- Aug 15, 2013
- 4
- 0
- 10,510
I've got a hyper 212 plus installed in my ASUS Sabertooth X79 LGA 2011 Intel X79 motherboard. (I had to get the lga 2011 update bracket from cooler master).
I've got the standoffs and bracket as tight as it can safely go but aside from the slight twisting which seems normal for these there still seems to be room for it to tilt a little which pulls the base of the heat sink off the processor which it should NOT be able to do.
It would seem to me that wobble in that large cooling system might put some undue pressure on just a small part of the chip rather than distributing the stress over the entire surface. I thought about taking an extra bracket and bending it slightly to compensate for the gap.
I wish they had a thermal SHIM to place in between ><
any ideas please?
thanks,
andy
I've got the standoffs and bracket as tight as it can safely go but aside from the slight twisting which seems normal for these there still seems to be room for it to tilt a little which pulls the base of the heat sink off the processor which it should NOT be able to do.
It would seem to me that wobble in that large cooling system might put some undue pressure on just a small part of the chip rather than distributing the stress over the entire surface. I thought about taking an extra bracket and bending it slightly to compensate for the gap.
I wish they had a thermal SHIM to place in between ><
any ideas please?
thanks,
andy
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