What does the terms "low mounting pressure", or "medium" and "high" mean? - Overclocking, Thermal Paste, CPU

closefan

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Mar 18, 2014
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Recently Tomshardware put out the "Thermal Paste Comparison, Part Two: 39 Products Get Tested" Guide.

My question is, what do they mean by the terms "low mounting pressure", or "medium" and "high".
In regards to Thermal Paste (Compound)

Thank you in advance.

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invikast

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Jun 7, 2014
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it literally means how close the cooler's base and the cpu come in contact...regardless of what the package says, higher mounting pressure is recommended. higher mounting pressure ensures that the thermal paste can squeeze into the microscopic gap as much as possible and as thinly as possible for maximum heat transfer without any gap between the cooler's base and the cpu preferably metal to metal contact without any gap is desired but a heat sink can look flawless but theres bound to be microscopic pockets filled with air and this is not good for thermal transfer. and that is why thermal paste if possible be smeared as thinly as possible so that heat has less distance to travel and with as few resisteance as possible. if i'm wrong ingnore this please