I'm wondering if I'm just bad at thermal compound. This last reseat I put a small dot, just a hair bigger than a grain of rice, and firmly pushed the CPU block into place before tightening it down. The time before that I tried to evenly spread over my CPU using this little spreader that came with the Tim.with the recent application my temps went down slightly. Was seeing 58-59 stock speeds before. The back plate looks slightly bowed. Not sure why. Could that be preventing me from seating the waterblock correctly?