I spread my thermal paste...

Greysonj

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Feb 24, 2014
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When I built my pc a few months ago, I spread my thermal paste. I've now read in MANY places that that is a huge no-no. However, my temps have been great (and I'm using an 8350 with an Kraken H40). So why does everyone hate spreading it and make such a big deal? I know it can create air bubbles, but it doesn't seem like that happened to me... Can the method itself actually harm the CPU, aside from overheating? If it does, I'd fix it, but I really don't feel like removing the cooler, cleaning the cpu, buying more thermal paste, yada yada yada.
 
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I use the spread method myself and I am OC'd to 5ghz 24/7, as long as your temps are good, don't give it another thought.

Some think one method is better than another, like they like one...
The thing about air bubbles, you will not notice the temp difference as only very small high temp air pockets exist which literally can "burn" parts of the CPU without the CPU actually shutting down to overheating as it should under normal safety margins.
 

Greysonj

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Feb 24, 2014
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So is it something I really need to fix? What are the chances of it happening?
 


It would depend on how good or bad you installed it.
How long has it been?
 


I use the spread method myself and I am OC'd to 5ghz 24/7, as long as your temps are good, don't give it another thought.

Some think one method is better than another, like they like one product over another, or base their advice on someone else and not their own, no matter what you do someone has the better idea in their own minds.

The biggest proper cooling performance of thermal compound is less is best, the least you need for even coverage across the CPU die underneath the heat spreader the better the cooling performance, as actually the heat sink does the cooling the thermal compound is just a thermal conductor.

Now too much thermal compound is bad, as too much can act as an insulator instead of a conductor of the heat.

But the application method really does not matter unless you are using a thermal compound that specifically requires the the center pea size method, like IC Diamond, which is covered at their website.

IC Diamond is so thick if the spread method is used it seriously creates air bubbles so they recommend the pea in the center method for even coverage, I wouldn't use IC Diamond myself simply because of the scratching issues they've been plagued with, (costing users of the product their CPU warranty), and their lack of satisfaction with IC Diamond dealing with the issue.

Very few thermal compounds are as thick of consistency as the IC Diamond is, and do not require any specific application method.

Since we're covering this Artic MX-4 is the most excellent thermal compound I have discovered, as it spreads out so well.

There's only one sure way to know and that is to pull the heat sink and inspect the thermal compound footprint, and if you're curious or worried try different application methods and test for yourself, but if your temps are good, what's the worry?

 
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