I plan to delid my CPU some time in the future, and replace my compound with either the Thermal Grizzly Conductonaut or CooLaboratory Liquid Ultra.
After replacing the TIM, I plan to use epoxy to bond the IHS to the CPU. But, worried about the fact that the glue may create distance between the IHS and die, I'm afraid that I'll have to reopen it if temps go unpredictably high.
After some research, I heard that liquid metal compounds semi-solidify and keep two surfaces tightly together. Many call this a problem, but to me, it's a fantastic advantage.
If anyone has experience on this, how strong does the metal actually bond?
After replacing the TIM, I plan to use epoxy to bond the IHS to the CPU. But, worried about the fact that the glue may create distance between the IHS and die, I'm afraid that I'll have to reopen it if temps go unpredictably high.
After some research, I heard that liquid metal compounds semi-solidify and keep two surfaces tightly together. Many call this a problem, but to me, it's a fantastic advantage.
If anyone has experience on this, how strong does the metal actually bond?