I built my own PC using i-7 6700k and Corsair H-100i cooler. For a year my temperatures were fine. However they began to raise so I decided to reapply Thermal paste (Arctic Silver 5). However since then I have reapplied thermal paste numerous times because the same thing keeps on happenning. The temperatures are great for 2 to 3 days (30C in idle, 70C full load). However after 3 or 4 days of gamint the temperatures rise to 40C or 45C idle and over 85-90C load. Whenever I reopen the PC to add thermal paste (after cleaning the old paste) I notice that my thermal paste has migrated to the sides of the CPU and the middle of the CPU is almost left without any thermal paste. I am very puzzled by why that keeps happening. I noticed little mark on the cooler surface so I am thinking that somehow the thermal paste is affected by that and it dries it out. I have ordered sand paper and am about to try to polish the cooler surface, but I am getting tired of reapplying the paste (probably have done it 8 times by now) and always getting the same result.
Thermal paste migration
- Thread starter marovici
- Start date
- Oct 7, 2009
- 54,079
- 4,750
- 173,390
I would ask that you make sure the cooler is making proper contact.
To do this you're going to need to do a test fit by placing the thermal paste in the center of the CPU IHS
and then mount your AIO cooler.
Make sure that the thumbscrews are tightened as far as your fingers will allow and then remove the cooling assembly to inspect how far the thermal paste has spread across the processor and if there are any dead spots. Lack of any dead spots will look like this:
If you are seeing patches of thermal paste that are untouched then the backplate is either failing of r the motherboard/CPU socket is warping. I must also speculate that the heat from your system might be causing the board to warp. Can also happen due to having too many cables pushing against the motherboard.
Speaking of warp, mind sharing your full system's specs?
To do this you're going to need to do a test fit by placing the thermal paste in the center of the CPU IHS
and then mount your AIO cooler.
Make sure that the thumbscrews are tightened as far as your fingers will allow and then remove the cooling assembly to inspect how far the thermal paste has spread across the processor and if there are any dead spots. Lack of any dead spots will look like this:
If you are seeing patches of thermal paste that are untouched then the backplate is either failing of r the motherboard/CPU socket is warping. I must also speculate that the heat from your system might be causing the board to warp. Can also happen due to having too many cables pushing against the motherboard.
Speaking of warp, mind sharing your full system's specs?
Lutfij :
I would ask that you make sure the cooler is making proper contact.
To do this you're going to need to do a test fit by placing the thermal paste in the center of the CPU IHS
and then mount your AIO cooler.
Make sure that the thumbscrews are tightened as far as your fingers will allow and then remove the cooling assembly to inspect how far the thermal paste has spread across the processor and if there are any dead spots. Lack of any dead spots will look like this:
If you are seeing patches of thermal paste that are untouched then the backplate is either failing of r the motherboard/CPU socket is warping. I must also speculate that the heat from your system might be causing the board to warp. Can also happen due to having too many cables pushing against the motherboard.
Speaking of warp, mind sharing your full system's specs?
To do this you're going to need to do a test fit by placing the thermal paste in the center of the CPU IHS
and then mount your AIO cooler.
Make sure that the thumbscrews are tightened as far as your fingers will allow and then remove the cooling assembly to inspect how far the thermal paste has spread across the processor and if there are any dead spots. Lack of any dead spots will look like this:
If you are seeing patches of thermal paste that are untouched then the backplate is either failing of r the motherboard/CPU socket is warping. I must also speculate that the heat from your system might be causing the board to warp. Can also happen due to having too many cables pushing against the motherboard.
Speaking of warp, mind sharing your full system's specs?
Thanks, I did apply thermal paste with a dot in the center of the CPU. What I am surprised by is the fact that the temps according to AIDA are very low, but only for a few days and then they begin to raise and raise pretty quickly. The system specs are: ASUS ROG Maximus VIII Hero, 16GB RAM, 250GB Samsung 850 SSD, 500GB Samsung 850 SSD, EVGA 980TI, H100i, I-7 6700k, Noctis 450 case. The temperatures have not been high for prolonged periods of time and I saw no indication of excessive motherboard temps.
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