Now I don't want anyone to think I'm teaching them what they already know, I also work in the industry supplying heat solutions to aerospace and military customers. Putting a huge amount of deflection on the heat sink can do several things. If you are using a paste and over-deflect the paste will dry or cure quicker over time than usual and will require cleaning and reapplying more frequently. Over compressing does not give you a better connection between the heat sink and chip. The paste will wet both sides sufficiently just by using a small amount and applying the correct amount of deflection. Neither the heat sink base nor the chip have a smooth surface and when they meet there will be air trapped, they are made in their millions and it would not be cost effective to give the heat sink or the chip surface a truly smooth glass like surface. The components on a board are generally soldered but even done automatically by machine this does not make the solder precisely the same height under or around a chip. A small amount of paste, correctly deflected will fill most, but not all, of the gaps. By over deflection you are effectively squeezing out the paste and simply crushing the heat sink into the chip. The heat sink is generally a lot tougher than the chip and will damage the part over time, every time the chip heats up and cools down the static force on it changes slightly leading to a broken component. You are also putting more strain on the pcb than it should take. The points on the board at where the heat sink clips are situated will probably deform and this will easily break any solder connections or circuits around that immediate area. Last point - I promise. When you over deflect and you have to reapply the paste you will find in most cases that the heat sink will not sit exactly as it did when reapplied, and probably won't be level. Maybe look in to using a thermal pad or tape, there are plenty available.