Homemade Multi Chamber CPU Waterblock Questions

jheiges

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Aug 13, 2013
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10,510
With the new school year coming I decided to start a new project for the semester. I am planning on designing and machining a 2 chamber CPU block. Water would enter from the top directly to the bottom chamber and follow a circular maze to the outer edge and flow to the top chamber consisting of a pin design throughout. My questions and concerns for this project are as follows:

1) Will the flow of water from the bottom chamber to the top chamber be possible and if so will it be too restrictive?

2) What would be recommended to connect the upper and lower block? An o-ring inlay around the outer edge? Soldering? Or even just tightly bolting them together?


Any suggestions and comments are welcome. I will see if I can post a 3d design when I get home today for further details.

Thanks in advance,
Heiges
 
Solution
Welcome to the Forums!

1) With enough pressure, high flow is possible through any system ;)

2) This depends on your design intent. Do you want to transfer heat from the CPU through both chambers of the CPU block? If so, soldering (possibly requiring a reinforcing frame/bolts to hold against system pressure) is likely your best option. This will allow you to flow heat into both chambers to be dissipated through the pins/maze. You would probably want to mill in an overflow channel inside of where the solder is applied to catch excess solder when you flow the chambers together; else you will partially fill the maze/pin array with solder.

What I am having a difficult time understanding though is (first) why you would want to have two...
Welcome to the Forums!

1) With enough pressure, high flow is possible through any system ;)

2) This depends on your design intent. Do you want to transfer heat from the CPU through both chambers of the CPU block? If so, soldering (possibly requiring a reinforcing frame/bolts to hold against system pressure) is likely your best option. This will allow you to flow heat into both chambers to be dissipated through the pins/maze. You would probably want to mill in an overflow channel inside of where the solder is applied to catch excess solder when you flow the chambers together; else you will partially fill the maze/pin array with solder.

What I am having a difficult time understanding though is (first) why you would want to have two chambers as stated and (second) why you would not want to have the pin array on the CPU side?

If you were to use a single milled plate with a mass of pins, it would give you a much higher surface area to transfer heat through then a circular maze.
Having only one transfer plate will also avoid any coupling issues you would encounter when trying to flow heat to an upper chamber; you could use a simple O-Ring or RTV (again with an overflow channel) for the sealing element.

apogee_gt_1.jpg
 
Solution

jheiges

Honorable
Aug 13, 2013
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10,510


1) I am going for 2 chambers just to "say I did it," more or less. I assume that I won't lose/gain much from the 2 chamber design and just need a project to last me more than a week of design and a day or 2 of machining.

2) I had to laugh when I read this because I was thinking about switching them last night for the same surface area reason but didn't have time to redesign my 3d model. I will more than likely end up with the pins on the bottom and maze on the top.

Just wanted to get a post out here to see what kind of ideas everyone had about a 2 chamber system and how to connect them.

Thanks for the response. Hope to hear back again soon!

 
I have no idea what kind of milling access you have, but I would think something like below would be a good two chamber starting point.

This would be soldered together in your oven; probably with something nice and heavy on top of the assembly to ensure solid contact; allowing heat to flow throughout the entire assembly.
The short tube segment would be press-fit into the top plate segment and is used to minimize any possible leakage directly to the intermediate plate.