i have an antec high current gamer 750w psu the rig is in my sig its the older type non modular psu and i was thinking of adding another gtx 770 but do you think my psu would handle it or need a new one i kind of think i might be pushing it
And TDP is the average thermal heat dissipation of a processor under a certain scenario, which Intel, AMD and Nvidia define very flexibly for their products.
tdp is thermal design point thats heat not power a single gtx 770 uses about 300w there or there abouts on load, i have an i5 4670k overclocked to 4.4ghz its in my sig
Thermal Design Power (TDP) represents the near maximum power a product can draw for a thermally significant period while running commercially available software.
i have an antec high current gamer 750w psu the rig is in my sig its the older type non modular psu and i was thinking of adding another gtx 770 but do you think my psu would handle it or need a new one i kind of think i might be pushing it
i have an antec high current gamer 750w psu the rig is in my sig its the older type non modular psu and i was thinking of adding another gtx 770 but do you think my psu would handle it or need a new one i kind of think i might be pushing it
Thanks for the article links wow 1000w that seems an awesome jump in power i was keen to know was the actual psu good that i was not putting too much pressure on it with a second gtx 770 im thinking i might chance it now
Thermal Design Power (TDP) represents the near maximum power a product can draw for a thermally significant period while running commercially available software.
i5-4670 = 84W
so 460W + 84W = 544W max tdp
TDP (power point profile) its the thermal is the important word its technically the max amount of power the cooling system needs to dissapate. Its not the maximum amount of power a component can draw. An i5 4670k is 84w stock
And TDP is the average thermal heat dissipation of a processor under a certain scenario, which Intel, AMD and Nvidia define very flexibly for their products.
And TDP is the average thermal heat dissipation of a processor under a certain scenario, which Intel, AMD and Nvidia define very flexibly for their products.