I'm building a new system in a jonsbo u2 case, but I was wondering whether i should go for a top down air-cooling to blow air to the motherboard, or go with watercooling and opt for easier maintenance and dust removal.
Just to emphasize, I'm not concerned about cpu temps because i know that both methods are sufficient enough for my build. It's the temps of other components im concerned about in the long-run.
So, which do you think would be better, watercooling or top-down aircooling?
Specs are gtx670 i5 3350p corsair cx600w.
Just to emphasize, I'm not concerned about cpu temps because i know that both methods are sufficient enough for my build. It's the temps of other components im concerned about in the long-run.
So, which do you think would be better, watercooling or top-down aircooling?
Specs are gtx670 i5 3350p corsair cx600w.