Dell 490 not reading more then 8gb ram HELP
- Thread starter giannir
- Start date
Solution
Here you go
Computer Brand Name: DELL Precision WorkStation 490
[Operating System]
Operating System: Microsoft Windows 7 Ultimate (x64) Build 7601
Service Pack: Service Pack 1
UEFI Boot: Not Present
Central Processor(s)
[CPU Unit Count]
Number Of Processor Packages (Physical): 1
Number Of Processors Cores: 2
Number Of Logical Processors: 2
Intel Xeon 5140
[General Information]
Processor Name: Intel Xeon 5140
Original Processor Frequency: 2333.3 MHz
Original Processor Frequency [MHz]: 2333
CPU ID: 000006FB
CPU Brand Name: Intel(R) Xeon(R) CPU 5140 @ 2.33GHz
CPU Vendor: GenuineIntel
CPU Stepping: G0
CPU Code Name: Woodcrest
CPU S-Spec: SLAGB
CPU Thermal Design Power (TDP): 65 W
CPU Max. Case Temperature (Tcase_max): 65 °C
CPU Type: Production Unit
CPU Platform: LGA771 (FC-LGA6)
Microcode Update Revision: B9
Number of CPU Cores: 2
Number of Logical CPUs: 2
[Operating Points]
CPU LFM (Minimum): 2000.0 MHz = 6 x 333.3 MHz @ 1.0875 V
CPU HFM (Maximum): 2333.3 MHz = 7 x 333.3 MHz @ 1.3250 V [Unlocked]
CPU Current: 2327.3 MHz = 7 x 332.5 MHz @ 1.3250 V
CPU Bus Type: FSB (QDR)
[Cache and TLB]
L1 Cache: Instruction: 2 x 32 KBytes, Data: 2 x 32 KBytes
L2 Cache: Integrated: 4 MBytes
Instruction TLB: 4 KB Pages, 4-way set associative, 128 entries
Data TLB: 4 MB Pages, 4-way set associative, 32 entries
[Standard Feature Flags]
FPU on Chip Present
Enhanced Virtual-86 Mode Present
I/O Breakpoints Present
Page Size Extensions Present
Time Stamp Counter Present
Pentium-style Model Specific Registers Present
Physical Address Extension Present
Machine Check Exception Present
CMPXCHG8B Instruction Present
APIC On Chip / PGE (AMD) Present
Fast System Call Present
Memory Type Range Registers Present
Page Global Feature Present
Machine Check Architecture Present
CMOV Instruction Present
Page Attribute Table Present
36-bit Page Size Extensions Present
Processor Number Not Present
CLFLUSH Instruction Present
Debug Trace and EMON Store Present
Internal ACPI Support Present
MMX Technology Present
Fast FP Save/Restore (IA MMX-2) Present
Streaming SIMD Extensions Present
Streaming SIMD Extensions 2 Present
Self-Snoop Present
Multi-Threading Capable Present
Automatic Clock Control Present
IA-64 Processor Not Present
Signal Break on FERR Present
Streaming SIMD Extensions 3 Present
Carryless Multiplication (PCLMULQDQ)/GFMUL Not Present
64-Bit Debug Store Present
MONITOR/MWAIT Support Present
CPL Qualified Debug Store Present
Virtual Machine Extensions Present
Safer Mode Extensions (Intel TXT) Not Present
Thermal Monitor 2 Present
Supplemental Streaming SIMD Extensions 3 Present
Enhanced SpeedStep Technology Present
L1 Context ID Not Present
IA32 Debug Interface Support Not Present
Fused Multiply Add Not Present
CMPXCHG16B Support Present
Send Task Priority Messages Disabling Present
Performance/Debug Capability MSR Present
Processor Context ID Not Present
Direct Cache Access Present
Streaming SIMD Extensions 4.1 Not Present
Streaming SIMD Extensions 4.2 Not Present
Extended xAPIC Not Present
MOVBE Instruction Not Present
POPCNT Instruction Not Present
TSC-deadline Timer Not Present
AES Cryptography Support Not Present
XSAVE/XRSTOR/XSETBV/XGETBV Instructions Not Present
XGETBV/XSETBV OS Enabled Not Present
AVX Support Not Present
Float16 Instructions Not Present
Random Number Read Instruction Not Present
[Extended Feature Flags]
64-bit Extensions Present
RDTSCP and TSC_AUX Support Not Present
1 GB large page support Not Present
No Execute Present
SYSCALL/SYSRET Support Not Present
Read/Write FS/GS Base Instructions Not Present
TSC_THREAD_OFFSET Not Present
Software Guard Extensions (SGX) Support Not Present
Bit Manipulation Instructions Set 1 Not Present
Hardware Lock Elision Not Present
AVX2 Instructions Not Present
Supervisor Mode Execution Protection Not Present
Bit Manipulation Instructions Set 2 Not Present
Enhanced Performance String Instruction Not Present
INVPCID Instruction Not Present
Restricted Transactional Memory Not Present
Platform Quality of Service Monitoring (PQM) Not Present
Platform Quality of Service Enforcement (PQE) Not Present
Deprecated FPU CS and FPU DS Not Present
Memory Protection Extensions Not Present
Advanced Vector Extensions 512 (AVX-512) Not Present
AVX-512 Doubleword and Quadword Instructions Not Present
RDSEED Instruction Not Present
Multi-precision Add Carry Instructions Not Present
Supervisor Mode Access Prevention (SMAP) Not Present
AVX-512 52-bit Integer FMA Instructions Not Present
CLFLUSHOPT Instructions Not Present
Intel Processor Trace Not Present
AVX-512 Prefetch Instructions Not Present
AVX-512 Exponential and Reciprocal Instructions Not Present
AVX-512 Conflict Detection Instructions Not Present
Secure Hash Algorithm (SHA) Extensions Not Present
AVX-512 Byte and Word Instructions Not Present
AVX-512 Vector Length Extensions Not Present
PREFETCHWT1 Instruction Not Present
AVX-512 Vector Bit Manipulation Instructions Not Present
[Enhanced Features]
Thermal Monitor 1: Supported, Enabled
Thermal Monitor 2: Supported, Enabled
Enhanced Intel SpeedStep (GV3): Supported, Disabled
Bi-directional PROCHOT#: N/A
Extended Auto-HALT State C1E: Enabled
Extended Stop Grant State C2E: N/A
Enhanced Halt State C3E: N/A
Enhanced Halt State C4E: N/A
Enhanced Halt State Hard C4E: N/A
Hardware Prefetcher: Supported, Enabled
DCU Prefetcher: Supported, Disabled
IP Prefetcher: Supported, Enabled
Adjacent Cache Line Prefetch: Supported, Disabled
MLC Streamer Prefetcher Not Supported
MLC Spatial Prefetcher Not Supported
DCU Streamer Prefetcher Not Supported
DCU IP Prefetcher Not Supported
Intel Dynamic Acceleration (IDA) Technology: Not Supported
Intel Dynamic FSB Switching: Not Supported
Enhanced Multi Threaded Thermal Management: N/A
Intel Turbo Boost Technology: Not Supported
Programmable Ratio Limits: Not Supported
Programmable TDC/TDP Limits: Not Supported
[Memory Ranges]
Maximum Physical Address Size: 38-bit (256 GBytes)
Maximum Virtual Address Size: 48-bit (256 TBytes)
[MTRRs]
Range 0-4000000000 (0MB-262144MB) Type: Write Back (WB)
Range CFF00000-30D0000000 (3327MB-199936MB) Type: Uncacheable (UC)
Range D0000000-30E0000000 (3328MB-200192MB) Type: Uncacheable (UC)
Range E0000000-3100000000 (3584MB-200704MB) Type: Uncacheable (UC)
Range FF0000000-4000000000 (65280MB-262144MB) Type: Uncacheable (UC)
Motherboard
[Computer]
Computer Brand Name: DELL Precision WorkStation 490
[Motherboard]
Motherboard Model: DELL 0GU083
Motherboard Chipset: Intel 5000X (Greencreek) + 631x/6321 ESB2
Motherboard Slots: 3xPCI, 2xPCI Express x4, 1xPCI Express x16
PCI Express Version Supported: v1.1
USB Version Supported: v2.0
[BIOS]
BIOS Manufacturer: Phoenix Technologies
BIOS Date: 04/25/08
BIOS Version: A08
UEFI BIOS: Not Capable
Super-IO/LPC Chip: SMSC EMC2700P
ACPI Devices
ACPI Fixed Feature Button
Device Name: ACPI Fixed Feature Button
Intel Processor
Device Name: Intel Processor
Intel Processor
Device Name: Intel Processor
Programmable interrupt controller
Device Name: Programmable interrupt controller
[Assigned Resources]
I/O Port: 0020 - 003F
[Alternative 1]
I/O Port: 0020 - 003F
I/O Port: 00A0 - 00BF
I/O Port: 04D0 - 04D1
System timer
Device Name: System timer
[Assigned Resources]
I/O Port: 0040 - 005F
[Alternative 1]
I/O Port: 0040 - 005F
IRQ: 0
High precision event timer
Device Name: High precision event timer
[Assigned Resources]
Memory Location: FED00000 - FED003FF
[Alternative 1]
Memory Location: FED00000 - FED003FF
Direct memory access controller
Device Name: Direct memory access controller
[Assigned Resources]
I/O Port: 0080 - 009F
[Alternative 1]
I/O Port: 0080 - 009F
I/O Port: 0000 - 001F
I/O Port: 00C0 - 00DF
DMA: 4
ECP Printer Port
Device Name: ECP Printer Port
[Assigned Resources]
I/O Port: 0378 - 037F
[Alternative 1]
I/O Port: 0378 - 037F
I/O Port: 0778 - 077F
IRQ: 7
[Alternative 2]
I/O Port: 0278 - 027F
I/O Port: 0678 - 067F
IRQ: 5
[Alternative 3]
I/O Port: 0378 - 037F
I/O Port: 0778 - 077F
IRQ: 3
IRQ: 4
IRQ: 5
IRQ: 6
IRQ: 7
IRQ: 12
[Alternative 4]
I/O Port: 0378 - 037F
I/O Port: 0778 - 077F
IRQ: 3
IRQ: 4
IRQ: 5
IRQ: 6
IRQ: 7
IRQ: 12
DMA: 1
DMA: 2
DMA: 3
[Alternative 5]
I/O Port: 0278 - 027F
I/O Port: 0678 - 067F
IRQ: 3
IRQ: 4
IRQ: 5
IRQ: 6
IRQ: 7
IRQ: 12
[Alternative 6]
I/O Port: 0278 - 027F
I/O Port: 0678 - 067F
IRQ: 3
IRQ: 4
IRQ: 5
IRQ: 6
IRQ: 7
IRQ: 12
DMA: 1
DMA: 2
DMA: 3
[Alternative 7]
I/O Port: 0378 - 037F
I/O Port: 0778 - 077F
[Alternative 8]
I/O Port: 0278 - 027F
I/O Port: 0678 - 067F
[Alternative 9]
I/O Port: 03BC - 03BF
I/O Port: 07BC - 07BF
[Alternative 10]
I/O Port: 03BC - 03BF
I/O Port: 07BC - 07BF
IRQ: 7
Communications Port
Device Name: Communications Port
[Assigned Resources]
I/O Port: 03F8 - 03FF
[Alternative 1]
I/O Port: 03F8 - 03FF
IRQ: 4
[Alternative 2]
I/O Port: 03E8 - 03EF
IRQ: 4
[Alternative 3]
I/O Port: 02F8 - 02FF
IRQ: 3
[Alternative 4]
I/O Port: 02E8 - 02EF
IRQ: 3
Communications Port
Device Name: Communications Port
[Assigned Resources]
I/O Port: 02F8 - 02FF
[Alternative 1]
I/O Port: 02F8 - 02FF
IRQ: 3
[Alternative 2]
I/O Port: 02E8 - 02EF
IRQ: 3
[Alternative 3]
I/O Port: 03F8 - 03FF
IRQ: 4
[Alternative 4]
I/O Port: 03E8 - 03EF
IRQ: 4
Standard floppy disk controller
Device Name: Standard floppy disk controller
[Assigned Resources]
I/O Port: 03F0 - 03F5
I/O Port: 0000 - 0005
[Alternative 1]
I/O Port: 03F0 - 03F5
I/O Port: 03F7
IRQ: 6
DMA: 2
[Alternative 2]
I/O Port: 03F0 - 03F5
I/O Port: 03F7
IRQ: 3
IRQ: 4
IRQ: 5
IRQ: 6
IRQ: 7
IRQ: 12
DMA: 1
DMA: 2
DMA: 3
[Alternative 3]
I/O Port: 0370 - 0375
I/O Port: 0377
IRQ: 3
IRQ: 4
IRQ: 5
IRQ: 6
IRQ: 7
IRQ: 12
DMA: 1
DMA: 2
DMA: 3
System speaker
Device Name: System speaker
[Assigned Resources]
I/O Port: 0061
[Alternative 1]
I/O Port: 0061
PCI bus
Device Name: PCI bus
[Assigned Resources]
I/O Port: 0000 - FFFFFFFF
I/O Port: 0000 - 0002
Memory Location: 000A0000 - 000BFFFF
Memory Location: 000F0000 - 000EFFFF
Memory Location: CFF00000 - DFFFFFFF
[Alternative 1]
I/O Port: 0000 - 0CF7
I/O Port: 0D00 - FFFF
Memory Location: 000A0000 - 000BFFFF
Memory Location: 000C0000 - 000EFFFF
Memory Location: 000F0000 - 000FFFFF
Memory Location: F0000000 - FE000000
Memory Location: CFF00000 - DFFFFFFF
Memory Location: FF980800 - FF980BFF
Memory Location: FF97C000 - FF97FFFF
Memory Location: FED20000 - FED9FFFF
System CMOS/real time clock
Device Name: System CMOS/real time clock
[Assigned Resources]
I/O Port: 0070 - 007F
[Alternative 1]
I/O Port: 0070 - 007F
IRQ: 8
System board
Device Name: System board
[Assigned Resources]
I/O Port: 0060
I/O Port: 0000 - 0061
I/O Port: 00E0 - 00EF
[Alternative 1]
I/O Port: 0060
I/O Port: 0064
I/O Port: 0062 - 0063
I/O Port: 0065 - 006F
I/O Port: 00E0 - 00EF
I/O Port: 0800 - 085F
I/O Port: 0C00 - 0C7F
I/O Port: 0860 - 08FF
Numeric data processor
Device Name: Numeric data processor
[Assigned Resources]
I/O Port: 00F0 - 00FF
[Alternative 1]
I/O Port: 00F0 - 00FF
IRQ: 13
ACPI Power Button
Device Name: ACPI Power Button
SMBIOS DMI
BIOS
BIOS Vendor: Dell Inc.
BIOS Version: A08
BIOS Release Date: 04/25/2008
BIOS Start Segment: F000
BIOS Size: 1024 KBytes
ISA Support: Not Present
MCA Support: Not Present
EISA Support: Not Present
PCI Support: Present
PC Card (PCMCIA) Support: Not Present
Plug-and-Play Support: Present
APM Support: Present
Flash BIOS: Present
BIOS Shadow: Present
VL-VESA Support: Not Present
ESCD Support: Not Present
Boot from CD: Present
Selectable Boot: Present
BIOS ROM Socketed: Not Present
Boot from PC Card: Not Present
EDD Support: Present
NEC PC-98 Support: Not Present
ACPI Support: Present
USB Legacy Support: Present
AGP Support: Not Present
I2O Boot Support: Not Present
LS-120 Boot Support: Present
ATAPI ZIP Drive Boot Support: Not Present
IEE1394 Boot Support: Not Present
Smart Battery Support: Not Present
BIOS Boot Specification Support: Present
Function key-initiated Network Service Boot Support: Present
Targeted Content Distribution Support: Present
UEFI Specification Support: Not Present
System
System Manufacturer: Dell Inc.
Product Name: Precision WorkStation 490
Product Version: Unknown
Product Serial Number: 2C9F83J
UUID: {4C4C4544-0043-3910-4680-B2C04F38334A}
SKU Number: Unknown
Family: Unknown
Mainboard
Mainboard Manufacturer: Dell Inc.
Mainboard Name: 0GU083
Mainboard Version: A00
Mainboard Serial Number: ..CN1374078B008X.
System Enclosure
Manufacturer: Dell Inc.
Case Type: Tower
Version: Unknown
Serial Number: 2C9F83J
Asset Tag Number:
Processor
Processor Manufacturer: Intel
Processor Version: Unknown
External Clock: 1333 MHz
Maximum Clock Supported: 3800 MHz
Current Clock: 2333 MHz
CPU Socket: Populated
CPU Status: Enabled
Processor Type: Central Processor
Processor Voltage: 1.8 V
Processor Upgrade: ZIF
Socket Designation: Microprocessor
Processor
Processor Manufacturer: Intel
Processor Version: Unknown
External Clock: 100 MHz
Maximum Clock Supported: 3800 MHz
Current Clock: N/A
CPU Socket: Unpopulated
CPU Status: Unknown
Processor Type: Central Processor
Processor Voltage: 1.8 V
Processor Upgrade: ZIF
Socket Designation: Microprocessor
Unknown
Socket Designation: Unknown
Cache State: Enabled
Cache Type: Internal, Data
Cache Scheme: Write-Back
Supported SRAM Type:
Current SRAM Type:
Cache Speed: Unknown
Error Correction Type: Unknown
Maximum Cache Size: 32 KBytes
Installed Cache Size: 32 KBytes
Cache Associativity: 8-way Set-Associative
Unknown
Socket Designation: Unknown
Cache State: Enabled
Cache Type: Internal, Unified
Cache Scheme: Write-Through and Write-Back
Supported SRAM Type:
Current SRAM Type:
Cache Speed: Unknown
Error Correction Type:
Maximum Cache Size: 4096 KBytes
Installed Cache Size: 4096 KBytes
Cache Associativity: 16-way Set-Associative
Unknown
Socket Designation: Unknown
Cache State: Enabled
Cache Type: Internal, Data
Cache Scheme: Write-Back
Supported SRAM Type:
Current SRAM Type:
Cache Speed: Unknown
Error Correction Type: Unknown
Maximum Cache Size: 0 KBytes
Installed Cache Size: 0 KBytes
Cache Associativity: Unknown
Unknown
Socket Designation: Unknown
Cache State: Enabled
Cache Type: Internal, Unified
Cache Scheme: Write-Through and Write-Back
Supported SRAM Type:
Current SRAM Type:
Cache Speed: Unknown
Error Correction Type:
Maximum Cache Size: 4096 KBytes
Installed Cache Size: 4096 KBytes
Cache Associativity: 16-way Set-Associative
On Board Device
Device Description: Broadcom 5752 NetXtreme Gigabit Controller
Device Type: Ethernet Adapter
Device Status: Enabled
On Board Device
Device Description: Intel(R) High Definition Audio Controller
Device Type: Audio Device
Device Status: Enabled
OEM Strings
www.dell.com
BIOS Language
en|US|iso8859-1 <Active>
System Event Log
Hardware Security
Power-on Password: Enabled
Keyboard Password: Not implemented
Administrator Password: Enabled
Front Panel Reset: Not implemented
System Power Controls
Voltage Probe
Description: CPU0 Voltage
Location: Motherboard
Status: OK
Maximum Value: 3320 mV
Minimum Value: Unknown
Resolution: 7.8 mV
Tolerance: Unknown
Accuracy: 2.00
Voltage Probe
Description: +VTT
Location: Motherboard
Status: OK
Maximum Value: 1990 mV
Minimum Value: Unknown
Resolution: 7.8 mV
Tolerance: Unknown
Accuracy: 2.00
Voltage Probe
Description: +VCC
Location: Motherboard
Status: OK
Maximum Value: 6640 mV
Minimum Value: Unknown
Resolution: 17.1 mV
Tolerance: Unknown
Accuracy: 2.00
Cooling Device
Type: Fan
Status: OK
Cooling Device
Type: Fan
Status: OK
Cooling Device
Type: Fan
Status: OK
Cooling Device
Type: Fan
Status: OK
Temperature Probe
Description: CPU0
Location: Processor
Status: OK
Maximum Value: 127.0 °C
Minimum Value: -127.0 °C
Resolution: 1.000 °C
Tolerance: Unknown
Accuracy: Unknown
System Boot Information
Boot Status: No error occured
Memory Devices
Physical Memory Array
Array Location: System board
Array Use: System memory
Error Detecting Method: Single-bit ECC
Memory Capacity: 33554432 KBytes
Memory Devices: 8
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 2048 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 1
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: 80CE7FB380CE
Serial Number: 44846B85
Part Number: M395T5663QZ4-CE66
Asset Tag: 011014
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 2048 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 2
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: 80CE7FB380CE
Serial Number: 44846B70
Part Number: M395T5663QZ4-CE66
Asset Tag: 011014
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 1024 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 3
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: 830B8089830B
Serial Number: A5E60442
Part Number: NT1GT72U8PB1BN-3C
Asset Tag: 110722
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 1024 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 4
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: 80CE808980CE
Serial Number: 1113289E
Part Number: M395T2953EZ4-CE65
Asset Tag: 010732
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 1024 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 5
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: 80AD808980AD
Serial Number: 50881129
Part Number: HYMP112F72CP8N3-Y5
Asset Tag: 010941
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 1024 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 6
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: 01987FB380AD
Serial Number: 391270E7
Part Number: KINGSTON
Asset Tag: 041028
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 0 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 7
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: FFFFFFFFFFFF
Serial Number: FFFFFFFF
Part Number:
Asset Tag: FFFFFF
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 0 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 8
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: FFFFFFFFFFFF
Serial Number: FFFFFFFF
Part Number:
Asset Tag: FFFFFF
Memory Array Mapped Address
Starting Address: 00000000
Ending Address: 007FFFFF
Partition Width: 1
Memory Device Mapped Address
Starting Address: 00000000
Ending Address: 003FFFFF
Partition Row Position: 1
Interleave Position: 1
Interleave Data Depth: 2
Memory Device Mapped Address
Starting Address: 00000000
Ending Address: 003FFFFF
Partition Row Position: 1
Interleave Position: 2
Interleave Data Depth: 2
Memory Device Mapped Address
Starting Address: 00400000
Ending Address: 005FFFFF
Partition Row Position: 1
Interleave Position: 3
Interleave Data Depth: 2
Memory Device Mapped Address
Starting Address: 00400000
Ending Address: 005FFFFF
Partition Row Position: 1
Interleave Position: 4
Interleave Data Depth: 2
Memory Device Mapped Address
Starting Address: 00600000
Ending Address: 007FFFFF
Partition Row Position: 1
Interleave Position: 1
Interleave Data Depth: 2
Memory Device Mapped Address
Starting Address: 00600000
Ending Address: 007FFFFF
Partition Row Position: 1
Interleave Position: 2
Interleave Data Depth: 2
Port Connectors
Parallel Port PS/2
Port Type: Parallel Port PS/2
Internal Reference: PARALLEL
Internal Connector Type: None
External Reference: Unknown
External Connector Type: DB25 pin female
Serial Port 16550A Compatible
Port Type: Serial Port 16550A Compatible
Internal Reference: SERIAL1
Internal Connector Type: None
External Reference: Unknown
External Connector Type: DB-9 pin male
Serial Port 16550A Compatible
Port Type: Serial Port 16550A Compatible
Internal Reference: SERIAL2
Internal Connector Type: None
External Reference: Unknown
External Connector Type: DB-9 pin male
Keyboard Port
Port Type: Keyboard Port
Internal Reference: KYBD
Internal Connector Type: None
External Reference: Unknown
External Connector Type: PS/2
Mouse Port
Port Type: Mouse Port
Internal Reference: MOUSE
Internal Connector Type: None
External Reference: Unknown
External Connector Type: PS/2
USB
Port Type: USB
Internal Reference: USB1
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
USB
Port Type: USB
Internal Reference: USB2
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
USB
Port Type: USB
Internal Reference: USB3
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
USB
Port Type: USB
Internal Reference: USB4
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
USB
Port Type: USB
Internal Reference: USB5
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
USB
Port Type: USB
Internal Reference: USB6
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
USB
Port Type: USB
Internal Reference: USB7
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
USB
Port Type: USB
Internal Reference: USB8
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
Network Port
Port Type: Network Port
Internal Reference: ENET
Internal Connector Type: None
External Reference: Unknown
External Connector Type: RJ-45
Audio Port
Port Type: Audio Port
Internal Reference: MIC
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Mini-jack (headphones)
Audio Port
Port Type: Audio Port
Internal Reference: LINE-OUT
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Mini-jack (headphones)
Audio Port
Port Type: Audio Port
Internal Reference: LINE-IN
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Mini-jack (headphones)
Audio Port
Port Type: Audio Port
Internal Reference: HP-OUT
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Mini-jack (headphones)
System Slots
SLOT1
Slot Designation: SLOT1
Slot Type: PCI Express
Slot Usage: In use
Slot Data Bus Width: 4x / x4
Slot Length: Long
SLOT2
Slot Designation: SLOT2
Slot Type: PCI Express
Slot Usage: In use
Slot Data Bus Width: 16x / x16
Slot Length: Long
SLOT3
Slot Designation: SLOT3
Slot Type: PCI Express
Slot Usage: Empty
Slot Data Bus Width: 4x / x4
Slot Length: Long
SLOT4
Slot Designation: SLOT4
Slot Type: PCI
Slot Usage: Empty
Slot Data Bus Width: 32-bit
Slot Length: Long
SLOT5
Slot Designation: SLOT5
Slot Type: PCI
Slot Usage: In use
Slot Data Bus Width: 64-bit
Slot Length: Long
SLOT6
Slot Designation: SLOT6
Slot Type: PCI
Slot Usage: Empty
Slot Data Bus Width: 64-bit
Slot Length: Long
Memory
[General information]
Total Memory Size: 8 GBytes
Total Memory Size [MB]: 8192
[Current Performance Settings]
Current Memory Clock: 332.5 MHz (1 : 1 ratio)
Current Timing (tCAS-tRCD-tRP-tRAS): 5.0-5-5-15
Read to Read Delay (tRD_RD) Same Rank: 3T
Write to Write Delay (tWR_WR) Same Rank: 2T
Read to Write Delay (tRD_WR) Same Rank: 5T
Write to Read Delay (tWR_RD) Same Rank (tWTR): 9T
Write to Read Delay (tWR_RD) Different Rank: 2T
Read to Precharge Delay (tRTP): 3T
Write to Precharge Delay (tWTP): 16T
Write Recovery Time (tWR): 5T
RAS# to RAS# Delay (tRRD): 3T
Row Cycle Time (tRC): 20T
Refresh Cycle Time (tRFC): 43T
Row: 0 - 2048 MB PC5300F DDR2 FB-DIMM Samsung M395T5663QZ4-CE66
[General Module Information]
Module Number: 0
Module Size: 2048 MBytes
Memory Type: DDR2 FB-DIMM
Module Type: FB-DIMM
Error Check/Correction: ECC
Memory Speed: 333.3 MHz (PC5300F)
Module Manufacturer: Samsung
Module Part Number: M395T5663QZ4-CE66
Module Revision: 0
Module Serial Number: 2238415940
Module Manufacturing Date: Year: 2010, Week: 14
Module Manufacturing Location: 1
SDRAM Manufacturer: Samsung
AMB Manufacturer: Unknown
[Module characteristics]
Row Address Bits: 14
Column Address Bits: 10
Number Of Banks: 8
Number Of Ranks: 2
Device Width: 8 bits
Voltage Levels: Power Supply1: 1.5V, Power Supply2: 1.8V
[Module timing]
CAS# Latencies Supported: 3 - 5
Write Recovery Times Supported: 2 - 5
Write Latencies Supported: 2 - 4
Additive Latencies Supported: 0 - 5
Burst Lengths Supported: 4, 8
Terminations Supported: 150, 75, 50 Ohm ODT
Minimum SDRAM Cycle Time (tCKmin): 3.000 ns
Maximum SDRAM Cycle Time (tCKmax): 8.000 ns
Minimum CAS Latency Time (tAAmin): 15.000 ns
Minimum RAS# to CAS# Delay (tRCDmin): 15.000 ns
Minimum Row Precharge Time (tRPmin): 15.000 ns
Minimum Active to Precharge Time (tRASmin): 45.000 ns
Supported Module Timing at 333.3 MHz: 5-5-5-15
Supported Module Timing at 266.7 MHz: 4-4-4-12
Supported Module Timing at 200.0 MHz: 3-3-3-9
Minimum Row Active to Row Active Delay (tRRD): 7.500 ns
Write Recovery Time (tWR): 15.000 ns
Minimum Active to Active/Refresh Time (tRC): 60.000 ns
Minimum Refresh Recovery Time Delay (tRFC): 127.500 ns
Minimum Internal Write to Read Command Delay (tWTR): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTP): 7.500 ns
Average SDRAM Refresh Interval (tREFI): 7.8 us (reduced 0.5x)
Minimum Read-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Write-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Read-to-Write Turnaround Additional Cycles: 1 clocks
Buffer Read Access Time for DDR2-800: 3.500 tCK
Buffer Read Access Time for DDR2-667: 3.333 tCK
Buffer Read Access Time for DDR2-533: 3.167 tCK
Computer Brand Name: DELL Precision WorkStation 490
[Operating System]
Operating System: Microsoft Windows 7 Ultimate (x64) Build 7601
Service Pack: Service Pack 1
UEFI Boot: Not Present
Central Processor(s)
[CPU Unit Count]
Number Of Processor Packages (Physical): 1
Number Of Processors Cores: 2
Number Of Logical Processors: 2
Intel Xeon 5140
[General Information]
Processor Name: Intel Xeon 5140
Original Processor Frequency: 2333.3 MHz
Original Processor Frequency [MHz]: 2333
CPU ID: 000006FB
CPU Brand Name: Intel(R) Xeon(R) CPU 5140 @ 2.33GHz
CPU Vendor: GenuineIntel
CPU Stepping: G0
CPU Code Name: Woodcrest
CPU S-Spec: SLAGB
CPU Thermal Design Power (TDP): 65 W
CPU Max. Case Temperature (Tcase_max): 65 °C
CPU Type: Production Unit
CPU Platform: LGA771 (FC-LGA6)
Microcode Update Revision: B9
Number of CPU Cores: 2
Number of Logical CPUs: 2
[Operating Points]
CPU LFM (Minimum): 2000.0 MHz = 6 x 333.3 MHz @ 1.0875 V
CPU HFM (Maximum): 2333.3 MHz = 7 x 333.3 MHz @ 1.3250 V [Unlocked]
CPU Current: 2327.3 MHz = 7 x 332.5 MHz @ 1.3250 V
CPU Bus Type: FSB (QDR)
[Cache and TLB]
L1 Cache: Instruction: 2 x 32 KBytes, Data: 2 x 32 KBytes
L2 Cache: Integrated: 4 MBytes
Instruction TLB: 4 KB Pages, 4-way set associative, 128 entries
Data TLB: 4 MB Pages, 4-way set associative, 32 entries
[Standard Feature Flags]
FPU on Chip Present
Enhanced Virtual-86 Mode Present
I/O Breakpoints Present
Page Size Extensions Present
Time Stamp Counter Present
Pentium-style Model Specific Registers Present
Physical Address Extension Present
Machine Check Exception Present
CMPXCHG8B Instruction Present
APIC On Chip / PGE (AMD) Present
Fast System Call Present
Memory Type Range Registers Present
Page Global Feature Present
Machine Check Architecture Present
CMOV Instruction Present
Page Attribute Table Present
36-bit Page Size Extensions Present
Processor Number Not Present
CLFLUSH Instruction Present
Debug Trace and EMON Store Present
Internal ACPI Support Present
MMX Technology Present
Fast FP Save/Restore (IA MMX-2) Present
Streaming SIMD Extensions Present
Streaming SIMD Extensions 2 Present
Self-Snoop Present
Multi-Threading Capable Present
Automatic Clock Control Present
IA-64 Processor Not Present
Signal Break on FERR Present
Streaming SIMD Extensions 3 Present
Carryless Multiplication (PCLMULQDQ)/GFMUL Not Present
64-Bit Debug Store Present
MONITOR/MWAIT Support Present
CPL Qualified Debug Store Present
Virtual Machine Extensions Present
Safer Mode Extensions (Intel TXT) Not Present
Thermal Monitor 2 Present
Supplemental Streaming SIMD Extensions 3 Present
Enhanced SpeedStep Technology Present
L1 Context ID Not Present
IA32 Debug Interface Support Not Present
Fused Multiply Add Not Present
CMPXCHG16B Support Present
Send Task Priority Messages Disabling Present
Performance/Debug Capability MSR Present
Processor Context ID Not Present
Direct Cache Access Present
Streaming SIMD Extensions 4.1 Not Present
Streaming SIMD Extensions 4.2 Not Present
Extended xAPIC Not Present
MOVBE Instruction Not Present
POPCNT Instruction Not Present
TSC-deadline Timer Not Present
AES Cryptography Support Not Present
XSAVE/XRSTOR/XSETBV/XGETBV Instructions Not Present
XGETBV/XSETBV OS Enabled Not Present
AVX Support Not Present
Float16 Instructions Not Present
Random Number Read Instruction Not Present
[Extended Feature Flags]
64-bit Extensions Present
RDTSCP and TSC_AUX Support Not Present
1 GB large page support Not Present
No Execute Present
SYSCALL/SYSRET Support Not Present
Read/Write FS/GS Base Instructions Not Present
TSC_THREAD_OFFSET Not Present
Software Guard Extensions (SGX) Support Not Present
Bit Manipulation Instructions Set 1 Not Present
Hardware Lock Elision Not Present
AVX2 Instructions Not Present
Supervisor Mode Execution Protection Not Present
Bit Manipulation Instructions Set 2 Not Present
Enhanced Performance String Instruction Not Present
INVPCID Instruction Not Present
Restricted Transactional Memory Not Present
Platform Quality of Service Monitoring (PQM) Not Present
Platform Quality of Service Enforcement (PQE) Not Present
Deprecated FPU CS and FPU DS Not Present
Memory Protection Extensions Not Present
Advanced Vector Extensions 512 (AVX-512) Not Present
AVX-512 Doubleword and Quadword Instructions Not Present
RDSEED Instruction Not Present
Multi-precision Add Carry Instructions Not Present
Supervisor Mode Access Prevention (SMAP) Not Present
AVX-512 52-bit Integer FMA Instructions Not Present
CLFLUSHOPT Instructions Not Present
Intel Processor Trace Not Present
AVX-512 Prefetch Instructions Not Present
AVX-512 Exponential and Reciprocal Instructions Not Present
AVX-512 Conflict Detection Instructions Not Present
Secure Hash Algorithm (SHA) Extensions Not Present
AVX-512 Byte and Word Instructions Not Present
AVX-512 Vector Length Extensions Not Present
PREFETCHWT1 Instruction Not Present
AVX-512 Vector Bit Manipulation Instructions Not Present
[Enhanced Features]
Thermal Monitor 1: Supported, Enabled
Thermal Monitor 2: Supported, Enabled
Enhanced Intel SpeedStep (GV3): Supported, Disabled
Bi-directional PROCHOT#: N/A
Extended Auto-HALT State C1E: Enabled
Extended Stop Grant State C2E: N/A
Enhanced Halt State C3E: N/A
Enhanced Halt State C4E: N/A
Enhanced Halt State Hard C4E: N/A
Hardware Prefetcher: Supported, Enabled
DCU Prefetcher: Supported, Disabled
IP Prefetcher: Supported, Enabled
Adjacent Cache Line Prefetch: Supported, Disabled
MLC Streamer Prefetcher Not Supported
MLC Spatial Prefetcher Not Supported
DCU Streamer Prefetcher Not Supported
DCU IP Prefetcher Not Supported
Intel Dynamic Acceleration (IDA) Technology: Not Supported
Intel Dynamic FSB Switching: Not Supported
Enhanced Multi Threaded Thermal Management: N/A
Intel Turbo Boost Technology: Not Supported
Programmable Ratio Limits: Not Supported
Programmable TDC/TDP Limits: Not Supported
[Memory Ranges]
Maximum Physical Address Size: 38-bit (256 GBytes)
Maximum Virtual Address Size: 48-bit (256 TBytes)
[MTRRs]
Range 0-4000000000 (0MB-262144MB) Type: Write Back (WB)
Range CFF00000-30D0000000 (3327MB-199936MB) Type: Uncacheable (UC)
Range D0000000-30E0000000 (3328MB-200192MB) Type: Uncacheable (UC)
Range E0000000-3100000000 (3584MB-200704MB) Type: Uncacheable (UC)
Range FF0000000-4000000000 (65280MB-262144MB) Type: Uncacheable (UC)
Motherboard
[Computer]
Computer Brand Name: DELL Precision WorkStation 490
[Motherboard]
Motherboard Model: DELL 0GU083
Motherboard Chipset: Intel 5000X (Greencreek) + 631x/6321 ESB2
Motherboard Slots: 3xPCI, 2xPCI Express x4, 1xPCI Express x16
PCI Express Version Supported: v1.1
USB Version Supported: v2.0
[BIOS]
BIOS Manufacturer: Phoenix Technologies
BIOS Date: 04/25/08
BIOS Version: A08
UEFI BIOS: Not Capable
Super-IO/LPC Chip: SMSC EMC2700P
ACPI Devices
ACPI Fixed Feature Button
Device Name: ACPI Fixed Feature Button
Intel Processor
Device Name: Intel Processor
Intel Processor
Device Name: Intel Processor
Programmable interrupt controller
Device Name: Programmable interrupt controller
[Assigned Resources]
I/O Port: 0020 - 003F
[Alternative 1]
I/O Port: 0020 - 003F
I/O Port: 00A0 - 00BF
I/O Port: 04D0 - 04D1
System timer
Device Name: System timer
[Assigned Resources]
I/O Port: 0040 - 005F
[Alternative 1]
I/O Port: 0040 - 005F
IRQ: 0
High precision event timer
Device Name: High precision event timer
[Assigned Resources]
Memory Location: FED00000 - FED003FF
[Alternative 1]
Memory Location: FED00000 - FED003FF
Direct memory access controller
Device Name: Direct memory access controller
[Assigned Resources]
I/O Port: 0080 - 009F
[Alternative 1]
I/O Port: 0080 - 009F
I/O Port: 0000 - 001F
I/O Port: 00C0 - 00DF
DMA: 4
ECP Printer Port
Device Name: ECP Printer Port
[Assigned Resources]
I/O Port: 0378 - 037F
[Alternative 1]
I/O Port: 0378 - 037F
I/O Port: 0778 - 077F
IRQ: 7
[Alternative 2]
I/O Port: 0278 - 027F
I/O Port: 0678 - 067F
IRQ: 5
[Alternative 3]
I/O Port: 0378 - 037F
I/O Port: 0778 - 077F
IRQ: 3
IRQ: 4
IRQ: 5
IRQ: 6
IRQ: 7
IRQ: 12
[Alternative 4]
I/O Port: 0378 - 037F
I/O Port: 0778 - 077F
IRQ: 3
IRQ: 4
IRQ: 5
IRQ: 6
IRQ: 7
IRQ: 12
DMA: 1
DMA: 2
DMA: 3
[Alternative 5]
I/O Port: 0278 - 027F
I/O Port: 0678 - 067F
IRQ: 3
IRQ: 4
IRQ: 5
IRQ: 6
IRQ: 7
IRQ: 12
[Alternative 6]
I/O Port: 0278 - 027F
I/O Port: 0678 - 067F
IRQ: 3
IRQ: 4
IRQ: 5
IRQ: 6
IRQ: 7
IRQ: 12
DMA: 1
DMA: 2
DMA: 3
[Alternative 7]
I/O Port: 0378 - 037F
I/O Port: 0778 - 077F
[Alternative 8]
I/O Port: 0278 - 027F
I/O Port: 0678 - 067F
[Alternative 9]
I/O Port: 03BC - 03BF
I/O Port: 07BC - 07BF
[Alternative 10]
I/O Port: 03BC - 03BF
I/O Port: 07BC - 07BF
IRQ: 7
Communications Port
Device Name: Communications Port
[Assigned Resources]
I/O Port: 03F8 - 03FF
[Alternative 1]
I/O Port: 03F8 - 03FF
IRQ: 4
[Alternative 2]
I/O Port: 03E8 - 03EF
IRQ: 4
[Alternative 3]
I/O Port: 02F8 - 02FF
IRQ: 3
[Alternative 4]
I/O Port: 02E8 - 02EF
IRQ: 3
Communications Port
Device Name: Communications Port
[Assigned Resources]
I/O Port: 02F8 - 02FF
[Alternative 1]
I/O Port: 02F8 - 02FF
IRQ: 3
[Alternative 2]
I/O Port: 02E8 - 02EF
IRQ: 3
[Alternative 3]
I/O Port: 03F8 - 03FF
IRQ: 4
[Alternative 4]
I/O Port: 03E8 - 03EF
IRQ: 4
Standard floppy disk controller
Device Name: Standard floppy disk controller
[Assigned Resources]
I/O Port: 03F0 - 03F5
I/O Port: 0000 - 0005
[Alternative 1]
I/O Port: 03F0 - 03F5
I/O Port: 03F7
IRQ: 6
DMA: 2
[Alternative 2]
I/O Port: 03F0 - 03F5
I/O Port: 03F7
IRQ: 3
IRQ: 4
IRQ: 5
IRQ: 6
IRQ: 7
IRQ: 12
DMA: 1
DMA: 2
DMA: 3
[Alternative 3]
I/O Port: 0370 - 0375
I/O Port: 0377
IRQ: 3
IRQ: 4
IRQ: 5
IRQ: 6
IRQ: 7
IRQ: 12
DMA: 1
DMA: 2
DMA: 3
System speaker
Device Name: System speaker
[Assigned Resources]
I/O Port: 0061
[Alternative 1]
I/O Port: 0061
PCI bus
Device Name: PCI bus
[Assigned Resources]
I/O Port: 0000 - FFFFFFFF
I/O Port: 0000 - 0002
Memory Location: 000A0000 - 000BFFFF
Memory Location: 000F0000 - 000EFFFF
Memory Location: CFF00000 - DFFFFFFF
[Alternative 1]
I/O Port: 0000 - 0CF7
I/O Port: 0D00 - FFFF
Memory Location: 000A0000 - 000BFFFF
Memory Location: 000C0000 - 000EFFFF
Memory Location: 000F0000 - 000FFFFF
Memory Location: F0000000 - FE000000
Memory Location: CFF00000 - DFFFFFFF
Memory Location: FF980800 - FF980BFF
Memory Location: FF97C000 - FF97FFFF
Memory Location: FED20000 - FED9FFFF
System CMOS/real time clock
Device Name: System CMOS/real time clock
[Assigned Resources]
I/O Port: 0070 - 007F
[Alternative 1]
I/O Port: 0070 - 007F
IRQ: 8
System board
Device Name: System board
[Assigned Resources]
I/O Port: 0060
I/O Port: 0000 - 0061
I/O Port: 00E0 - 00EF
[Alternative 1]
I/O Port: 0060
I/O Port: 0064
I/O Port: 0062 - 0063
I/O Port: 0065 - 006F
I/O Port: 00E0 - 00EF
I/O Port: 0800 - 085F
I/O Port: 0C00 - 0C7F
I/O Port: 0860 - 08FF
Numeric data processor
Device Name: Numeric data processor
[Assigned Resources]
I/O Port: 00F0 - 00FF
[Alternative 1]
I/O Port: 00F0 - 00FF
IRQ: 13
ACPI Power Button
Device Name: ACPI Power Button
SMBIOS DMI
BIOS
BIOS Vendor: Dell Inc.
BIOS Version: A08
BIOS Release Date: 04/25/2008
BIOS Start Segment: F000
BIOS Size: 1024 KBytes
ISA Support: Not Present
MCA Support: Not Present
EISA Support: Not Present
PCI Support: Present
PC Card (PCMCIA) Support: Not Present
Plug-and-Play Support: Present
APM Support: Present
Flash BIOS: Present
BIOS Shadow: Present
VL-VESA Support: Not Present
ESCD Support: Not Present
Boot from CD: Present
Selectable Boot: Present
BIOS ROM Socketed: Not Present
Boot from PC Card: Not Present
EDD Support: Present
NEC PC-98 Support: Not Present
ACPI Support: Present
USB Legacy Support: Present
AGP Support: Not Present
I2O Boot Support: Not Present
LS-120 Boot Support: Present
ATAPI ZIP Drive Boot Support: Not Present
IEE1394 Boot Support: Not Present
Smart Battery Support: Not Present
BIOS Boot Specification Support: Present
Function key-initiated Network Service Boot Support: Present
Targeted Content Distribution Support: Present
UEFI Specification Support: Not Present
System
System Manufacturer: Dell Inc.
Product Name: Precision WorkStation 490
Product Version: Unknown
Product Serial Number: 2C9F83J
UUID: {4C4C4544-0043-3910-4680-B2C04F38334A}
SKU Number: Unknown
Family: Unknown
Mainboard
Mainboard Manufacturer: Dell Inc.
Mainboard Name: 0GU083
Mainboard Version: A00
Mainboard Serial Number: ..CN1374078B008X.
System Enclosure
Manufacturer: Dell Inc.
Case Type: Tower
Version: Unknown
Serial Number: 2C9F83J
Asset Tag Number:
Processor
Processor Manufacturer: Intel
Processor Version: Unknown
External Clock: 1333 MHz
Maximum Clock Supported: 3800 MHz
Current Clock: 2333 MHz
CPU Socket: Populated
CPU Status: Enabled
Processor Type: Central Processor
Processor Voltage: 1.8 V
Processor Upgrade: ZIF
Socket Designation: Microprocessor
Processor
Processor Manufacturer: Intel
Processor Version: Unknown
External Clock: 100 MHz
Maximum Clock Supported: 3800 MHz
Current Clock: N/A
CPU Socket: Unpopulated
CPU Status: Unknown
Processor Type: Central Processor
Processor Voltage: 1.8 V
Processor Upgrade: ZIF
Socket Designation: Microprocessor
Unknown
Socket Designation: Unknown
Cache State: Enabled
Cache Type: Internal, Data
Cache Scheme: Write-Back
Supported SRAM Type:
Current SRAM Type:
Cache Speed: Unknown
Error Correction Type: Unknown
Maximum Cache Size: 32 KBytes
Installed Cache Size: 32 KBytes
Cache Associativity: 8-way Set-Associative
Unknown
Socket Designation: Unknown
Cache State: Enabled
Cache Type: Internal, Unified
Cache Scheme: Write-Through and Write-Back
Supported SRAM Type:
Current SRAM Type:
Cache Speed: Unknown
Error Correction Type:
Maximum Cache Size: 4096 KBytes
Installed Cache Size: 4096 KBytes
Cache Associativity: 16-way Set-Associative
Unknown
Socket Designation: Unknown
Cache State: Enabled
Cache Type: Internal, Data
Cache Scheme: Write-Back
Supported SRAM Type:
Current SRAM Type:
Cache Speed: Unknown
Error Correction Type: Unknown
Maximum Cache Size: 0 KBytes
Installed Cache Size: 0 KBytes
Cache Associativity: Unknown
Unknown
Socket Designation: Unknown
Cache State: Enabled
Cache Type: Internal, Unified
Cache Scheme: Write-Through and Write-Back
Supported SRAM Type:
Current SRAM Type:
Cache Speed: Unknown
Error Correction Type:
Maximum Cache Size: 4096 KBytes
Installed Cache Size: 4096 KBytes
Cache Associativity: 16-way Set-Associative
On Board Device
Device Description: Broadcom 5752 NetXtreme Gigabit Controller
Device Type: Ethernet Adapter
Device Status: Enabled
On Board Device
Device Description: Intel(R) High Definition Audio Controller
Device Type: Audio Device
Device Status: Enabled
OEM Strings
www.dell.com
BIOS Language
en|US|iso8859-1 <Active>
System Event Log
Hardware Security
Power-on Password: Enabled
Keyboard Password: Not implemented
Administrator Password: Enabled
Front Panel Reset: Not implemented
System Power Controls
Voltage Probe
Description: CPU0 Voltage
Location: Motherboard
Status: OK
Maximum Value: 3320 mV
Minimum Value: Unknown
Resolution: 7.8 mV
Tolerance: Unknown
Accuracy: 2.00
Voltage Probe
Description: +VTT
Location: Motherboard
Status: OK
Maximum Value: 1990 mV
Minimum Value: Unknown
Resolution: 7.8 mV
Tolerance: Unknown
Accuracy: 2.00
Voltage Probe
Description: +VCC
Location: Motherboard
Status: OK
Maximum Value: 6640 mV
Minimum Value: Unknown
Resolution: 17.1 mV
Tolerance: Unknown
Accuracy: 2.00
Cooling Device
Type: Fan
Status: OK
Cooling Device
Type: Fan
Status: OK
Cooling Device
Type: Fan
Status: OK
Cooling Device
Type: Fan
Status: OK
Temperature Probe
Description: CPU0
Location: Processor
Status: OK
Maximum Value: 127.0 °C
Minimum Value: -127.0 °C
Resolution: 1.000 °C
Tolerance: Unknown
Accuracy: Unknown
System Boot Information
Boot Status: No error occured
Memory Devices
Physical Memory Array
Array Location: System board
Array Use: System memory
Error Detecting Method: Single-bit ECC
Memory Capacity: 33554432 KBytes
Memory Devices: 8
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 2048 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 1
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: 80CE7FB380CE
Serial Number: 44846B85
Part Number: M395T5663QZ4-CE66
Asset Tag: 011014
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 2048 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 2
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: 80CE7FB380CE
Serial Number: 44846B70
Part Number: M395T5663QZ4-CE66
Asset Tag: 011014
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 1024 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 3
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: 830B8089830B
Serial Number: A5E60442
Part Number: NT1GT72U8PB1BN-3C
Asset Tag: 110722
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 1024 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 4
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: 80CE808980CE
Serial Number: 1113289E
Part Number: M395T2953EZ4-CE65
Asset Tag: 010732
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 1024 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 5
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: 80AD808980AD
Serial Number: 50881129
Part Number: HYMP112F72CP8N3-Y5
Asset Tag: 010941
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 1024 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 6
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: 01987FB380AD
Serial Number: 391270E7
Part Number: KINGSTON
Asset Tag: 041028
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 0 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 7
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: FFFFFFFFFFFF
Serial Number: FFFFFFFF
Part Number:
Asset Tag: FFFFFF
Memory Device
Total Width: 72 bits
Data Width: 64 bits
Device Size: 0 MBytes
Device Form Factor: FB-DIMM
Device Locator: DIMM 8
Bank Locator: Unknown
Device Type: DDR2 FB-DIMM
Device Type Detail: Synchronous
Memory Speed: 667 MHz
Manufacturer: FFFFFFFFFFFF
Serial Number: FFFFFFFF
Part Number:
Asset Tag: FFFFFF
Memory Array Mapped Address
Starting Address: 00000000
Ending Address: 007FFFFF
Partition Width: 1
Memory Device Mapped Address
Starting Address: 00000000
Ending Address: 003FFFFF
Partition Row Position: 1
Interleave Position: 1
Interleave Data Depth: 2
Memory Device Mapped Address
Starting Address: 00000000
Ending Address: 003FFFFF
Partition Row Position: 1
Interleave Position: 2
Interleave Data Depth: 2
Memory Device Mapped Address
Starting Address: 00400000
Ending Address: 005FFFFF
Partition Row Position: 1
Interleave Position: 3
Interleave Data Depth: 2
Memory Device Mapped Address
Starting Address: 00400000
Ending Address: 005FFFFF
Partition Row Position: 1
Interleave Position: 4
Interleave Data Depth: 2
Memory Device Mapped Address
Starting Address: 00600000
Ending Address: 007FFFFF
Partition Row Position: 1
Interleave Position: 1
Interleave Data Depth: 2
Memory Device Mapped Address
Starting Address: 00600000
Ending Address: 007FFFFF
Partition Row Position: 1
Interleave Position: 2
Interleave Data Depth: 2
Port Connectors
Parallel Port PS/2
Port Type: Parallel Port PS/2
Internal Reference: PARALLEL
Internal Connector Type: None
External Reference: Unknown
External Connector Type: DB25 pin female
Serial Port 16550A Compatible
Port Type: Serial Port 16550A Compatible
Internal Reference: SERIAL1
Internal Connector Type: None
External Reference: Unknown
External Connector Type: DB-9 pin male
Serial Port 16550A Compatible
Port Type: Serial Port 16550A Compatible
Internal Reference: SERIAL2
Internal Connector Type: None
External Reference: Unknown
External Connector Type: DB-9 pin male
Keyboard Port
Port Type: Keyboard Port
Internal Reference: KYBD
Internal Connector Type: None
External Reference: Unknown
External Connector Type: PS/2
Mouse Port
Port Type: Mouse Port
Internal Reference: MOUSE
Internal Connector Type: None
External Reference: Unknown
External Connector Type: PS/2
USB
Port Type: USB
Internal Reference: USB1
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
USB
Port Type: USB
Internal Reference: USB2
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
USB
Port Type: USB
Internal Reference: USB3
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
USB
Port Type: USB
Internal Reference: USB4
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
USB
Port Type: USB
Internal Reference: USB5
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
USB
Port Type: USB
Internal Reference: USB6
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
USB
Port Type: USB
Internal Reference: USB7
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
USB
Port Type: USB
Internal Reference: USB8
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Access Bus (USB)
Network Port
Port Type: Network Port
Internal Reference: ENET
Internal Connector Type: None
External Reference: Unknown
External Connector Type: RJ-45
Audio Port
Port Type: Audio Port
Internal Reference: MIC
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Mini-jack (headphones)
Audio Port
Port Type: Audio Port
Internal Reference: LINE-OUT
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Mini-jack (headphones)
Audio Port
Port Type: Audio Port
Internal Reference: LINE-IN
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Mini-jack (headphones)
Audio Port
Port Type: Audio Port
Internal Reference: HP-OUT
Internal Connector Type: None
External Reference: Unknown
External Connector Type: Mini-jack (headphones)
System Slots
SLOT1
Slot Designation: SLOT1
Slot Type: PCI Express
Slot Usage: In use
Slot Data Bus Width: 4x / x4
Slot Length: Long
SLOT2
Slot Designation: SLOT2
Slot Type: PCI Express
Slot Usage: In use
Slot Data Bus Width: 16x / x16
Slot Length: Long
SLOT3
Slot Designation: SLOT3
Slot Type: PCI Express
Slot Usage: Empty
Slot Data Bus Width: 4x / x4
Slot Length: Long
SLOT4
Slot Designation: SLOT4
Slot Type: PCI
Slot Usage: Empty
Slot Data Bus Width: 32-bit
Slot Length: Long
SLOT5
Slot Designation: SLOT5
Slot Type: PCI
Slot Usage: In use
Slot Data Bus Width: 64-bit
Slot Length: Long
SLOT6
Slot Designation: SLOT6
Slot Type: PCI
Slot Usage: Empty
Slot Data Bus Width: 64-bit
Slot Length: Long
Memory
[General information]
Total Memory Size: 8 GBytes
Total Memory Size [MB]: 8192
[Current Performance Settings]
Current Memory Clock: 332.5 MHz (1 : 1 ratio)
Current Timing (tCAS-tRCD-tRP-tRAS): 5.0-5-5-15
Read to Read Delay (tRD_RD) Same Rank: 3T
Write to Write Delay (tWR_WR) Same Rank: 2T
Read to Write Delay (tRD_WR) Same Rank: 5T
Write to Read Delay (tWR_RD) Same Rank (tWTR): 9T
Write to Read Delay (tWR_RD) Different Rank: 2T
Read to Precharge Delay (tRTP): 3T
Write to Precharge Delay (tWTP): 16T
Write Recovery Time (tWR): 5T
RAS# to RAS# Delay (tRRD): 3T
Row Cycle Time (tRC): 20T
Refresh Cycle Time (tRFC): 43T
Row: 0 - 2048 MB PC5300F DDR2 FB-DIMM Samsung M395T5663QZ4-CE66
[General Module Information]
Module Number: 0
Module Size: 2048 MBytes
Memory Type: DDR2 FB-DIMM
Module Type: FB-DIMM
Error Check/Correction: ECC
Memory Speed: 333.3 MHz (PC5300F)
Module Manufacturer: Samsung
Module Part Number: M395T5663QZ4-CE66
Module Revision: 0
Module Serial Number: 2238415940
Module Manufacturing Date: Year: 2010, Week: 14
Module Manufacturing Location: 1
SDRAM Manufacturer: Samsung
AMB Manufacturer: Unknown
[Module characteristics]
Row Address Bits: 14
Column Address Bits: 10
Number Of Banks: 8
Number Of Ranks: 2
Device Width: 8 bits
Voltage Levels: Power Supply1: 1.5V, Power Supply2: 1.8V
[Module timing]
CAS# Latencies Supported: 3 - 5
Write Recovery Times Supported: 2 - 5
Write Latencies Supported: 2 - 4
Additive Latencies Supported: 0 - 5
Burst Lengths Supported: 4, 8
Terminations Supported: 150, 75, 50 Ohm ODT
Minimum SDRAM Cycle Time (tCKmin): 3.000 ns
Maximum SDRAM Cycle Time (tCKmax): 8.000 ns
Minimum CAS Latency Time (tAAmin): 15.000 ns
Minimum RAS# to CAS# Delay (tRCDmin): 15.000 ns
Minimum Row Precharge Time (tRPmin): 15.000 ns
Minimum Active to Precharge Time (tRASmin): 45.000 ns
Supported Module Timing at 333.3 MHz: 5-5-5-15
Supported Module Timing at 266.7 MHz: 4-4-4-12
Supported Module Timing at 200.0 MHz: 3-3-3-9
Minimum Row Active to Row Active Delay (tRRD): 7.500 ns
Write Recovery Time (tWR): 15.000 ns
Minimum Active to Active/Refresh Time (tRC): 60.000 ns
Minimum Refresh Recovery Time Delay (tRFC): 127.500 ns
Minimum Internal Write to Read Command Delay (tWTR): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTP): 7.500 ns
Average SDRAM Refresh Interval (tREFI): 7.8 us (reduced 0.5x)
Minimum Read-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Write-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Read-to-Write Turnaround Additional Cycles: 1 clocks
Buffer Read Access Time for DDR2-800: 3.500 tCK
Buffer Read Access Time for DDR2-667: 3.333 tCK
Buffer Read Access Time for DDR2-533: 3.167 tCK
[Thermal characteristics]
SDRAM Maximum Case Temperature (Tcasemax): 95 °C
DT4R4W Delta: 0.8 °C
Thermal Resistance of SDRAM Package from Top (Case) to Ambient: 29.0 °C/W
SDRAM Case Temperature Rise from Ambient due to Activate-Precharge (DT0): 4.0 °C
SDRAM Case Temperature Rise from Ambient due to Precharge/Quiet Standby (DT2N/DT2Q): 1.7 °C
SDRAM Case Temperature Rise from Ambient due to Precharge Power-Down (DT2P): 0.825 °C
SDRAM Case Temperature Rise from Ambient due to Active Standby (DT3N): 2.70 °C
SDRAM Case Temperature Rise from Ambient due to Page Open Burst Read (DT4R): 6.8 °C
SDRAM Case Temperature Rise from Ambient due to Burst Refresh (DT5B): 7.5 °C
SDRAM Case Temperature Rise from Ambient due to Bank Interleave Reads with Auto-Precharge (DT7): 12.5 °C
Thermal Resistance of AMB Package from Top (Case) to Ambient: 21.0 °C/W
AMB Case Temperature Rise from Ambient due to AMB in Idle_0 State (DT AMB Idle_0): 86 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_1 State (DT AMB Idle_1): 107 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_2 State (DT AMB Idle_2): 92 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_1 State (DT AMB Active_1): 145 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_2 State (DT AMB Active_2): 118 °C
AMB Case Temperature Rise from Ambient due to AMB in L0s State (DT AMB L0s): 0 °C
Row: 1 - 1024 MB PC5300F DDR2 FB-DIMM SK Hynix HYMP112F72CP8N3-Y5
[General Module Information]
Module Number: 1
Module Size: 1024 MBytes
Memory Type: DDR2 FB-DIMM
Module Type: FB-DIMM
Error Check/Correction: ECC
Memory Speed: 333.3 MHz (PC5300F)
Module Manufacturer: SK Hynix
Module Part Number: HYMP112F72CP8N3-Y5
Module Revision: 0
Module Serial Number: 689014864
Module Manufacturing Date: Year: 2009, Week: 41
Module Manufacturing Location: 1
SDRAM Manufacturer: SK Hynix
AMB Manufacturer: Numonyx (Intel)
[Module characteristics]
Row Address Bits: 14
Column Address Bits: 10
Number Of Banks: 8
Number Of Ranks: 1
Device Width: 8 bits
Voltage Levels: Power Supply1: 1.5V, Power Supply2: 1.8V
[Module timing]
CAS# Latencies Supported: 4 - 5
Write Recovery Times Supported: 2 - 5
Write Latencies Supported: 2 - 5
Additive Latencies Supported: 0 - 3
Burst Lengths Supported: 4, 8
Terminations Supported: 150, 75, 50 Ohm ODT
Minimum SDRAM Cycle Time (tCKmin): 3.000 ns
Maximum SDRAM Cycle Time (tCKmax): 8.000 ns
Minimum CAS Latency Time (tAAmin): 15.000 ns
Minimum RAS# to CAS# Delay (tRCDmin): 15.000 ns
Minimum Row Precharge Time (tRPmin): 15.000 ns
Minimum Active to Precharge Time (tRASmin): 45.000 ns
Supported Module Timing at 333.3 MHz: 5-5-5-15
Supported Module Timing at 266.7 MHz: 4-4-4-12
Minimum Row Active to Row Active Delay (tRRD): 7.500 ns
Write Recovery Time (tWR): 15.000 ns
Minimum Active to Active/Refresh Time (tRC): 60.000 ns
Minimum Refresh Recovery Time Delay (tRFC): 127.500 ns
Minimum Internal Write to Read Command Delay (tWTR): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTP): 7.500 ns
Average SDRAM Refresh Interval (tREFI): 7.8 us (reduced 0.5x)
Minimum Read-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Write-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Read-to-Write Turnaround Additional Cycles: 1 clocks
Buffer Read Access Time for DDR2-800: 5.500 tCK
Buffer Read Access Time for DDR2-667: 4.000 tCK
Buffer Read Access Time for DDR2-533: 3.500 tCK
[Thermal characteristics]
SDRAM Maximum Case Temperature (Tcasemax): 95 °C
DT4R4W Delta: 0.0 °C
Thermal Resistance of SDRAM Package from Top (Case) to Ambient: 69.5 °C/W
SDRAM Case Temperature Rise from Ambient due to Activate-Precharge (DT0): 9.1 °C
SDRAM Case Temperature Rise from Ambient due to Precharge/Quiet Standby (DT2N/DT2Q): 4.0 °C
SDRAM Case Temperature Rise from Ambient due to Precharge Power-Down (DT2P): 1.320 °C
SDRAM Case Temperature Rise from Ambient due to Active Standby (DT3N): 6.60 °C
SDRAM Case Temperature Rise from Ambient due to Page Open Burst Read (DT4R): 20.0 °C
SDRAM Case Temperature Rise from Ambient due to Burst Refresh (DT5B): 23.0 °C
SDRAM Case Temperature Rise from Ambient due to Bank Interleave Reads with Auto-Precharge (DT7): 24.0 °C
Thermal Resistance of AMB Package from Top (Case) to Ambient: 24.0 °C/W
AMB Case Temperature Rise from Ambient due to AMB in Idle_0 State (DT AMB Idle_0): 96 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_1 State (DT AMB Idle_1): 122 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_2 State (DT AMB Idle_2): 110 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_1 State (DT AMB Active_1): 161 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_2 State (DT AMB Active_2): 127 °C
AMB Case Temperature Rise from Ambient due to AMB in L0s State (DT AMB L0s): 0 °C
Row: 8 - 2048 MB PC5300F DDR2 FB-DIMM Samsung M395T5663QZ4-CE66
[General Module Information]
Module Number: 8
Module Size: 2048 MBytes
Memory Type: DDR2 FB-DIMM
Module Type: FB-DIMM
Error Check/Correction: ECC
Memory Speed: 333.3 MHz (PC5300F)
Module Manufacturer: Samsung
Module Part Number: M395T5663QZ4-CE66
Module Revision: 0
Module Serial Number: 1886094404
Module Manufacturing Date: Year: 2010, Week: 14
Module Manufacturing Location: 1
SDRAM Manufacturer: Samsung
AMB Manufacturer: Unknown
[Module characteristics]
Row Address Bits: 14
Column Address Bits: 10
Number Of Banks: 8
Number Of Ranks: 2
Device Width: 8 bits
Voltage Levels: Power Supply1: 1.5V, Power Supply2: 1.8V
[Module timing]
CAS# Latencies Supported: 3 - 5
Write Recovery Times Supported: 2 - 5
Write Latencies Supported: 2 - 4
Additive Latencies Supported: 0 - 5
Burst Lengths Supported: 4, 8
Terminations Supported: 150, 75, 50 Ohm ODT
Minimum SDRAM Cycle Time (tCKmin): 3.000 ns
Maximum SDRAM Cycle Time (tCKmax): 8.000 ns
Minimum CAS Latency Time (tAAmin): 15.000 ns
Minimum RAS# to CAS# Delay (tRCDmin): 15.000 ns
Minimum Row Precharge Time (tRPmin): 15.000 ns
Minimum Active to Precharge Time (tRASmin): 45.000 ns
Supported Module Timing at 333.3 MHz: 5-5-5-15
Supported Module Timing at 266.7 MHz: 4-4-4-12
Supported Module Timing at 200.0 MHz: 3-3-3-9
Minimum Row Active to Row Active Delay (tRRD): 7.500 ns
Write Recovery Time (tWR): 15.000 ns
Minimum Active to Active/Refresh Time (tRC): 60.000 ns
Minimum Refresh Recovery Time Delay (tRFC): 127.500 ns
Minimum Internal Write to Read Command Delay (tWTR): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTP): 7.500 ns
Average SDRAM Refresh Interval (tREFI): 7.8 us (reduced 0.5x)
Minimum Read-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Write-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Read-to-Write Turnaround Additional Cycles: 1 clocks
Buffer Read Access Time for DDR2-800: 3.500 tCK
Buffer Read Access Time for DDR2-667: 3.333 tCK
Buffer Read Access Time for DDR2-533: 3.167 tCK
[Thermal characteristics]
SDRAM Maximum Case Temperature (Tcasemax): 95 °C
DT4R4W Delta: 0.8 °C
Thermal Resistance of SDRAM Package from Top (Case) to Ambient: 29.0 °C/W
SDRAM Case Temperature Rise from Ambient due to Activate-Precharge (DT0): 4.0 °C
SDRAM Case Temperature Rise from Ambient due to Precharge/Quiet Standby (DT2N/DT2Q): 1.7 °C
SDRAM Case Temperature Rise from Ambient due to Precharge Power-Down (DT2P): 0.825 °C
SDRAM Case Temperature Rise from Ambient due to Active Standby (DT3N): 2.70 °C
SDRAM Case Temperature Rise from Ambient due to Page Open Burst Read (DT4R): 6.8 °C
SDRAM Case Temperature Rise from Ambient due to Burst Refresh (DT5B): 7.5 °C
SDRAM Case Temperature Rise from Ambient due to Bank Interleave Reads with Auto-Precharge (DT7): 12.5 °C
Thermal Resistance of AMB Package from Top (Case) to Ambient: 21.0 °C/W
AMB Case Temperature Rise from Ambient due to AMB in Idle_0 State (DT AMB Idle_0): 86 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_1 State (DT AMB Idle_1): 107 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_2 State (DT AMB Idle_2): 92 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_1 State (DT AMB Active_1): 145 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_2 State (DT AMB Active_2): 118 °C
AMB Case Temperature Rise from Ambient due to AMB in L0s State (DT AMB L0s): 0 °C
Row: 9 - 1024 MB PC5300F DDR2 FB-DIMM Kingston KINGSTON
[General Module Information]
Module Number: 9
Module Size: 1024 MBytes
Memory Type: DDR2 FB-DIMM
Module Type: FB-DIMM
Error Check/Correction: ECC
Memory Speed: 333.3 MHz (PC5300F)
Module Manufacturer: Kingston
Module Part Number: KINGSTON
Module Revision: 12611
Module Serial Number: 3882881593
Module Manufacturing Date: Year: 2010, Week: 28
Module Manufacturing Location: 4
SDRAM Manufacturer: SK Hynix
AMB Manufacturer: Unknown
[Module characteristics]
Row Address Bits: 14
Column Address Bits: 10
Number Of Banks: 8
Number Of Ranks: 1
Device Width: 8 bits
Voltage Levels: Power Supply1: 1.5V, Power Supply2: 1.8V
[Module timing]
CAS# Latencies Supported: 4 - 5
Write Recovery Times Supported: 2 - 5
Write Latencies Supported: 2 - 5
Additive Latencies Supported: 0 - 3
Burst Lengths Supported: 4, 8
Terminations Supported: 150, 75, 50 Ohm ODT
Minimum SDRAM Cycle Time (tCKmin): 3.000 ns
Maximum SDRAM Cycle Time (tCKmax): 8.000 ns
Minimum CAS Latency Time (tAAmin): 15.000 ns
Minimum RAS# to CAS# Delay (tRCDmin): 15.000 ns
Minimum Row Precharge Time (tRPmin): 15.000 ns
Minimum Active to Precharge Time (tRASmin): 45.000 ns
Supported Module Timing at 333.3 MHz: 5-5-5-15
Supported Module Timing at 266.7 MHz: 4-4-4-12
Minimum Row Active to Row Active Delay (tRRD): 7.500 ns
Write Recovery Time (tWR): 15.000 ns
Minimum Active to Active/Refresh Time (tRC): 60.000 ns
Minimum Refresh Recovery Time Delay (tRFC): 127.500 ns
Minimum Internal Write to Read Command Delay (tWTR): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTP): 7.500 ns
Average SDRAM Refresh Interval (tREFI): 7.8 us (reduced 0.5x)
Minimum Read-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Write-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Read-to-Write Turnaround Additional Cycles: 1 clocks
Buffer Read Access Time for DDR2-800: 3.500 tCK
Buffer Read Access Time for DDR2-667: 3.333 tCK
Buffer Read Access Time for DDR2-533: 3.167 tCK
[Thermal characteristics]
SDRAM Maximum Case Temperature (Tcasemax): 95 °C
DT4R4W Delta: 0.8 °C
Thermal Resistance of SDRAM Package from Top (Case) to Ambient: 70.0 °C/W
SDRAM Case Temperature Rise from Ambient due to Activate-Precharge (DT0): 9.4 °C
SDRAM Case Temperature Rise from Ambient due to Precharge/Quiet Standby (DT2N/DT2Q): 4.0 °C
SDRAM Case Temperature Rise from Ambient due to Precharge Power-Down (DT2P): 1.335 °C
SDRAM Case Temperature Rise from Ambient due to Active Standby (DT3N): 6.60 °C
SDRAM Case Temperature Rise from Ambient due to Page Open Burst Read (DT4R): 18.8 °C
SDRAM Case Temperature Rise from Ambient due to Burst Refresh (DT5B): 22.0 °C
SDRAM Case Temperature Rise from Ambient due to Bank Interleave Reads with Auto-Precharge (DT7): 26.0 °C
Thermal Resistance of AMB Package from Top (Case) to Ambient: 21.0 °C/W
AMB Case Temperature Rise from Ambient due to AMB in Idle_0 State (DT AMB Idle_0): 86 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_1 State (DT AMB Idle_1): 107 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_2 State (DT AMB Idle_2): 92 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_1 State (DT AMB Active_1): 145 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_2 State (DT AMB Active_2): 118 °C
AMB Case Temperature Rise from Ambient due to AMB in L0s State (DT AMB L0s): 0 °C
Row: 16 - 1024 MB PC5300F DDR2 FB-DIMM Nanya Technology NT1GT72U8PB1BN-3C
[General Module Information]
Module Number: 16
Module Size: 1024 MBytes
Memory Type: DDR2 FB-DIMM
Module Type: FB-DIMM
Error Check/Correction: ECC
Memory Speed: 333.3 MHz (PC5300F)
Module Manufacturer: Nanya Technology
Module Part Number: NT1GT72U8PB1BN-3C
Module Revision: 0
Module Serial Number: 1107617445
Module Manufacturing Date: Year: 2007, Week: 22
Module Manufacturing Location: 17
SDRAM Manufacturer: Nanya Technology
AMB Manufacturer: Numonyx (Intel)
[Module characteristics]
Row Address Bits: 14
Column Address Bits: 10
Number Of Banks: 4
Number Of Ranks: 2
Device Width: 8 bits
Voltage Levels: Power Supply1: 1.5V, Power Supply2: 1.8V
[Module timing]
CAS# Latencies Supported: 3 - 5
Write Recovery Times Supported: 2 - 5
Write Latencies Supported: 2 - 5
Additive Latencies Supported: 0 - 3
Burst Lengths Supported: 4, 8
Terminations Supported: 150, 75, 50 Ohm ODT
Minimum SDRAM Cycle Time (tCKmin): 3.000 ns
Maximum SDRAM Cycle Time (tCKmax): 8.000 ns
Minimum CAS Latency Time (tAAmin): 15.000 ns
Minimum RAS# to CAS# Delay (tRCDmin): 15.000 ns
Minimum Row Precharge Time (tRPmin): 15.000 ns
Minimum Active to Precharge Time (tRASmin): 45.000 ns
Supported Module Timing at 333.3 MHz: 5-5-5-15
Supported Module Timing at 266.7 MHz: 4-4-4-12
Supported Module Timing at 200.0 MHz: 3-3-3-9
Minimum Row Active to Row Active Delay (tRRD): 7.500 ns
Write Recovery Time (tWR): 15.000 ns
Minimum Active to Active/Refresh Time (tRC): 60.000 ns
Minimum Refresh Recovery Time Delay (tRFC): 105.000 ns
Minimum Internal Write to Read Command Delay (tWTR): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTP): 7.500 ns
Average SDRAM Refresh Interval (tREFI): 7.8 us (reduced 0.5x)
Minimum Read-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Write-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Read-to-Write Turnaround Additional Cycles: 1 clocks
Buffer Read Access Time for DDR2-800: 5.500 tCK
Buffer Read Access Time for DDR2-667: 4.000 tCK
Buffer Read Access Time for DDR2-533: 3.500 tCK
[Thermal characteristics]
SDRAM Maximum Case Temperature (Tcasemax): 95 °C
DT4R4W Delta: 1.2 °C
Thermal Resistance of SDRAM Package from Top (Case) to Ambient: 61.0 °C/W
SDRAM Case Temperature Rise from Ambient due to Activate-Precharge (DT0): 8.8 °C
SDRAM Case Temperature Rise from Ambient due to Precharge/Quiet Standby (DT2N/DT2Q): 4.7 °C
SDRAM Case Temperature Rise from Ambient due to Precharge Power-Down (DT2P): 0.825 °C
SDRAM Case Temperature Rise from Ambient due to Active Standby (DT3N): 5.85 °C
SDRAM Case Temperature Rise from Ambient due to Page Open Burst Read (DT4R): 15.2 °C
SDRAM Case Temperature Rise from Ambient due to Burst Refresh (DT5B): 19.0 °C
SDRAM Case Temperature Rise from Ambient due to Bank Interleave Reads with Auto-Precharge (DT7): 20.0 °C
Thermal Resistance of AMB Package from Top (Case) to Ambient: 24.0 °C/W
AMB Case Temperature Rise from Ambient due to AMB in Idle_0 State (DT AMB Idle_0): 96 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_1 State (DT AMB Idle_1): 122 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_2 State (DT AMB Idle_2): 110 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_1 State (DT AMB Active_1): 161 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_2 State (DT AMB Active_2): 127 °C
AMB Case Temperature Rise from Ambient due to AMB in L0s State (DT AMB L0s): 0 °C
Row: 24 - 1024 MB PC5300F DDR2 FB-DIMM Samsung M395T2953EZ4-CE65
[General Module Information]
Module Number: 24
Module Size: 1024 MBytes
Memory Type: DDR2 FB-DIMM
Module Type: FB-DIMM
Error Check/Correction: ECC
Memory Speed: 333.3 MHz (PC5300F)
Module Manufacturer: Samsung
Module Part Number: M395T2953EZ4-CE65
Module Revision: 0
Module Serial Number: 2653426449
Module Manufacturing Date: Year: 2007, Week: 32
Module Manufacturing Location: 1
SDRAM Manufacturer: Samsung
AMB Manufacturer: Numonyx (Intel)
[Module characteristics]
Row Address Bits: 14
Column Address Bits: 10
Number Of Banks: 4
Number Of Ranks: 2
Device Width: 8 bits
Voltage Levels: Power Supply1: 1.5V, Power Supply2: 1.8V
[Module timing]
CAS# Latencies Supported: 3 - 5
Write Recovery Times Supported: 2 - 5
Write Latencies Supported: 2 - 4
Additive Latencies Supported: 0 - 3
Burst Lengths Supported: 4, 8
Terminations Supported: 150, 75, 50 Ohm ODT
Minimum SDRAM Cycle Time (tCKmin): 3.000 ns
Maximum SDRAM Cycle Time (tCKmax): 8.000 ns
Minimum CAS Latency Time (tAAmin): 15.000 ns
Minimum RAS# to CAS# Delay (tRCDmin): 15.000 ns
Minimum Row Precharge Time (tRPmin): 15.000 ns
Minimum Active to Precharge Time (tRASmin): 45.000 ns
Supported Module Timing at 333.3 MHz: 5-5-5-15
Supported Module Timing at 266.7 MHz: 4-4-4-12
Supported Module Timing at 200.0 MHz: 3-3-3-9
Minimum Row Active to Row Active Delay (tRRD): 7.500 ns
Write Recovery Time (tWR): 15.000 ns
Minimum Active to Active/Refresh Time (tRC): 60.000 ns
Minimum Refresh Recovery Time Delay (tRFC): 105.000 ns
Minimum Internal Write to Read Command Delay (tWTR): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTP): 7.500 ns
Average SDRAM Refresh Interval (tREFI): 7.8 us (reduced 0.5x)
Minimum Read-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Write-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Read-to-Write Turnaround Additional Cycles: 1 clocks
Buffer Read Access Time for DDR2-800: 5.500 tCK
Buffer Read Access Time for DDR2-667: 4.000 tCK
Buffer Read Access Time for DDR2-533: 3.500 tCK
[Thermal characteristics]
SDRAM Maximum Case Temperature (Tcasemax): 95 °C
DT4R4W Delta: 1.6 °C
Thermal Resistance of SDRAM Package from Top (Case) to Ambient: 31.0 °C/W
SDRAM Case Temperature Rise from Ambient due to Activate-Precharge (DT0): 4.3 °C
SDRAM Case Temperature Rise from Ambient due to Precharge/Quiet Standby (DT2N/DT2Q): 2.1 °C
SDRAM Case Temperature Rise from Ambient due to Precharge Power-Down (DT2P): 0.465 °C
SDRAM Case Temperature Rise from Ambient due to Active Standby (DT3N): 3.30 °C
SDRAM Case Temperature Rise from Ambient due to Page Open Burst Read (DT4R): 8.0 °C
SDRAM Case Temperature Rise from Ambient due to Burst Refresh (DT5B): 6.5 °C
SDRAM Case Temperature Rise from Ambient due to Bank Interleave Reads with Auto-Precharge (DT7): 10.5 °C
Thermal Resistance of AMB Package from Top (Case) to Ambient: 24.0 °C/W
AMB Case Temperature Rise from Ambient due to AMB in Idle_0 State (DT AMB Idle_0): 96 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_1 State (DT AMB Idle_1): 122 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_2 State (DT AMB Idle_2): 110 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_1 State (DT AMB Active_1): 161 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_2 State (DT AMB Active_2): 127 °C
AMB Case Temperature Rise from Ambient due to AMB in L0s State (DT AMB L0s): 0 °C
Bus
PCI Bus #0
Intel 5000X Chipset - Memory Controller Hub / ESI Bridge [B-2]
[General Information]
Device Name: Intel 5000X Chipset - Memory Controller Hub / ESI Bridge [B-2]
Original Device Name: Intel 5000X Chipset - Memory Controller Hub / ESI Bridge [B-2]
Device Class: Host-to-PCI Bridge
Revision ID: 12
Bus Number: 0
Device Number: 0
Function Number: 0
PCI Latency Timer: 0
Hardware ID: PCI\VEN_8086&DEV_25C0&SUBSYS_80868086&REV_12
[PCI Express]
Version: 1.1
Maximum Link Width: 4x
Current Link Width: 4x
Maximum Link Speed: 2.5 Gb/s
Current Link Speed: 2.5 Gb/s
Device/Port Type: Root Port of PCI Express Root Complex
Slot Implemented: No
Active State Power Management (ASPM) Support: L0s
Active State Power Management (ASPM) Status: Disabled
[System Resources]
Interrupt Line: N/A
Interrupt Pin: INTA#
[Features]
Bus Mastering: Enabled
Running At 66 MHz: Not Capable
Fast Back-to-Back Transactions: Not Capable
[Driver Information]
Driver Manufacturer: Intel
Driver Description: Intel(R) 5000X Chipset Memory Controller Hub - 25C0
Driver Provider: Microsoft
Driver Version: 6.1.7601.17514
Driver Date: 21-Jun-2006
DeviceInstanceId PCI\VEN_8086&DEV_25C0&SUBSYS_80868086&REV_12\3&172E68DD&0&00
Intel 5000 Series Chipset - PCI Express x4 Port 2
[General Information]
Device Name: Intel 5000 Series Chipset - PCI Express x4 Port 2
Original Device Name: Intel 5000 Series Chipset - PCI Express x4 Port 2
Device Class: PCI-to-PCI Bridge
Revision ID: 12
Bus Number: 0
Device Number: 2
Function Number: 0
PCI Latency Timer: 0
Hardware ID: PCI\VEN_8086&DEV_25E2&SUBSYS_00000000&REV_12
[PCI Express]
Version: 1.1
Maximum Link Width: 4x
Current Link Width: 4x
Maximum Link Speed: 2.5 Gb/s
Current Link Speed: 2.5 Gb/s
Device/Port Type: Root Port of PCI Express Root Complex
Slot Implemented: No
Active State Power Management (ASPM) Support: L0s
Active State Power Management (ASPM) Status: Disabled
[System Resources]
Interrupt Line: N/A
Interrupt Pin: INTA#
[Features]
Bus Mastering: Enabled
Running At 66 MHz: Not Capable
Fast Back-to-Back Transactions: Not Capable
[Driver Information]
Driver Manufacturer: Intel
Driver Description: Intel(R) 5000 Series Chipset PCI Express x4 Port 2 - 25E2
Driver Provider: Microsoft
Driver Version: 6.1.7601.17514
Driver Date: 21-Jun-2006
DeviceInstanceId PCI\VEN_8086&DEV_25E2&SUBSYS_00000000&REV_12\3&172E68DD&0&10
PCI Express x4 Bus #1
Intel 6311/6321 ESB2 - PCI Express Upstream Port [A-1]
[General Information]
Device Name: Intel 6311/6321 ESB2 - PCI Express Upstream Port [A-1]
Original Device Name: Intel 6311/6321 ESB2 - PCI Express Upstream Port [A-1]
Device Class: PCI-to-PCI Bridge
Revision ID: 1
Bus Number: 1
Device Number: 0
Function Number: 0
PCI Latency Timer: 0
Hardware ID: PCI\VEN_8086&DEV_3500&SUBSYS_00000000&REV_01
[PCI Express]
Version: 1.1
Maximum Link Width: 8x
Current Link Width: 4x
Maximum Link Speed: 2.5 Gb/s
Current Link Speed: 2.5 Gb/s
Device/Port Type: Upstream Port of PCI Express Switch
Slot Implemented: No
Active State Power Management (ASPM) Support: L0s
Active State Power Management (ASPM) Status: Disabled
[System Resources]
Interrupt Line: IRQ16
Interrupt Pin: INTA#
[Features]
Bus Mastering: Enabled
Running At 66 MHz: Not Capable
Fast Back-to-Back Transactions: Not Capable
[Driver Information]
Driver Manufacturer: Intel
Driver Description: Intel(R) 6311ESB/6321ESB PCI Express Upstream Port - 3500
Driver Provider: Microsoft
Driver Version: 6.1.7601.17514
Driver Date: 21-Jun-2006
DeviceInstanceId PCI\VEN_8086&DEV_3500&SUBSYS_01C11028&REV_01\4&34A8240A&0&0010
PCI Express x8 Bus #2
Intel 6311/6321 ESB2 - PCI Express Downstream Port E1 [A-1]
[General Information]
Device Name: Intel 6311/6321 ESB2 - PCI Express Downstream Port E1 [A-1]
Original Device Name: Intel 6311/6321 ESB2 - PCI Express Downstream Port E1 [A-1]
Device Class: PCI-to-PCI Bridge
Revision ID: 1
Bus Number: 2
Device Number: 0
Function Number: 0
PCI Latency Timer: 0
Hardware ID: PCI\VEN_8086&DEV_3510&SUBSYS_00000000&REV_01
[PCI Express]
Version: 1.1
Maximum Link Width: 4x
Current Link Width: 4x
Maximum Link Speed: 2.5 Gb/s
Current Link Speed: 2.5 Gb/s
Device/Port Type: Downstream Port of PCI Express Switch
Slot Implemented: Yes
Hot-Plug: Not Capable
Hot-Plug Surprise: Not Capable
Slot Power Limit: 25.000 W
Active State Power Management (ASPM) Support: L0s
Active State Power Management (ASPM) Status: Disabled
[System Resources]
Interrupt Line: IRQ16
Interrupt Pin: INTA#
[Features]
Bus Mastering: Enabled
Running At 66 MHz: Not Capable
Fast Back-to-Back Transactions: Not Capable
[Driver Information]
Driver Manufacturer: Intel
Driver Description: Intel(R) 6311ESB/6321ESB PCI Express Downstream Port E1 - 3510
Driver Provider: Microsoft
Driver Version: 6.1.7601.17514
Driver Date: 21-Jun-2006
DeviceInstanceId PCI\VEN_8086&DEV_3510&SUBSYS_01C11028&REV_01\5&2ECFD3DD&0&000010
PCI Express x4 Bus #3
Intel 6702PXH PCI Express-to-PCI Bridge A
[General Information]
Device Name: Intel 6702PXH PCI Express-to-PCI Bridge A
Original Device Name: Intel 6702PXH PCI Express-to-PCI Bridge A
Device Class: PCI-to-PCI Bridge
Revision ID: 9
Bus Number: 3
Device Number: 0
Function Number: 0
PCI Latency Timer: 0
Hardware ID: PCI\VEN_8086&DEV_032C&SUBSYS_00000000&REV_09
PCI-X Mode: PCI-X 133
[PCI Express]
Version: 1.1
Maximum Link Width: 8x
Current Link Width: 4x
Maximum Link Speed: 2.5 Gb/s
Current Link Speed: 2.5 Gb/s
Device/Port Type: PCI Express-to-PCI/PCI-X Bridge
Slot Implemented: No
Active State Power Management (ASPM) Support: L0s
Active State Power Management (ASPM) Status: Disabled
[System Resources]
Interrupt Line: N/A
Interrupt Pin: N/A
[Features]
Bus Mastering: Enabled
Running At 66 MHz: Not Capable
Fast Back-to-Back Transactions: Not Capable
SDRAM Maximum Case Temperature (Tcasemax): 95 °C
DT4R4W Delta: 0.8 °C
Thermal Resistance of SDRAM Package from Top (Case) to Ambient: 29.0 °C/W
SDRAM Case Temperature Rise from Ambient due to Activate-Precharge (DT0): 4.0 °C
SDRAM Case Temperature Rise from Ambient due to Precharge/Quiet Standby (DT2N/DT2Q): 1.7 °C
SDRAM Case Temperature Rise from Ambient due to Precharge Power-Down (DT2P): 0.825 °C
SDRAM Case Temperature Rise from Ambient due to Active Standby (DT3N): 2.70 °C
SDRAM Case Temperature Rise from Ambient due to Page Open Burst Read (DT4R): 6.8 °C
SDRAM Case Temperature Rise from Ambient due to Burst Refresh (DT5B): 7.5 °C
SDRAM Case Temperature Rise from Ambient due to Bank Interleave Reads with Auto-Precharge (DT7): 12.5 °C
Thermal Resistance of AMB Package from Top (Case) to Ambient: 21.0 °C/W
AMB Case Temperature Rise from Ambient due to AMB in Idle_0 State (DT AMB Idle_0): 86 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_1 State (DT AMB Idle_1): 107 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_2 State (DT AMB Idle_2): 92 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_1 State (DT AMB Active_1): 145 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_2 State (DT AMB Active_2): 118 °C
AMB Case Temperature Rise from Ambient due to AMB in L0s State (DT AMB L0s): 0 °C
Row: 1 - 1024 MB PC5300F DDR2 FB-DIMM SK Hynix HYMP112F72CP8N3-Y5
[General Module Information]
Module Number: 1
Module Size: 1024 MBytes
Memory Type: DDR2 FB-DIMM
Module Type: FB-DIMM
Error Check/Correction: ECC
Memory Speed: 333.3 MHz (PC5300F)
Module Manufacturer: SK Hynix
Module Part Number: HYMP112F72CP8N3-Y5
Module Revision: 0
Module Serial Number: 689014864
Module Manufacturing Date: Year: 2009, Week: 41
Module Manufacturing Location: 1
SDRAM Manufacturer: SK Hynix
AMB Manufacturer: Numonyx (Intel)
[Module characteristics]
Row Address Bits: 14
Column Address Bits: 10
Number Of Banks: 8
Number Of Ranks: 1
Device Width: 8 bits
Voltage Levels: Power Supply1: 1.5V, Power Supply2: 1.8V
[Module timing]
CAS# Latencies Supported: 4 - 5
Write Recovery Times Supported: 2 - 5
Write Latencies Supported: 2 - 5
Additive Latencies Supported: 0 - 3
Burst Lengths Supported: 4, 8
Terminations Supported: 150, 75, 50 Ohm ODT
Minimum SDRAM Cycle Time (tCKmin): 3.000 ns
Maximum SDRAM Cycle Time (tCKmax): 8.000 ns
Minimum CAS Latency Time (tAAmin): 15.000 ns
Minimum RAS# to CAS# Delay (tRCDmin): 15.000 ns
Minimum Row Precharge Time (tRPmin): 15.000 ns
Minimum Active to Precharge Time (tRASmin): 45.000 ns
Supported Module Timing at 333.3 MHz: 5-5-5-15
Supported Module Timing at 266.7 MHz: 4-4-4-12
Minimum Row Active to Row Active Delay (tRRD): 7.500 ns
Write Recovery Time (tWR): 15.000 ns
Minimum Active to Active/Refresh Time (tRC): 60.000 ns
Minimum Refresh Recovery Time Delay (tRFC): 127.500 ns
Minimum Internal Write to Read Command Delay (tWTR): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTP): 7.500 ns
Average SDRAM Refresh Interval (tREFI): 7.8 us (reduced 0.5x)
Minimum Read-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Write-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Read-to-Write Turnaround Additional Cycles: 1 clocks
Buffer Read Access Time for DDR2-800: 5.500 tCK
Buffer Read Access Time for DDR2-667: 4.000 tCK
Buffer Read Access Time for DDR2-533: 3.500 tCK
[Thermal characteristics]
SDRAM Maximum Case Temperature (Tcasemax): 95 °C
DT4R4W Delta: 0.0 °C
Thermal Resistance of SDRAM Package from Top (Case) to Ambient: 69.5 °C/W
SDRAM Case Temperature Rise from Ambient due to Activate-Precharge (DT0): 9.1 °C
SDRAM Case Temperature Rise from Ambient due to Precharge/Quiet Standby (DT2N/DT2Q): 4.0 °C
SDRAM Case Temperature Rise from Ambient due to Precharge Power-Down (DT2P): 1.320 °C
SDRAM Case Temperature Rise from Ambient due to Active Standby (DT3N): 6.60 °C
SDRAM Case Temperature Rise from Ambient due to Page Open Burst Read (DT4R): 20.0 °C
SDRAM Case Temperature Rise from Ambient due to Burst Refresh (DT5B): 23.0 °C
SDRAM Case Temperature Rise from Ambient due to Bank Interleave Reads with Auto-Precharge (DT7): 24.0 °C
Thermal Resistance of AMB Package from Top (Case) to Ambient: 24.0 °C/W
AMB Case Temperature Rise from Ambient due to AMB in Idle_0 State (DT AMB Idle_0): 96 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_1 State (DT AMB Idle_1): 122 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_2 State (DT AMB Idle_2): 110 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_1 State (DT AMB Active_1): 161 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_2 State (DT AMB Active_2): 127 °C
AMB Case Temperature Rise from Ambient due to AMB in L0s State (DT AMB L0s): 0 °C
Row: 8 - 2048 MB PC5300F DDR2 FB-DIMM Samsung M395T5663QZ4-CE66
[General Module Information]
Module Number: 8
Module Size: 2048 MBytes
Memory Type: DDR2 FB-DIMM
Module Type: FB-DIMM
Error Check/Correction: ECC
Memory Speed: 333.3 MHz (PC5300F)
Module Manufacturer: Samsung
Module Part Number: M395T5663QZ4-CE66
Module Revision: 0
Module Serial Number: 1886094404
Module Manufacturing Date: Year: 2010, Week: 14
Module Manufacturing Location: 1
SDRAM Manufacturer: Samsung
AMB Manufacturer: Unknown
[Module characteristics]
Row Address Bits: 14
Column Address Bits: 10
Number Of Banks: 8
Number Of Ranks: 2
Device Width: 8 bits
Voltage Levels: Power Supply1: 1.5V, Power Supply2: 1.8V
[Module timing]
CAS# Latencies Supported: 3 - 5
Write Recovery Times Supported: 2 - 5
Write Latencies Supported: 2 - 4
Additive Latencies Supported: 0 - 5
Burst Lengths Supported: 4, 8
Terminations Supported: 150, 75, 50 Ohm ODT
Minimum SDRAM Cycle Time (tCKmin): 3.000 ns
Maximum SDRAM Cycle Time (tCKmax): 8.000 ns
Minimum CAS Latency Time (tAAmin): 15.000 ns
Minimum RAS# to CAS# Delay (tRCDmin): 15.000 ns
Minimum Row Precharge Time (tRPmin): 15.000 ns
Minimum Active to Precharge Time (tRASmin): 45.000 ns
Supported Module Timing at 333.3 MHz: 5-5-5-15
Supported Module Timing at 266.7 MHz: 4-4-4-12
Supported Module Timing at 200.0 MHz: 3-3-3-9
Minimum Row Active to Row Active Delay (tRRD): 7.500 ns
Write Recovery Time (tWR): 15.000 ns
Minimum Active to Active/Refresh Time (tRC): 60.000 ns
Minimum Refresh Recovery Time Delay (tRFC): 127.500 ns
Minimum Internal Write to Read Command Delay (tWTR): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTP): 7.500 ns
Average SDRAM Refresh Interval (tREFI): 7.8 us (reduced 0.5x)
Minimum Read-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Write-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Read-to-Write Turnaround Additional Cycles: 1 clocks
Buffer Read Access Time for DDR2-800: 3.500 tCK
Buffer Read Access Time for DDR2-667: 3.333 tCK
Buffer Read Access Time for DDR2-533: 3.167 tCK
[Thermal characteristics]
SDRAM Maximum Case Temperature (Tcasemax): 95 °C
DT4R4W Delta: 0.8 °C
Thermal Resistance of SDRAM Package from Top (Case) to Ambient: 29.0 °C/W
SDRAM Case Temperature Rise from Ambient due to Activate-Precharge (DT0): 4.0 °C
SDRAM Case Temperature Rise from Ambient due to Precharge/Quiet Standby (DT2N/DT2Q): 1.7 °C
SDRAM Case Temperature Rise from Ambient due to Precharge Power-Down (DT2P): 0.825 °C
SDRAM Case Temperature Rise from Ambient due to Active Standby (DT3N): 2.70 °C
SDRAM Case Temperature Rise from Ambient due to Page Open Burst Read (DT4R): 6.8 °C
SDRAM Case Temperature Rise from Ambient due to Burst Refresh (DT5B): 7.5 °C
SDRAM Case Temperature Rise from Ambient due to Bank Interleave Reads with Auto-Precharge (DT7): 12.5 °C
Thermal Resistance of AMB Package from Top (Case) to Ambient: 21.0 °C/W
AMB Case Temperature Rise from Ambient due to AMB in Idle_0 State (DT AMB Idle_0): 86 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_1 State (DT AMB Idle_1): 107 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_2 State (DT AMB Idle_2): 92 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_1 State (DT AMB Active_1): 145 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_2 State (DT AMB Active_2): 118 °C
AMB Case Temperature Rise from Ambient due to AMB in L0s State (DT AMB L0s): 0 °C
Row: 9 - 1024 MB PC5300F DDR2 FB-DIMM Kingston KINGSTON
[General Module Information]
Module Number: 9
Module Size: 1024 MBytes
Memory Type: DDR2 FB-DIMM
Module Type: FB-DIMM
Error Check/Correction: ECC
Memory Speed: 333.3 MHz (PC5300F)
Module Manufacturer: Kingston
Module Part Number: KINGSTON
Module Revision: 12611
Module Serial Number: 3882881593
Module Manufacturing Date: Year: 2010, Week: 28
Module Manufacturing Location: 4
SDRAM Manufacturer: SK Hynix
AMB Manufacturer: Unknown
[Module characteristics]
Row Address Bits: 14
Column Address Bits: 10
Number Of Banks: 8
Number Of Ranks: 1
Device Width: 8 bits
Voltage Levels: Power Supply1: 1.5V, Power Supply2: 1.8V
[Module timing]
CAS# Latencies Supported: 4 - 5
Write Recovery Times Supported: 2 - 5
Write Latencies Supported: 2 - 5
Additive Latencies Supported: 0 - 3
Burst Lengths Supported: 4, 8
Terminations Supported: 150, 75, 50 Ohm ODT
Minimum SDRAM Cycle Time (tCKmin): 3.000 ns
Maximum SDRAM Cycle Time (tCKmax): 8.000 ns
Minimum CAS Latency Time (tAAmin): 15.000 ns
Minimum RAS# to CAS# Delay (tRCDmin): 15.000 ns
Minimum Row Precharge Time (tRPmin): 15.000 ns
Minimum Active to Precharge Time (tRASmin): 45.000 ns
Supported Module Timing at 333.3 MHz: 5-5-5-15
Supported Module Timing at 266.7 MHz: 4-4-4-12
Minimum Row Active to Row Active Delay (tRRD): 7.500 ns
Write Recovery Time (tWR): 15.000 ns
Minimum Active to Active/Refresh Time (tRC): 60.000 ns
Minimum Refresh Recovery Time Delay (tRFC): 127.500 ns
Minimum Internal Write to Read Command Delay (tWTR): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTP): 7.500 ns
Average SDRAM Refresh Interval (tREFI): 7.8 us (reduced 0.5x)
Minimum Read-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Write-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Read-to-Write Turnaround Additional Cycles: 1 clocks
Buffer Read Access Time for DDR2-800: 3.500 tCK
Buffer Read Access Time for DDR2-667: 3.333 tCK
Buffer Read Access Time for DDR2-533: 3.167 tCK
[Thermal characteristics]
SDRAM Maximum Case Temperature (Tcasemax): 95 °C
DT4R4W Delta: 0.8 °C
Thermal Resistance of SDRAM Package from Top (Case) to Ambient: 70.0 °C/W
SDRAM Case Temperature Rise from Ambient due to Activate-Precharge (DT0): 9.4 °C
SDRAM Case Temperature Rise from Ambient due to Precharge/Quiet Standby (DT2N/DT2Q): 4.0 °C
SDRAM Case Temperature Rise from Ambient due to Precharge Power-Down (DT2P): 1.335 °C
SDRAM Case Temperature Rise from Ambient due to Active Standby (DT3N): 6.60 °C
SDRAM Case Temperature Rise from Ambient due to Page Open Burst Read (DT4R): 18.8 °C
SDRAM Case Temperature Rise from Ambient due to Burst Refresh (DT5B): 22.0 °C
SDRAM Case Temperature Rise from Ambient due to Bank Interleave Reads with Auto-Precharge (DT7): 26.0 °C
Thermal Resistance of AMB Package from Top (Case) to Ambient: 21.0 °C/W
AMB Case Temperature Rise from Ambient due to AMB in Idle_0 State (DT AMB Idle_0): 86 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_1 State (DT AMB Idle_1): 107 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_2 State (DT AMB Idle_2): 92 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_1 State (DT AMB Active_1): 145 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_2 State (DT AMB Active_2): 118 °C
AMB Case Temperature Rise from Ambient due to AMB in L0s State (DT AMB L0s): 0 °C
Row: 16 - 1024 MB PC5300F DDR2 FB-DIMM Nanya Technology NT1GT72U8PB1BN-3C
[General Module Information]
Module Number: 16
Module Size: 1024 MBytes
Memory Type: DDR2 FB-DIMM
Module Type: FB-DIMM
Error Check/Correction: ECC
Memory Speed: 333.3 MHz (PC5300F)
Module Manufacturer: Nanya Technology
Module Part Number: NT1GT72U8PB1BN-3C
Module Revision: 0
Module Serial Number: 1107617445
Module Manufacturing Date: Year: 2007, Week: 22
Module Manufacturing Location: 17
SDRAM Manufacturer: Nanya Technology
AMB Manufacturer: Numonyx (Intel)
[Module characteristics]
Row Address Bits: 14
Column Address Bits: 10
Number Of Banks: 4
Number Of Ranks: 2
Device Width: 8 bits
Voltage Levels: Power Supply1: 1.5V, Power Supply2: 1.8V
[Module timing]
CAS# Latencies Supported: 3 - 5
Write Recovery Times Supported: 2 - 5
Write Latencies Supported: 2 - 5
Additive Latencies Supported: 0 - 3
Burst Lengths Supported: 4, 8
Terminations Supported: 150, 75, 50 Ohm ODT
Minimum SDRAM Cycle Time (tCKmin): 3.000 ns
Maximum SDRAM Cycle Time (tCKmax): 8.000 ns
Minimum CAS Latency Time (tAAmin): 15.000 ns
Minimum RAS# to CAS# Delay (tRCDmin): 15.000 ns
Minimum Row Precharge Time (tRPmin): 15.000 ns
Minimum Active to Precharge Time (tRASmin): 45.000 ns
Supported Module Timing at 333.3 MHz: 5-5-5-15
Supported Module Timing at 266.7 MHz: 4-4-4-12
Supported Module Timing at 200.0 MHz: 3-3-3-9
Minimum Row Active to Row Active Delay (tRRD): 7.500 ns
Write Recovery Time (tWR): 15.000 ns
Minimum Active to Active/Refresh Time (tRC): 60.000 ns
Minimum Refresh Recovery Time Delay (tRFC): 105.000 ns
Minimum Internal Write to Read Command Delay (tWTR): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTP): 7.500 ns
Average SDRAM Refresh Interval (tREFI): 7.8 us (reduced 0.5x)
Minimum Read-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Write-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Read-to-Write Turnaround Additional Cycles: 1 clocks
Buffer Read Access Time for DDR2-800: 5.500 tCK
Buffer Read Access Time for DDR2-667: 4.000 tCK
Buffer Read Access Time for DDR2-533: 3.500 tCK
[Thermal characteristics]
SDRAM Maximum Case Temperature (Tcasemax): 95 °C
DT4R4W Delta: 1.2 °C
Thermal Resistance of SDRAM Package from Top (Case) to Ambient: 61.0 °C/W
SDRAM Case Temperature Rise from Ambient due to Activate-Precharge (DT0): 8.8 °C
SDRAM Case Temperature Rise from Ambient due to Precharge/Quiet Standby (DT2N/DT2Q): 4.7 °C
SDRAM Case Temperature Rise from Ambient due to Precharge Power-Down (DT2P): 0.825 °C
SDRAM Case Temperature Rise from Ambient due to Active Standby (DT3N): 5.85 °C
SDRAM Case Temperature Rise from Ambient due to Page Open Burst Read (DT4R): 15.2 °C
SDRAM Case Temperature Rise from Ambient due to Burst Refresh (DT5B): 19.0 °C
SDRAM Case Temperature Rise from Ambient due to Bank Interleave Reads with Auto-Precharge (DT7): 20.0 °C
Thermal Resistance of AMB Package from Top (Case) to Ambient: 24.0 °C/W
AMB Case Temperature Rise from Ambient due to AMB in Idle_0 State (DT AMB Idle_0): 96 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_1 State (DT AMB Idle_1): 122 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_2 State (DT AMB Idle_2): 110 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_1 State (DT AMB Active_1): 161 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_2 State (DT AMB Active_2): 127 °C
AMB Case Temperature Rise from Ambient due to AMB in L0s State (DT AMB L0s): 0 °C
Row: 24 - 1024 MB PC5300F DDR2 FB-DIMM Samsung M395T2953EZ4-CE65
[General Module Information]
Module Number: 24
Module Size: 1024 MBytes
Memory Type: DDR2 FB-DIMM
Module Type: FB-DIMM
Error Check/Correction: ECC
Memory Speed: 333.3 MHz (PC5300F)
Module Manufacturer: Samsung
Module Part Number: M395T2953EZ4-CE65
Module Revision: 0
Module Serial Number: 2653426449
Module Manufacturing Date: Year: 2007, Week: 32
Module Manufacturing Location: 1
SDRAM Manufacturer: Samsung
AMB Manufacturer: Numonyx (Intel)
[Module characteristics]
Row Address Bits: 14
Column Address Bits: 10
Number Of Banks: 4
Number Of Ranks: 2
Device Width: 8 bits
Voltage Levels: Power Supply1: 1.5V, Power Supply2: 1.8V
[Module timing]
CAS# Latencies Supported: 3 - 5
Write Recovery Times Supported: 2 - 5
Write Latencies Supported: 2 - 4
Additive Latencies Supported: 0 - 3
Burst Lengths Supported: 4, 8
Terminations Supported: 150, 75, 50 Ohm ODT
Minimum SDRAM Cycle Time (tCKmin): 3.000 ns
Maximum SDRAM Cycle Time (tCKmax): 8.000 ns
Minimum CAS Latency Time (tAAmin): 15.000 ns
Minimum RAS# to CAS# Delay (tRCDmin): 15.000 ns
Minimum Row Precharge Time (tRPmin): 15.000 ns
Minimum Active to Precharge Time (tRASmin): 45.000 ns
Supported Module Timing at 333.3 MHz: 5-5-5-15
Supported Module Timing at 266.7 MHz: 4-4-4-12
Supported Module Timing at 200.0 MHz: 3-3-3-9
Minimum Row Active to Row Active Delay (tRRD): 7.500 ns
Write Recovery Time (tWR): 15.000 ns
Minimum Active to Active/Refresh Time (tRC): 60.000 ns
Minimum Refresh Recovery Time Delay (tRFC): 105.000 ns
Minimum Internal Write to Read Command Delay (tWTR): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTP): 7.500 ns
Average SDRAM Refresh Interval (tREFI): 7.8 us (reduced 0.5x)
Minimum Read-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Write-to-Read Turnaround Additional Cycles: 0 clocks
Minimum Read-to-Write Turnaround Additional Cycles: 1 clocks
Buffer Read Access Time for DDR2-800: 5.500 tCK
Buffer Read Access Time for DDR2-667: 4.000 tCK
Buffer Read Access Time for DDR2-533: 3.500 tCK
[Thermal characteristics]
SDRAM Maximum Case Temperature (Tcasemax): 95 °C
DT4R4W Delta: 1.6 °C
Thermal Resistance of SDRAM Package from Top (Case) to Ambient: 31.0 °C/W
SDRAM Case Temperature Rise from Ambient due to Activate-Precharge (DT0): 4.3 °C
SDRAM Case Temperature Rise from Ambient due to Precharge/Quiet Standby (DT2N/DT2Q): 2.1 °C
SDRAM Case Temperature Rise from Ambient due to Precharge Power-Down (DT2P): 0.465 °C
SDRAM Case Temperature Rise from Ambient due to Active Standby (DT3N): 3.30 °C
SDRAM Case Temperature Rise from Ambient due to Page Open Burst Read (DT4R): 8.0 °C
SDRAM Case Temperature Rise from Ambient due to Burst Refresh (DT5B): 6.5 °C
SDRAM Case Temperature Rise from Ambient due to Bank Interleave Reads with Auto-Precharge (DT7): 10.5 °C
Thermal Resistance of AMB Package from Top (Case) to Ambient: 24.0 °C/W
AMB Case Temperature Rise from Ambient due to AMB in Idle_0 State (DT AMB Idle_0): 96 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_1 State (DT AMB Idle_1): 122 °C
AMB Case Temperature Rise from Ambient due to AMB in Idle_2 State (DT AMB Idle_2): 110 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_1 State (DT AMB Active_1): 161 °C
AMB Case Temperature Rise from Ambient due to AMB in Active_2 State (DT AMB Active_2): 127 °C
AMB Case Temperature Rise from Ambient due to AMB in L0s State (DT AMB L0s): 0 °C
Bus
PCI Bus #0
Intel 5000X Chipset - Memory Controller Hub / ESI Bridge [B-2]
[General Information]
Device Name: Intel 5000X Chipset - Memory Controller Hub / ESI Bridge [B-2]
Original Device Name: Intel 5000X Chipset - Memory Controller Hub / ESI Bridge [B-2]
Device Class: Host-to-PCI Bridge
Revision ID: 12
Bus Number: 0
Device Number: 0
Function Number: 0
PCI Latency Timer: 0
Hardware ID: PCI\VEN_8086&DEV_25C0&SUBSYS_80868086&REV_12
[PCI Express]
Version: 1.1
Maximum Link Width: 4x
Current Link Width: 4x
Maximum Link Speed: 2.5 Gb/s
Current Link Speed: 2.5 Gb/s
Device/Port Type: Root Port of PCI Express Root Complex
Slot Implemented: No
Active State Power Management (ASPM) Support: L0s
Active State Power Management (ASPM) Status: Disabled
[System Resources]
Interrupt Line: N/A
Interrupt Pin: INTA#
[Features]
Bus Mastering: Enabled
Running At 66 MHz: Not Capable
Fast Back-to-Back Transactions: Not Capable
[Driver Information]
Driver Manufacturer: Intel
Driver Description: Intel(R) 5000X Chipset Memory Controller Hub - 25C0
Driver Provider: Microsoft
Driver Version: 6.1.7601.17514
Driver Date: 21-Jun-2006
DeviceInstanceId PCI\VEN_8086&DEV_25C0&SUBSYS_80868086&REV_12\3&172E68DD&0&00
Intel 5000 Series Chipset - PCI Express x4 Port 2
[General Information]
Device Name: Intel 5000 Series Chipset - PCI Express x4 Port 2
Original Device Name: Intel 5000 Series Chipset - PCI Express x4 Port 2
Device Class: PCI-to-PCI Bridge
Revision ID: 12
Bus Number: 0
Device Number: 2
Function Number: 0
PCI Latency Timer: 0
Hardware ID: PCI\VEN_8086&DEV_25E2&SUBSYS_00000000&REV_12
[PCI Express]
Version: 1.1
Maximum Link Width: 4x
Current Link Width: 4x
Maximum Link Speed: 2.5 Gb/s
Current Link Speed: 2.5 Gb/s
Device/Port Type: Root Port of PCI Express Root Complex
Slot Implemented: No
Active State Power Management (ASPM) Support: L0s
Active State Power Management (ASPM) Status: Disabled
[System Resources]
Interrupt Line: N/A
Interrupt Pin: INTA#
[Features]
Bus Mastering: Enabled
Running At 66 MHz: Not Capable
Fast Back-to-Back Transactions: Not Capable
[Driver Information]
Driver Manufacturer: Intel
Driver Description: Intel(R) 5000 Series Chipset PCI Express x4 Port 2 - 25E2
Driver Provider: Microsoft
Driver Version: 6.1.7601.17514
Driver Date: 21-Jun-2006
DeviceInstanceId PCI\VEN_8086&DEV_25E2&SUBSYS_00000000&REV_12\3&172E68DD&0&10
PCI Express x4 Bus #1
Intel 6311/6321 ESB2 - PCI Express Upstream Port [A-1]
[General Information]
Device Name: Intel 6311/6321 ESB2 - PCI Express Upstream Port [A-1]
Original Device Name: Intel 6311/6321 ESB2 - PCI Express Upstream Port [A-1]
Device Class: PCI-to-PCI Bridge
Revision ID: 1
Bus Number: 1
Device Number: 0
Function Number: 0
PCI Latency Timer: 0
Hardware ID: PCI\VEN_8086&DEV_3500&SUBSYS_00000000&REV_01
[PCI Express]
Version: 1.1
Maximum Link Width: 8x
Current Link Width: 4x
Maximum Link Speed: 2.5 Gb/s
Current Link Speed: 2.5 Gb/s
Device/Port Type: Upstream Port of PCI Express Switch
Slot Implemented: No
Active State Power Management (ASPM) Support: L0s
Active State Power Management (ASPM) Status: Disabled
[System Resources]
Interrupt Line: IRQ16
Interrupt Pin: INTA#
[Features]
Bus Mastering: Enabled
Running At 66 MHz: Not Capable
Fast Back-to-Back Transactions: Not Capable
[Driver Information]
Driver Manufacturer: Intel
Driver Description: Intel(R) 6311ESB/6321ESB PCI Express Upstream Port - 3500
Driver Provider: Microsoft
Driver Version: 6.1.7601.17514
Driver Date: 21-Jun-2006
DeviceInstanceId PCI\VEN_8086&DEV_3500&SUBSYS_01C11028&REV_01\4&34A8240A&0&0010
PCI Express x8 Bus #2
Intel 6311/6321 ESB2 - PCI Express Downstream Port E1 [A-1]
[General Information]
Device Name: Intel 6311/6321 ESB2 - PCI Express Downstream Port E1 [A-1]
Original Device Name: Intel 6311/6321 ESB2 - PCI Express Downstream Port E1 [A-1]
Device Class: PCI-to-PCI Bridge
Revision ID: 1
Bus Number: 2
Device Number: 0
Function Number: 0
PCI Latency Timer: 0
Hardware ID: PCI\VEN_8086&DEV_3510&SUBSYS_00000000&REV_01
[PCI Express]
Version: 1.1
Maximum Link Width: 4x
Current Link Width: 4x
Maximum Link Speed: 2.5 Gb/s
Current Link Speed: 2.5 Gb/s
Device/Port Type: Downstream Port of PCI Express Switch
Slot Implemented: Yes
Hot-Plug: Not Capable
Hot-Plug Surprise: Not Capable
Slot Power Limit: 25.000 W
Active State Power Management (ASPM) Support: L0s
Active State Power Management (ASPM) Status: Disabled
[System Resources]
Interrupt Line: IRQ16
Interrupt Pin: INTA#
[Features]
Bus Mastering: Enabled
Running At 66 MHz: Not Capable
Fast Back-to-Back Transactions: Not Capable
[Driver Information]
Driver Manufacturer: Intel
Driver Description: Intel(R) 6311ESB/6321ESB PCI Express Downstream Port E1 - 3510
Driver Provider: Microsoft
Driver Version: 6.1.7601.17514
Driver Date: 21-Jun-2006
DeviceInstanceId PCI\VEN_8086&DEV_3510&SUBSYS_01C11028&REV_01\5&2ECFD3DD&0&000010
PCI Express x4 Bus #3
Intel 6702PXH PCI Express-to-PCI Bridge A
[General Information]
Device Name: Intel 6702PXH PCI Express-to-PCI Bridge A
Original Device Name: Intel 6702PXH PCI Express-to-PCI Bridge A
Device Class: PCI-to-PCI Bridge
Revision ID: 9
Bus Number: 3
Device Number: 0
Function Number: 0
PCI Latency Timer: 0
Hardware ID: PCI\VEN_8086&DEV_032C&SUBSYS_00000000&REV_09
PCI-X Mode: PCI-X 133
[PCI Express]
Version: 1.1
Maximum Link Width: 8x
Current Link Width: 4x
Maximum Link Speed: 2.5 Gb/s
Current Link Speed: 2.5 Gb/s
Device/Port Type: PCI Express-to-PCI/PCI-X Bridge
Slot Implemented: No
Active State Power Management (ASPM) Support: L0s
Active State Power Management (ASPM) Status: Disabled
[System Resources]
Interrupt Line: N/A
Interrupt Pin: N/A
[Features]
Bus Mastering: Enabled
Running At 66 MHz: Not Capable
Fast Back-to-Back Transactions: Not Capable
Or maybe that was enough
Computer: DELL Precision WorkStation 490
CPU: Intel Xeon 5140 (Woodcrest, G0)
2333 MHz (7.00x333.3) @ 2309 MHz (7.00x330.0)
Motherboard: DELL 0GU083
Chipset: Intel 5000X (Greencreek) + 631x/6321 ESB2
Memory: 8192 MBytes @ 329 MHz, 5.0-5-5-15
- 2048 MB PC5300 DDR2 FB-DIMM - Samsung M395T5663QZ4-CE66
- 1024 MB PC5300 DDR2 FB-DIMM - SK Hynix HYMP112F72CP8N3-Y5
- 2048 MB PC5300 DDR2 FB-DIMM - Samsung M395T5663QZ4-CE66
- 1024 MB PC5300 DDR2 FB-DIMM - Kingston KINGSTON
- 1024 MB PC5300 DDR2 FB-DIMM - Nanya Technology NT1GT72U8PB1BN-3C
- 1024 MB PC5300 DDR2 FB-DIMM - Samsung M395T2953EZ4-CE65
Graphics: NVIDIA Quadro FX 4500 (q348)
NVIDIA Quadro FX 4500, 512 MB GDDR3 SDRAM
Drive: HL-DT-ST DVD+-RW GSA-H53N, DVD+R DL
Drive: SEAGATE ST3300555SS, Disk drive
Sound: Intel 631x/6321 ESB2 - High Definition Audio [A-1]
Network: Broadcom BCM5750A1 NetXtreme Gigabit Ethernet Controller
OS: Microsoft Windows 7 Ultimate (x64)
Computer: DELL Precision WorkStation 490
CPU: Intel Xeon 5140 (Woodcrest, G0)
2333 MHz (7.00x333.3) @ 2309 MHz (7.00x330.0)
Motherboard: DELL 0GU083
Chipset: Intel 5000X (Greencreek) + 631x/6321 ESB2
Memory: 8192 MBytes @ 329 MHz, 5.0-5-5-15
- 2048 MB PC5300 DDR2 FB-DIMM - Samsung M395T5663QZ4-CE66
- 1024 MB PC5300 DDR2 FB-DIMM - SK Hynix HYMP112F72CP8N3-Y5
- 2048 MB PC5300 DDR2 FB-DIMM - Samsung M395T5663QZ4-CE66
- 1024 MB PC5300 DDR2 FB-DIMM - Kingston KINGSTON
- 1024 MB PC5300 DDR2 FB-DIMM - Nanya Technology NT1GT72U8PB1BN-3C
- 1024 MB PC5300 DDR2 FB-DIMM - Samsung M395T2953EZ4-CE65
Graphics: NVIDIA Quadro FX 4500 (q348)
NVIDIA Quadro FX 4500, 512 MB GDDR3 SDRAM
Drive: HL-DT-ST DVD+-RW GSA-H53N, DVD+R DL
Drive: SEAGATE ST3300555SS, Disk drive
Sound: Intel 631x/6321 ESB2 - High Definition Audio [A-1]
Network: Broadcom BCM5750A1 NetXtreme Gigabit Ethernet Controller
OS: Microsoft Windows 7 Ultimate (x64)
- Oct 22, 2013
- 20,885
- 994
- 87,990
The second post is all i need.
The system specs also only shows 6 sticks.Can you check by this info which sticks aren't in that list? If found test these on their own in different slots.Maybe those are faulty or the slots just don't work well.
Maybe the cpu's memory controller needs some extra voltage to be able to use all ram.
The system specs also only shows 6 sticks.Can you check by this info which sticks aren't in that list? If found test these on their own in different slots.Maybe those are faulty or the slots just don't work well.
Maybe the cpu's memory controller needs some extra voltage to be able to use all ram.
Yeah, I tried to place another stick in the 7th slot or move the stick from the 6th to the 7th slot and nothing, seems the slot 7th and 8th are not working properly.
I tried to clean them with a soft brush but nothing still not working.
Any idea how I can test it ?
Thanks
I tried to clean them with a soft brush but nothing still not working.
Any idea how I can test it ?
Thanks
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