I am using an Intel i5 3570k (pre applied paste) and cooling it with a h100i. At 3400 (stock clock) my idle temps (25-30c) seem acceptable, but when I load (1.18v, 3400mhz) I am easily passing 55-60c, I am no expert but me and my friend are confused. I have looked for solutions; I am pretty sure it's seated properly looks squared not on an angle each screw is equally tightened, I couldn't have failed with the paste as it was pre applied, my fans are push from inside the case going outwards and I have plenty of airflow. I am really stuck here any help is appreciated.
Temperatures, I'm confused!
- Thread starter adam wal
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chugot9218
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- May 8, 2012
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Pre-applied? To the CPU? Generally the pre-application of thermal paste comes attached to the stock heat sink, I don't think it comes pre-applied to the processor ever.
*Edit* Ahh I see, pre-applied to the h100, nevermind me.
*Edit* Ahh I see, pre-applied to the h100, nevermind me.
I doubt the paste is the problem I am no expert but I'm guessing a lot of people use pre applied for convenience, and as for the sensors, my pump sensor is plugged into the cpu_fan header, so there shouldn't be any problems, of this I am quite sure as my bios states taht my "cpu fan" is running at 2200-2300rpm which is stock rpm of the h100i pump.
An addition to my post, have just put it on load and I see that my pump heat increases as I load so there is definate contact. If the liquid is heating the pump is pumping and the fans are spinning, surely that covers are the processes of the h100i :S
*all the processes*
Just to cover any fan speed questions in the future, my fans (Sp120 Quiet) are constantly on max (1200-1300rpm) and I have the fans set to push (2 fans)
Temps seem about right. Remember, a stock i5 is maybe 100W TDP, overclock it and becomes 250W.
From there it is simple physics of heat transfer. Heat from the i5's heat spreader must travel through the paste, then water block metal, then into the coolant, from the coolant to the rad fin metal then to the air. Throw in the heat transfer characteristics of the metals and fluid. Then there is the l/hr of coolant, air and their temperature differentials.
From there it is simple physics of heat transfer. Heat from the i5's heat spreader must travel through the paste, then water block metal, then into the coolant, from the coolant to the rad fin metal then to the air. Throw in the heat transfer characteristics of the metals and fluid. Then there is the l/hr of coolant, air and their temperature differentials.
Opps, sorry about that. If you're sure it's seated properly then the pre-applied paste will do fine. If you want to re-seat then clean both sides up with the Artic Silver cleaners and apply Artic Silver. I do the credit card method and it has never failed me.
Then there are only 3 things left, coolant flow, air flow and the temperature differential through the rad. Could be the pump but hard to tell. If the temp of the coolant going into the rad is only 2 degrees higher than the air then your heat removal capacity will be way down.
Then there are only 3 things left, coolant flow, air flow and the temperature differential through the rad. Could be the pump but hard to tell. If the temp of the coolant going into the rad is only 2 degrees higher than the air then your heat removal capacity will be way down.
- Nov 13, 2006
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There's nothing wrong with your Core temperatures. Idle temperatures are relatively insignificant, however, Load temperatures and Ambient temperature is very important. Please list your Ambient temperature.
Always run Prime95 Small FFT's, which is a steady-state 100% workload ideal for processor thermal testing and stability testing. Blend is a cyclic workload designed for testing memory stability, but is not suitable for processor thermal testing. A 10 minute run of Small FFT's is adequate, since thermal saturation is typically reached within 7 to 8 minutes.
Any Core temperatures above 80C are considered by most users in the overclocking community to be too high. Since you're running at stock, your temperatures are well within Intel's specifications - http://ark.intel.com/products/65520/Intel-Core-i5-3570K-Processor-6M-Cache-up-to-3_80-GHz
Always run Prime95 Small FFT's, which is a steady-state 100% workload ideal for processor thermal testing and stability testing. Blend is a cyclic workload designed for testing memory stability, but is not suitable for processor thermal testing. A 10 minute run of Small FFT's is adequate, since thermal saturation is typically reached within 7 to 8 minutes.
Any Core temperatures above 80C are considered by most users in the overclocking community to be too high. Since you're running at stock, your temperatures are well within Intel's specifications - http://ark.intel.com/products/65520/Intel-Core-i5-3570K-Processor-6M-Cache-up-to-3_80-GHz
He probably thinks the temps are high because the only spec I could find on Corsair's website is a graph of a 3770K, OC'd to 4.6 with a 25 ambient and 100% load maxing out at 47.9 deg.
I run a chilled system on my i7 920 (a real heat producer) and with a coolant temp of 16 deg, stock clock it max's out at 41 deg with Prime95 small FFT.
I run a chilled system on my i7 920 (a real heat producer) and with a coolant temp of 16 deg, stock clock it max's out at 41 deg with Prime95 small FFT.
- Nov 13, 2006
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1st Generation i7: 45 Nanometer / 130 Watts
2nd Generation i7: 32 Nanometer / 95 Watts
3rd Generation i7: 22 Nanometer / 77 Watts
4th Generation i7: 22 Nanometer / 84 Watts
As Vcore and clock rates are increased above stock values to a respectable overclock, power disipation (wattage) and heat can increase up to 35%, so high-end air and liquid cooling solutions help to reduce Load temperatures.
Regardless, since 3rd and 4th gen CPU's are 22 nanometer architecture, they have a smaller die surface area in contact with the Integrated Heat Spreader (IHS), which translates into higher Load temperatures.
Also, on the 3rd and 4th gen, Intel used a cheap thermal compound between the die and the IHS rather than fluxless solder, so the heat transfer is less efficient than previous gen CPU's. This is why some overclockers perform the "de-lidding" mod to decrease Load temperatures.
2nd Generation i7: 32 Nanometer / 95 Watts
3rd Generation i7: 22 Nanometer / 77 Watts
4th Generation i7: 22 Nanometer / 84 Watts
As Vcore and clock rates are increased above stock values to a respectable overclock, power disipation (wattage) and heat can increase up to 35%, so high-end air and liquid cooling solutions help to reduce Load temperatures.
Regardless, since 3rd and 4th gen CPU's are 22 nanometer architecture, they have a smaller die surface area in contact with the Integrated Heat Spreader (IHS), which translates into higher Load temperatures.
Also, on the 3rd and 4th gen, Intel used a cheap thermal compound between the die and the IHS rather than fluxless solder, so the heat transfer is less efficient than previous gen CPU's. This is why some overclockers perform the "de-lidding" mod to decrease Load temperatures.
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