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X method for thermal paste on FX-8350 question

I have an AMD FX-8350. I just got my H105 today and I wanted to use my own themal paste, so I bought the Artic Silver 5. I used the pea method before on my CPU. I did not like it too much. I found a new method that I seem to like called the X method shown in the link (the very last way to apply thermal paste in the video). I want to do this, but I would like to know others thoughts before I install my H105. It seems to be effective at covering the entire cpu and it spreads better in my opinion.

Tell me what you guys think.
And please click the link before you comment.

It starts at 3:34 in the video http://www.youtube.com/watch?v=OHl62uptWaw
8 answers Last reply Best Answer
More about method thermal paste 8350 question
  1. The reason for the pea method is based on the idea that the entire surface doesn't heat up evenly. By doing a pea sized drop and installing the cooler properly, the paste will spread to the area that needs the paste the most - which doesn't include the edges.

    http://www.tomshardware.com/reviews/thermal-paste-heat-sink-heat-spreader,3600-5.html

    The X-method looks fine and if it gives you better peace of mind then go for it.
  2. ThatVietGuy said:
    The reason for the pea method is based on the idea that the entire surface doesn't heat up evenly. By doing a pea sized drop and installing the cooler properly, the paste will spread to the area that needs the paste the most - which doesn't include the edges.

    http://www.tomshardware.com/reviews/thermal-paste-heat-sink-heat-spreader,3600-5.html

    The X-method looks fine and if it gives you better peace of mind then go for it.


    I just thought of something. Would doing the X method, then putting a tiny dot in the middle be better? Or nah, just stick with the X method. Its just an idea
  3. This is a commonly asked question, though the answer is generally what the user prefers. I usually just apply a single rice size in the middle of the CPU and let the heatsink spread it out which has worked well.

    The only real wrong thing you can do when it comes to thermal paste is over apply. I tend not to use the "X" method because i feel it's to much and can actually impact your temps negatively. It doesn't have to cover every square inch of the CPU as if that was the case everyone would spread it.
  4. TheMagicalWallaby said:
    ThatVietGuy said:
    The reason for the pea method is based on the idea that the entire surface doesn't heat up evenly. By doing a pea sized drop and installing the cooler properly, the paste will spread to the area that needs the paste the most - which doesn't include the edges.

    http://www.tomshardware.com/reviews/thermal-paste-heat-sink-heat-spreader,3600-5.html

    The X-method looks fine and if it gives you better peace of mind then go for it.


    I just thought of something. Would doing the X method, then putting a tiny dot in the middle be better? Or nah, just stick with the X method. Its just an idea


    I honestly recommend doing a small dollop in the middle and letting the heat sink do the rest.
  5. ThatVietGuy said:
    TheMagicalWallaby said:
    ThatVietGuy said:
    The reason for the pea method is based on the idea that the entire surface doesn't heat up evenly. By doing a pea sized drop and installing the cooler properly, the paste will spread to the area that needs the paste the most - which doesn't include the edges.

    http://www.tomshardware.com/reviews/thermal-paste-heat-sink-heat-spreader,3600-5.html

    The X-method looks fine and if it gives you better peace of mind then go for it.


    I just thought of something. Would doing the X method, then putting a tiny dot in the middle be better? Or nah, just stick with the X method. Its just an idea


    I honestly recommend doing a small dollop in the middle and letting the heat sink do the rest.


    My issue is that when doing that, it is possible to have it not spread out evenly, and leave large parts of the CPU without the paste.
  6. Best answer
    This is purely anecdotal evidence, something that should be taken with a grain of salt and will not stand in a court of law. :P

    In my last build, I tried the "X" method with Arctic Silver 5 (I normally do a BB or rice sized dot in the center and let the heatsink spread it), and I found I got higher temperatures with the X method. When I switched back to the rice/BB method, my temperatures were about 5C lower. (I allowed for the "burn in" period before judging temperatures each time)

    This may be due to the fact that the thermal compound is better at transferring heat than air (which is why it is used), but transfers heat worse than metal, so too much (X method) results in poorer heat transfer.

    OR

    I just didn't install my Heatsink correctly the first time.

    I personally would stick with the BB/Rice sized blob method, but if you want to try the X method, go ahead! It shouldn't make much of a difference.

    Another benefit of the BB method is that it uses less thermal compound than the X method, and is therefore cheaper.
  7. TheMagicalWallaby said:
    ThatVietGuy said:
    The reason for the pea method is based on the idea that the entire surface doesn't heat up evenly. By doing a pea sized drop and installing the cooler properly, the paste will spread to the area that needs the paste the most - which doesn't include the edges.

    http://www.tomshardware.com/reviews/thermal-paste-heat-sink-heat-spreader,3600-5.html

    The X-method looks fine and if it gives you better peace of mind then go for it.


    I just thought of something. Would doing the X method, then putting a tiny dot in the middle be better? Or nah, just stick with the X method. Its just an idea


    Anonymous said:
    This is purely anecdotal evidence, something that should be taken with a grain of salt and will not stand in a court of law. :P

    In my last build, I tried the "X" method with Arctic Silver 5 (I normally do a BB or rice sized dot in the center and let the heatsink spread it), and I found I got higher temperatures with the X method. When I switched back to the rice/BB method, my temperatures were about 5C lower. (I allowed for the "burn in" period before judging temperatures each time)

    This may be due to the fact that the thermal compound is better at transferring heat than air (which is why it is used), but transfers heat worse than metal, so too much (X method) results in poorer heat transfer.

    OR

    I just didn't install my Heatsink correctly the first time.

    I personally would stick with the BB/Rice sized blob method, but if you want to try the X method, go ahead! It shouldn't make much of a difference.

    Another benefit of the BB method is that it uses less thermal compound than the X method, and is therefore cheaper.


    It might have been because the "X" method uses more paste, so the heat and the heatsink are separated a bit further and the heat has to get pulled through more paste.

    Just do a single rice sized dot in the middle, it covers all the parts of the chip that needs to be covered.
  8. CDdude55 said:
    It might have been because the "X" method uses more paste, so the heat and the heatsink are separated a bit further and the heat has to get pulled through more paste.

    Just do a single rice sized dot in the middle, it covers all the parts of the chip that needs to be covered.

    Exactly. Sorry if that wasn't clear in my post. It's what I was trying to say :P
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