So about 6 months ago i bought a Lenovo G510 its was a top of the line spec for the g series at the time. so i have been regularly cleaning the dust from my heatsink every 2 months. My i7-4700mq under full load never exceeded 78 Celsius on the hottest core, considering i always used my laptop on a table and my room temperature varied from 25-29 Celsius. anyway, i also have a R7 M265 with 2GB DDR3 memory on a 64-bit interface. the graphics card under full load from furmark reached a max of 70 Celsius. also considerably cooler that i expected it to be.
Then decided to replace the OEM T.I.M since i wanted to overclock the memory slightly. since there was a huge bottleneck thanks to the 64-bit interface. So i removed the back cover of my laptop and pulled apart the HSF assembly of my CPU and GPU since they there interconnected at the fan...Anyways as soon as i pulled apart my HSF assembly, noticed that there was a plastic layed on top of my gpu except a small hole for the processing core to come in direct contact with the heatsink... Now because this is a new Mobile Chip for lenovo G series, i didn't want to take the plastic off just yet.. because i wanted to be sure that its not supposed to be there. so i cleaned the old thermal paste and applied Arctic Silver 5 on both the Chips.i assembled my laptop back together. I switched it on and loaded cpu burner and furmark simultaneously. and there was a instant 5 Celsius drop in max temperature loads for both my CPU and GPU. it has been about two and a half weeks since i did this since i waited for the cure time to finish. now under max load my CPU does not exceed 69 Celsius and my GPU maxed at 63 Celsius. so i decided i would over clock my GPU for more performance. in Furmark the stock clocks gave me 24 FPS at a set resolution.(stock core clock was 825Mhz overclocked to 960Mhz and memory clock was 900 overclocked it to 1120Mhz) then i launched furmark again and i maintained a steady FPS of 30.
And my GPU and went form 63 Celsius to 70 Celsius. which is where i was before basically.
So guys i am still concerned about that plastic cover....should i take it out? because I am pretty sure that its not supposed to be there. and do you guys think i did okay for temps? anything i should know just in case?
system specs are:-
Leonovo G510
i7-4700mq 2.4-3.4Ghz
R7-M265 2GB DDR3
8GB of RAM (1033Mhz 4GB and a Samsung 1333Mhz 4GB )
150W power supply
.
.
.
.
Help is greatly Appreciated guys
and thank you for reading my post.
Then decided to replace the OEM T.I.M since i wanted to overclock the memory slightly. since there was a huge bottleneck thanks to the 64-bit interface. So i removed the back cover of my laptop and pulled apart the HSF assembly of my CPU and GPU since they there interconnected at the fan...Anyways as soon as i pulled apart my HSF assembly, noticed that there was a plastic layed on top of my gpu except a small hole for the processing core to come in direct contact with the heatsink... Now because this is a new Mobile Chip for lenovo G series, i didn't want to take the plastic off just yet.. because i wanted to be sure that its not supposed to be there. so i cleaned the old thermal paste and applied Arctic Silver 5 on both the Chips.i assembled my laptop back together. I switched it on and loaded cpu burner and furmark simultaneously. and there was a instant 5 Celsius drop in max temperature loads for both my CPU and GPU. it has been about two and a half weeks since i did this since i waited for the cure time to finish. now under max load my CPU does not exceed 69 Celsius and my GPU maxed at 63 Celsius. so i decided i would over clock my GPU for more performance. in Furmark the stock clocks gave me 24 FPS at a set resolution.(stock core clock was 825Mhz overclocked to 960Mhz and memory clock was 900 overclocked it to 1120Mhz) then i launched furmark again and i maintained a steady FPS of 30.
And my GPU and went form 63 Celsius to 70 Celsius. which is where i was before basically.
So guys i am still concerned about that plastic cover....should i take it out? because I am pretty sure that its not supposed to be there. and do you guys think i did okay for temps? anything i should know just in case?
system specs are:-
Leonovo G510
i7-4700mq 2.4-3.4Ghz
R7-M265 2GB DDR3
8GB of RAM (1033Mhz 4GB and a Samsung 1333Mhz 4GB )
150W power supply
.
.
.
.
Help is greatly Appreciated guys
and thank you for reading my post.
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