Intel Broadwell improvements

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Zgros

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Dec 29, 2013
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Hi, beyond what intel have already told us about their new broadwell CPU family due for release next year (I.e. Smaller, fan-less, with 1/3 lower power consumption), is there any indication as to what benefits or improvements there will be for desktops performance-wise or is the new chipset primarily for portable devices?
 
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Metalauxilia
Broadwell is expected to be launched in four major variants:
LGA 1150 socket: Broadwell-D: desktop version

BGA package: Broadwell-H: 37 W and 47 W TDP classes, for motherboards with HM86, HM87, QM87 and the new HM97 chipsets for "all-in-one" systems, mini-ITX form-factor motherboards, and other small footprint formats. It may come in two different variants, as single and dual chips; the dual chips (4 cores, 8 threads) will have GT3e and GT2 GPU, while a single chip (SoC; 2 cores, 4 threads) will have GT3e GPU. Maximum supported memory is 32 GB of DDR3L-1600.[6]
Broadwell-U: 15 W and 28 W TDP classes (SoC), for motherboards with PCH-LP chipset for Intel's ultrabook and NUC platforms. GT3, GT2 and GT1 GPU will be used, while maximum...
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Metalauxilia

Metalauxilia

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Dec 18, 2013
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Broadwell is expected to be launched in four major variants:
LGA 1150 socket: Broadwell-D: desktop version

BGA package: Broadwell-H: 37 W and 47 W TDP classes, for motherboards with HM86, HM87, QM87 and the new HM97 chipsets for "all-in-one" systems, mini-ITX form-factor motherboards, and other small footprint formats. It may come in two different variants, as single and dual chips; the dual chips (4 cores, 8 threads) will have GT3e and GT2 GPU, while a single chip (SoC; 2 cores, 4 threads) will have GT3e GPU. Maximum supported memory is 32 GB of DDR3L-1600.[6]
Broadwell-U: 15 W and 28 W TDP classes (SoC), for motherboards with PCH-LP chipset for Intel's ultrabook and NUC platforms. GT3, GT2 and GT1 GPU will be used, while maximum supported memory is either 16 GB of DDR3L-1600, or 8 GB of LPDDR3-1600.

Broadwell-Y: 4.5 W and 3.5 W TDP class (SoC), for tablets and certain ultrabook-class implementations. GT2 GPU will be used, while maximum supported memory is 8 GB of LPDDR3-1600.

PGA socket: Broadwell-M: mobile/laptop version
 
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Metalauxilia

Metalauxilia

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Also from what I heard they mainly focused on power consumption because they are trying to push into the x86 market for phones, tablets, and basically anything that uses a low power CPU. I doubt It would over much performance gain over the currentHaswell line.
 
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Sangeet Khatri

Sangeet Khatri

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Well.. there are just rumours, like everytime. You should not entirely trust the rumors. Wait for the final product to be launched or announced, then decide anything. As far as rumors are concerned, CPU-World posted this on their site, so it might be worth checking out

From CPU-World.com article at http://www.cpu-world.com/news_2013/2013121101_Intel_Broadwell_lineup_features.html

The next Intel microarchitecture, codenamed "Broadwell", will be mostly aimed at mobile computers, and will offer increased CPU and GPU performance, along with significant power savings. The first mobile processors to switch to new architecture will be "H", "U" and "Y" types. Because Broadwell products will be released in the second half of 2014, it is too early to talk about specific model numbers and frequencies, however we already have preliminary information on some Broadwell lineup features.
H-series high-performance processors will be available as one- and two-chip platforms. 2-chip versions will feature 4 CPU cores, GT3e or GT2 graphics (depending on SKU), up to 6 MB of last level cache, and they will work with DDR3L-1600 memory. The parts will have 47 Watt Thermal Design Power, although some models will support configurable TDP, that will allow them to operate in the 37 Watt thermal envelope. 2-chip "H" microprocessors will be paired with HM86, HM87, and QM87 Haswell chipsets, as well as with new HM97 chipset.

One-chip version of H-series systems on a chip (SoC) will integrate Broadwell PCH-LP chipset. They will also have 4 CPU cores, GT3e GPU, up to 6 MB of cache, and 47 Watt TDP. The processors will support up to 32 GB of DDR3L-1600 memory.
Ultra low-power "U" and "Y" SoCs will be offered only as a 1-chip platform. They will incorporate 2 CPU cores and up to 4 MB of last level cache. "U" models will support up to 16 GB of DDR3L-1600, or up to 8 GB of LPDDR3-1600 memory. They will have 15 Watt and 28 Watt TDP. 15 Watt Core-branded processors will come with GT3 and GT2 graphics, whereas Celeron and Pentium SKUs will be limited to GT1 GPU. 28 Watt chips will be available only with GT3 graphics unit, and they will be offered only as Core i3, Core i5 and Core i7 products.

The most interesting from the Broadwell lineup are "Y" ultra low power SoCs. These parts will fit into 4.5 Watt thermal envelope, and will have 3.5 Watt configurable TDP on some SKUs. The chips are going to have 2 CPU cores, GT2 GPU, and up 4 MB of last level cache. The processors will work with LPDDR3-1600 memory, and will support up to 8 GB of RAM.
Click to expand...

You might find this to be helpful.
 
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Zgros

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Dec 29, 2013
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Great answers, thanks guys. So in terms of raw processing power in desktops, we're not looking at a big leap based on what we already know at the moment?
 
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Metalauxilia

Metalauxilia

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From what I read the integrated graphics are supposed to have a 40% improvement over the current Haswell line.
 
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