Ok, so how many different dies are we talking about here?
So, Xeon E3 CPUs (that are sitting in LGA1155 chips) also use the same die as the Ivy Bridge E?
Is e.g. the HD4000 GPU on the same die as the CPU or are they separate dies inside the chip?
But how come that a 12 core Xeon use the same die as say a quad core i7? That's a lot of cores to be disabled = waste of valuable wafer!
Sorry I was unclear, I meant that ivy bridge based Xeons are from the same dies as Ivy Bridge-E i7s. For the higher end 12 cores I do not recall if they put 2 dies in one package or maybe they have a higher bin, 2 dies in one package is how Opterons get higher core counts if I recall correctly.
Edit: 2 dies in one package is how they raise the core count
According to this article on the Anand website,http://www.anandtech.com/show/7285/intel-xeon-e5-2600-v2-12-core-ivy-bridge-ep
the Ivy Bridge EP platform comes with three different die flavours. I take it to mean that there are three different types of die for this platform. That said, I would believe it to be likely that the 4-6 core die is also used in other current-gen Ivy Bridge platforms (that also involve core i7).
Edit: Indeed there are dual-die CPU chips out there. The following picture is a Core2 Quad that actually are two Core 2 Duo CPUs in one chip:
So it is reasonable to believe that some (at least older-gen CPUs) have dual-die set-ups. I guess that the the Intel CPUs with built-in GMAx000 are designed in this fashion.