I found this thread on Hardware Canucks useful:http://www.hardwarecanucks.com/forum/air-cooling/60409-thermal-compound-2.html#post716614
Here is a quote from a poster named BrainEater:
"Thermal Interface Material or T.I.M. /heatsink paste/etc .... is designed to fill the microscopic scratches between mating thermal surfaces.It's not designed to correct mismatched surfaces or non-uniform clamping , etc.
Any properly designed /implemented thermal solution should be within tolerance without thermal compound !!
The mating surfaces need to be flat or 'pair lapped'....The clamping/mounting screws need the correct torque.
Start there!!....If you are getting 2 degree improvement with thick/expensive/highC compounds then there are other far more important issues....
I use Silicone Heat Transfer Compound | MG Chemicals
20$ buys you a lifetime supply !!
Don't buy the expensive stuff.It's a myth.You don't need it unless you have a warped HSF or cpu....
edit :
Here's a secret ;
Wakefield-Vette | A Global Leader in Thermal Solutions, End-to-End Services with Engineering, Manufacturing, and Supply Chain
Commercial thermal solutions. They have the engineering documentation of what I just said too.Check em out , lotta cool stuff there."