BLUE SCREEN -healthy ram HELP!!!!

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Utkarsh Rai-

Honorable
Aug 31, 2014
106
0
10,690
I have 2 x 2GB ddr2 pc5300 ram
-667mhz ram
-RAM VOLTAGE - 1.8v -(source-Rammon)
-RAMs are identical
-RAMs are healthy - changed twice
-diagnostic tool doesn't find error
-tried each ram one at a time -no blue screen
-It is a OEM HP pavilion so bios doesn't have option to do anything(ie.adjusting voltage)
-Motherboard supports 2 gb dimms upto 4GB (it does support - pc5300@667mhz- source official HP upgrade information)
-160 watt PSU
-problem on windows 7 64bit , vista Basic 64bit (so not a OS problem I think)
Single RAM run fine but when I install another one ; after some time blue screen appears with message- something like physical waste for something"
Once this happens the bluescreen keeps coming each 4-5min unless the ram/cpu/mobo is allowed to cool , then after some longer time blue screen comes again
 
Solution
J
if both RAMs work (pass memtest86 test) when the system is cold, and fail when warm you are looking for a thermal crack in a trace. Several years ago, there was a push to use lead free solder. The older lead free solder was very brittle and would crack or pop free from the solder pad with thermal expansion and contraction. These are hard to find, sometimes you can find them via visual inspection, or use a heat gun and heat components or compressed air to cool components to help isolate the failures.

Last one I found was on a RAM board covered by a heat sink. I had to to take the heat sink off, and put it under a stereoscope to see the defect. In my case, the RAM would fail only for the first 8 seconds after power was supplied...
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johnbl

Polypheme
Nov 4, 2012
10,072
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if both RAMs work (pass memtest86 test) when the system is cold, and fail when warm you are looking for a thermal crack in a trace. Several years ago, there was a push to use lead free solder. The older lead free solder was very brittle and would crack or pop free from the solder pad with thermal expansion and contraction. These are hard to find, sometimes you can find them via visual inspection, or use a heat gun and heat components or compressed air to cool components to help isolate the failures.

Last one I found was on a RAM board covered by a heat sink. I had to to take the heat sink off, and put it under a stereoscope to see the defect. In my case, the RAM would fail only for the first 8 seconds after power was supplied. It would work great after that. Took me weeks to find the cause of all my bugchecks.

 
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