is evenly distributed contact across the entire heat sink base with the VRs, adjusting the heat sink if necessary if it is warped, in some cases you may need to purposely warp the heatsink in the middle to increase the center span of pressure if the contact is not good.

The visual inspection should reveal any contact problems.

Secondly the black Military Class ID plate is usually stuck on with double stick tape, you can remove that plate to gain more use of the restricted airflow, remove it carefully and do not discard the plate, keep it in case you have to RMA the motherboard because you'll need to restick to RMA the motherboard.

This plate removal also applies to the other heat sink with the black MSI plate.

Now regarding the heat sink with the MSI badge, it usually has thermal compound underneath it, MSI is notorious for using way too much thermal compound where thermal compound is used, pull it and inspect underneath for too much thermal compound, or improper alignment, the footprint will tell you exactly whats going on underneath.

You only want enough thermal compound when under mounting pressure to reach the edge of the die, not gushing out all around the die, too much thermal compound insulates instead of conducts the heat.

Be careful in your inspection and report what you discover.

I hope this helps you, if you do nothing more than remove the ID plates it will help the cooling, but I strongly urge you to see whats going on underneath the heat sinks.

One of my MSI motherboards had the thermal pad across the VRs installed at an angle only partially covering the last 2 blocks, I was lucky I had discovered that.

Good Luck!

Ryan



He never said his voltage was 4.8v, he said 1.48v.



He's already done that.