rajat501 :
thnxs buddy for ur help..
and plz tell your overclock setting and which thermal paste u use and which fans you use on your evo 212 pull-push or not
and how much quantity of paste you use
thnxs in adv
My multiplier is set at 46 and this gives me 4.6 GHz overclocked speed. The voltage on my CPU is set at 1.275V - this will vary from CPU to CPU of the same specs because of the die location on the silicon wafer which can be 12" to 18" in diameter. Hundreds of chips (dies) are cut from this wafer and some are of greater purity depending on the location from where the chip originated.
Because of this, your voltage maybe higher or lower for the same performance overclocking. Use the overclocking guides available at Tom's and also on other websites and get a good understanding of the settings and the procedures.
The thermal compound I used was Arctic Ceramique - http://www.arcticsilver.com/#
Thermal compound application procedure: http://www.arcticsilver.com/intel_application_method.html#
On my Hyper 212 EVO I have just the standard push fan that is part of the heatsink. I polished the base of the heatsink to make it more flat. I used 1200 grit silicon carbide paper (wet or dry) to polish the base and it took me about 30 minutes of polishing. If you decide to do this, do not rush this process. Polishing is a slow and careful process. Some people erroneously refer to this as "lapping". Lapping 1.5" x 1.5" heatsink base requires very expensive machine tools and cannot be done manually by any human being on earth! What I did was polishing, not lapping.
Your last question was about the quantity of thermal compound. I used a "pea-sized" drop on the CPU and the same amount on the heatsink base. Then I wrapped my finger in a plastic sandwich bag and carefully spread the compound from the center to the edges. A thin and even layer is desired. Thin and even.
There are plenty of videos on YouTube on this topic.
http://www.youtube.com/watch?v=-hNgFNH7zhQ
http://www.youtube.com/watch?v=fRRWbQUqW1Y
) in the centre.
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