I was watching this guy's video and was wondering if I should spread the paste or let the CPU do the job? I know that you should at least cover the center of the CPU since that is where most of the heat is generated. But what about the edges? The die seems like it would heat the edges as well. When you just sit the cooler on top of the CPU it only spreads it out the paste circularly and doesn't cover all the edges. So, what are the pros and cons of spreading it with an object vs. using the cooler?
Pros and cons on spreading paste?
- Thread starter Linnaeus
- Start date
Place a small pea sized dab in the center of the CPU's heat spreader then apply the heat sink and secure it firmly. Allow the mounting force to spread the thermal paste. If you spread the paste by hand you may trap air bubbles in between the heat spreader and the heat sink.
jimthenagual
Splendid
- Apr 8, 2012
- 4,005
- 16
- 29,365
The pros to spreading the paste is, like you said, it covers the corners as well. The problem with doing it that way is that you get air pockets when you pop the heatsink onto the pre-spread paste. When you do the rice grain method you don't get your corners covered, but you get less air pockets.
There are people who swear by both methods, but personally, I go with the pea method.
There are people who swear by both methods, but personally, I go with the pea method.
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