So I cleaned my FX8350 with my stock cooler the other day and applied some Antec Formula 7 Nano Diamond compound. I put my heat sink on the wrong way and could not clip it in so i took it off. When i did i noticed how little the thermal paste spread. Granted the paste may have dried up after not using it for 3 years but just in case i put the tube(closed cap) in some warm water to refresh it. I put a little dot in the center about the size of a grain of rice and the paste only spread to the size of a dime. I dont know if its because the compound is old or because the heat sink was not on the CPU for that long but i was concerned.
Does thermal paste spread with the addition of heat or not?Anyways, i reapplied it without lifting the heat sink (dont want air bubbles) and for the first couple minutes of starting it, my CPU was hitting around 50 during web browsing when its usually around high 20's. Now a day later the temperatures have leveled off a bit to what they used to be so does the heat from a CPU make the thermal paste, more liquidy which allows it to spread a lot more?
Does thermal paste spread with the addition of heat or not?Anyways, i reapplied it without lifting the heat sink (dont want air bubbles) and for the first couple minutes of starting it, my CPU was hitting around 50 during web browsing when its usually around high 20's. Now a day later the temperatures have leveled off a bit to what they used to be so does the heat from a CPU make the thermal paste, more liquidy which allows it to spread a lot more?