XxXSWEGXxX,
On behalf of Tom's Moderator Team, welcome aboard!
Unfortunately, your Cooler Master Hyper T2 uses the same problematic push-pins as Intel's stock coolers. Since the push-pins are deceivingly tricky to get them inserted completely through the motherboard and securely latched, it's highly likely that your cooler isn't properly seated. This is an all too common problem with push-pin coolers.
This causes poor contact pressure between the cooler and the CPU, resulting in high temperatures in BIOS, as well as in Windows at idle, and especially at 100% workload. You can troubleshoot this problem by pushing firmly on each corner of the cooler for about 30 seconds while watching your Core temperatures. When you see a significant drop, you've found the loose push-pin.
To re-seat a single loose push-pin:
(1) Release the latch mechanism to the retracted clockwise position, then reset it to the counterclockwise position, but do NOT push on it yet.
(2) To get the pin fully inserted through the motherboard, push only on the leg, NOT on the top of the latch.
(3) While holding the leg firmly against the motherboard with one hand, you can now push on the top of the latch with your other hand until the latch clicks.
If you're re-seating the entire cooler:
Be sure to latch the pins across from one another, rather than next to one another. Use an "X" pattern, so as to apply even pressure during installation.
Also, keep in mind that the typical "pea" size methods of applying thermal compound to the surface of the CPU pertains only to coolers with a solid base. Direct touch heat pipe coolers require the thermal compound to be applied to the heat pipes as well as the gaps between. The small edge of a business card makes a good tool to smooth the thermal compound to a thin, flat, nearly transparent layer.
Lastly, keep in mind that unlike your 65 Watt E7500, the Q6600 is a 95 Watt CPU, so if you intend to run it at stock, your cooler should be OK. However, if you intend to overclock, then you'll find that the Hyper T2 won't be capable of preventing Core temperatures from exceeding 80°C at 100% workload, especially with high ambient room temperature.
CT
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