Does removing or lapping the ihs help?
- Thread starter guest21
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gmkos
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- Jul 28, 2011
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Short answer: Yes. It helps.
In theory, lapping your integrated heatsink surface along with your external heatsink surface will provide a better heat transfer. In practice, it may provide a few degrees Celsius difference.
The specific processor does matter in removing the heatsink. Some processors have a thermal compound between the die and IHS, others have the die soldered to the IHS. Soldered is considered to be a better means of heat transfer, and is also harder to remove.
Replacing the thermal compound between an IHS and CPU die with other thermal compound would have little if any effect. Removing thermal compound between an IHS and CPU die and soldering it would theoretically lower temperatures.
Removing a soldered IHS would only logically be done with the goal of modifying the socket clamp to seat an external heatsink directly onto the CPU die. It could just as well be done with a thermal compound CPU. With the force needed to secure a large external heatsink, clamping it directly onto the die involves a risk of cracking the die. Again, the goal of reducing temperature.
It should go without saying, all of the above will void your warranty. In any case, there are better ways to reduce temperatures, and all of these strategies we've brought up are meant to provide that last inch of the mile for the most extreme hobbyists. Lapping the surface of your IHS is the least threatening, and even still, requires some basic knowledge and skill to avoid catastrophe.
In theory, lapping your integrated heatsink surface along with your external heatsink surface will provide a better heat transfer. In practice, it may provide a few degrees Celsius difference.
The specific processor does matter in removing the heatsink. Some processors have a thermal compound between the die and IHS, others have the die soldered to the IHS. Soldered is considered to be a better means of heat transfer, and is also harder to remove.
Replacing the thermal compound between an IHS and CPU die with other thermal compound would have little if any effect. Removing thermal compound between an IHS and CPU die and soldering it would theoretically lower temperatures.
Removing a soldered IHS would only logically be done with the goal of modifying the socket clamp to seat an external heatsink directly onto the CPU die. It could just as well be done with a thermal compound CPU. With the force needed to secure a large external heatsink, clamping it directly onto the die involves a risk of cracking the die. Again, the goal of reducing temperature.
It should go without saying, all of the above will void your warranty. In any case, there are better ways to reduce temperatures, and all of these strategies we've brought up are meant to provide that last inch of the mile for the most extreme hobbyists. Lapping the surface of your IHS is the least threatening, and even still, requires some basic knowledge and skill to avoid catastrophe.
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