I have for a couple of days a new motherboard: Intel DQ87PG
The problem is that the heatsink which is cooling the Q87 chipset was dangling. It was attached to the motherboard using a z-clip. I removed it and I have seen that it had some kind of thermal pad sticked to the heatsink but it was not sticked to the chip itself. The pressure from the z-clip is not high enough. I had removed that thermal pad, which seemed to be just dried thermal paste and I had applied CPU thermal paste myself. But due to the lack of pressure from the z-clip it is easy to move it. Should I RMA the board?
I have seen this manufacturer which doesn't even put a heatsink on the Q87 chipset.
Ark lists the Q87 s having a 4.1 W TDP
The problem is that the heatsink which is cooling the Q87 chipset was dangling. It was attached to the motherboard using a z-clip. I removed it and I have seen that it had some kind of thermal pad sticked to the heatsink but it was not sticked to the chip itself. The pressure from the z-clip is not high enough. I had removed that thermal pad, which seemed to be just dried thermal paste and I had applied CPU thermal paste myself. But due to the lack of pressure from the z-clip it is easy to move it. Should I RMA the board?
I have seen this manufacturer which doesn't even put a heatsink on the Q87 chipset.
Ark lists the Q87 s having a 4.1 W TDP
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