Why is there constantly thousands of completely re-designed CPU & Motherboard circuit-board architectures every month!?

ADVANCESSSS

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Why is there constantly thousands of completely re-designed CPU & Motherboard circuit-board architectures every month!?

When you look at Intel's list of CPUs or the motherboards out there, they are all different, the capacitors etc are all placed different etc, some are placed messy, some organized, but there is SO many!

They are always "improving" them. Are they having a hard time figuring out where all those lines on the board should go and where the components should be? I could help further this technology possibly.

Why doesn't Intel for example release only 1 CPU each month that is only MORE faster and "bigger" while smaller and has its components MORE neatly organized?

I hope yous can clear some things up here. To me it looks like a billion cars or tables each with different paint parts shapes and organizations and is just NOT right something is wrong and is not being properly done. That should be clear when you for example see one motherboard with say capacitors at the top right and another motherboard with some in the lower middle.
 
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The CPUs are mostly the same within one generation. AFAIK, Haswell consisted of about four dies: Two core, four core, four core with nice graphics, and the Haswell-E chips with no graphics. Every CPU is just a rebrand of one of those, with a few bits turned on and off, and a different clock speed.

They then put it into a different socket, depending on whether it's desktop, workstation, laptop, or thin laptop.

The bits you're likely looking at are probably bypass capacitors. As long as they're there, it doesn't really matter where they are or which way they face. They're likely placed mostly due to mechanical and routing constraints. Looking pretty is not a high priority.

They are by no means completely redesigned - it's very common...

Ethanh100

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Intel only releases new CPUs about every year. That being said the main improvements that we are seeing now from year to year is efficiency improvements, giving us more performance at lower power draws. There are also some more features that have been coming out such as ddr4 and soon PCIe gen4, but right now we aren't seeing much from Intel because they have no competition from AMD, or anyone else.
 

Aeacus

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As far as MoBos go, Intel is OEM who makes MoBo chipsets.

Let's take Intel's Z170 as an example.
Z170 chipset default specs: http://ark.intel.com/products/90591

After the chipsets are made, Intel sells them to the MoBo manufacturers (to name the few: Asus, ASRock, ECS, MSI, Gigabyte etc). Each MoBo manufacturer takes the Intel's Z170 chipset and makes their own versions of it with different features.

Here's current Z170 lineup at pcpp: http://pcpartpicker.com/products/motherboard/#c=110&sort=a1&page=1

I counted 104 different MoBos with all using the same Intel's Z170 chipset.

If you also put Intel's H110, B150, Q150, H170 and Q170 chipsets into the mix then the final total amount of different MoBos may very well reach 1000. And that just covers only LGA1151 socket that supports Intel's Skylake and future Kaby Lake CPUs.

But keep in mind that there are other CPU sockets as well.
Full Intel CPU socket and MoBo chipset list: https://en.wikipedia.org/wiki/List_of_Intel_chipsets

Last and not least, there is also an AMD who makes their own CPUs, CPU sockets and MoBo chipsets that differ from Intel. If you add up all AMD's different sockets and chipsets to the Intel's lineup then there is your answer about why we have hundreads of thousands different MoBos.
 

ADVANCESSSS

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Yes, but what I'm asking is, if you take only Intel's chip line of say just CPUs, or some other type of circuit board than intel, they pop out new ones often and why why why why why is the NEW one only just a bit faster? Why not BIG improvement? And why do the components keep changing around in the next design etc? Are they STILL trying to find the best place to put the lines n components soldered onto the board and to make em as tight together as possible? If they use a top-down or bottom-up approach and take the problem apart then each next circuit board should LOOK the same and get improved...???

Also Ethanh, since you brought up competition, I want to tell you that I'm a immortalist, and work on a lot of stuff, and technological advancements should not be done only so you can sit back and collect the money, I'm rushing to do as much as I can. Imagine a single system of people like of AIs that control all of Earth saying ok all, no more advancements...no, they will know what and why to do and do it quick dude. It'll get so fast we'll all be immortal soon.
 
The CPUs are mostly the same within one generation. AFAIK, Haswell consisted of about four dies: Two core, four core, four core with nice graphics, and the Haswell-E chips with no graphics. Every CPU is just a rebrand of one of those, with a few bits turned on and off, and a different clock speed.

They then put it into a different socket, depending on whether it's desktop, workstation, laptop, or thin laptop.

The bits you're likely looking at are probably bypass capacitors. As long as they're there, it doesn't really matter where they are or which way they face. They're likely placed mostly due to mechanical and routing constraints. Looking pretty is not a high priority.

They are by no means completely redesigned - it's very common to have a new generation of CPUs that is simply the old generation, but with new names and on a shrunken process node.
 
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ADVANCESSSS

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I agree on that big time.

EDIT: To compare vehicles, we must only look at cars, no trucks. There only needs to be one car.

Even no paint saying its name. That wastes material and adds weight. Laugh but its solid true.