Wrong the standard features are pretty similar on both. The difference is that Intel have moved the power saving components that were on the chip back on to the motherboard where they were 10 years ago after their foray into making chips run cooler and more efficiently
LGA ---- is how many contacts there are on an intel processor. The difference between the two is 5 little contacts.
LGA is not how many contacts the processor has. LGA means land grid array.
Lands are the little pads that are on the bottom of the CPU. The number of the CPU socket denotes the number of "lands" on the bottom of the CPU package. Socket 1150 has 1150 lands. Socket 1155 has 1155 lands. Grid array because they are in- you guessed it, a grid array.
Yes BUT that was not what I was saying - We know how many contacts each socket has. It can be looked up very easily. I was more interested in the REASON for the frequent, seemingly pointless changes. It turns out that this is more to do with the 22nm lithography used on the newer generation on the "i" series of Intel chips and the reason being is that 22nm lithography consumes less power.
Also Intel have deliberately moved some of the power conditioning components back off the chip and back on to the motherboard, a reverse of what they did years ago, presumably to ensure that you MUST buy a newer motherboard, to run that range of chips as well.
I have had this confirmed by several trade wholesalers that we use, so unless Intel are lying, I will go with what they say.