grandgalaz :
jossrik :
clutchc :
For Intel Processors, I tend to use the
Arctic 5 method. But I've found the line or pea spot works about the same. The theory is to have a film that fills in the microscopic pores of the metal surfaces so that air (poor thermal conductor) isn't present when the parts mate.
That's what I gathered, you technically don't want paste between the heatsink and the processor at all, but you want it where the two don't quite meet up. Air is an insulator. I've had them heatsinks where the heatpipes are just pressed into the heatsink and you need to fill the gaps with paste, but that was a long time ago, not sure what heatsinks look like now in the budget range.
Whichever procedure you follow there will be some uncovered area (a procedure will result more uncovered area than the other and vice versa) where the heatsink and paste "don't quite meet up". Then, what about that uncovered area? There too will be microscopic pores and air in between.
Two things to note. 1st is that there are hot spots on the processor, what you see on top isn't the chip it's the heatspreader and the chip underneath is quite a bit smaller in most cases, you only really need contact where the chip is. This varies from one model to the next so the safe way is to have as much coverage as you can without going over too much. The 2nd note is that if you use non conductive paste, have good pressure, and use the proper amount, the paste will spread over *most* of the heatspreader, with the pea method there's usually just the very corners. With the asterisk method, it will cover the entire heatspreader easily. If you check out Youtube for videos of glass on heatspreader so you can see what covers what you'll see what I mean, I forget what to search for though so you're on your own for this particular research.