for cpu cooling purposes water cooling methods are their.
1. Take processor heat generation at your specific degree Celsius
This heat to be given out to surroundings.
go --------
http://en.wikipedia.org/wiki/Heat_sink#Heat_transfer_pr...
read that.following is part of it. That page also contains various other details.
A heat sink transfers thermal energy from a higher temperature device to a lower temperature fluid medium. The fluid medium is frequently air, but can also be water, refrigerants or oil. If the fluid medium is water, the heat sink is frequently called a cold plate. In thermodynamics a heat sink is a heat reservoir that can absorb an arbitrary amount of heat without significantly changing temperature. Practical heat sinks for electronic devices must have a temperature higher than the surroundings to transfer heat by convection, radiation, and conduction.
To understand the principle of a heat sink, consider Fourier's law of heat conduction. Joseph Fourier was a French mathematician who made important contributions to the analytical treatment of heat conduction.[2] Fourier's law of heat conduction, simplified to a one-dimensional form in the x-direction, shows that when there is a temperature gradient in a body, heat will be transferred from the higher temperature region to the lower temperature region. The rate at which heat is transferred by conduction, q_k, is proportional to the product of the temperature gradient and the cross-sectional area through which heat is transferred.
q_k = -k A \frac{dT}{dx}
Figure 2: Sketch of a heat sink in a duct used to calculate the governing equations from conservation of energy and Newton’s law of cooling.
Consider a heat sink in a duct, where air flows through the duct, as shown in Figure 2. It is assumed that the heat sink base is higher in temperature than the air. Applying the conservation of energy, for steady-state conditions, and Newton’s law of cooling to the temperature nodes shown in Figure 2 gives the following set of equations.
\dot{Q} = \dot{m}c_{p,in}(T_{air,out} - T_{air,in}) (1)
\dot{Q} = \frac{T_{hs} - T_{air,av}}{R_{hs}} (2)
where
T_{air,av} = \frac{T_{air,in} + T_{air,out}}{2} (3)
Using the mean air temperature is an assumption that is valid for relatively short heat sinks. When compact heat exchangers are calculated, the logarithmic mean air temperature is used. \dot{m} is the air mass flow rate in kg/s.
The above equations show that
When the air flow through the heat sink decreases, this results in an increase in the average air temperature. This in turn increases the heat sink base temperature. And additionally, the thermal resistance of the heat sink will also increase. The net result is a higher heat sink base temperature.
The increase in heat sink thermal resistance with decrease in flow rate will be shown in later in this article.
The inlet air temperature relates strongly with the heat sink base temperature. For example, if there is recirculation of air in a product, the inlet air temperature is not the ambient air temperature. The inlet air temperature of the heat sink is therefore higher, which also results in a higher heat sink base temperature.
If there is no air flow around the heat sink, energy cannot be transferred.
A heat sink is not a device with the "magical ability to absorb heat like a sponge and send it off to a parallel universe".[3]
Natural convection requires free flow of air over the heat sink. If fins are not aligned vertically, or if fins are too close together to allow sufficient air flow between them, the efficiency of the heat sink will decline.
2. Apply NEWTON'S LAW OF COOLING.
After step 1, modelling first order differential's not a big problem
3. Allow proper ventilation in plastic case.
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