Hello, a few days ago i bought an i7 7700k and i was getting temps of 70-75c while playing bf1 at 4.2ghz 1.25v using a corsair h60 aio. I decided to delid using the rockit kit tool. I removed the ihs, cleaned the old crap intel puts in there and cleaned the silicon glue. I went ahead and applied artic mx-4 to the chip then put the ihs on top (without using glue, the retention bracket is holding it down), then applied some mx-4 on top of the ihs to make contact with the pump head. I launched bf1 and i am getting the same results as before the delid. Is this because i didnt use glue to keep the ihs on the chip which makes it move when i close down the retention bracket and potentially spread the thermal compound on the chip?
7700k delid with the same temps as before delid.
- Thread starter jdq1412
- Start date
Solution
superninja12
Glorious
- May 18, 2015
- 11,378
- 56
- 49,140
dont use mx 4 to the ihs , its not made for it !
instead use this : PCPartPicker part list / Price breakdown by merchant
Thermal Compound: Coollaboratory - Liquid Pro 0.15g Thermal Paste ($18.88 @ OutletPC)
Total: $18.88
Prices include shipping, taxes, and discounts when available
Generated by PCPartPicker 2017-10-08 13:10 EDT-0400
instead use this : PCPartPicker part list / Price breakdown by merchant
Thermal Compound: Coollaboratory - Liquid Pro 0.15g Thermal Paste ($18.88 @ OutletPC)
Total: $18.88
Prices include shipping, taxes, and discounts when available
Generated by PCPartPicker 2017-10-08 13:10 EDT-0400
superninja12
Glorious
- May 18, 2015
- 11,378
- 56
- 49,140
No it will not? I never heard about that. If you can find a source that claims that I would be happy to know as well
- Nov 13, 2006
- 6,374
- 279
- 38,240
jdq1412,
Liquid metal TIM (Thermal Interface Material) is corrosive to aluminum, which is used on many Direct Touch Heatpipe coolers to secure the pipes at the cooler's base. Many high-end air coolers instead have a nickel coated solid copper base.
Liquid metal TIM is not corrosive to the Die or the IHS (Integrated Heat Spreader), which is nickel coated copper, including the underside of the IHS that faces the Die. Since the surface of your H-60 is copper, it would not be corroded by liquid metal TIM, however, minor discoloration may be observed after cleaning.
Moreover, typical silicon TIM used between the IHS and cooler will not perform properly when used between the IHS and Die, due to a problem called "pumping" or "pump-out", where the TIM oozes out from between the surfaces due to thermal cycling. The result is that frequent TIM reapplications are needed, because core temperatures gradually increase as the TIM fails over relatively brief periods of time.
Although Intel's TIM has inferior thermal conductivity compared to Indium solder, it's highly resistant to pump-out, as is liquid metal TIM. This is why only liquid metal TIM should be used for delidding.
Additionally, as your IHS moved during latch down, it no doubt smeared the MX4, rendering it less effective. This is why it's recommended that the IHS should be bonded in place, so as to prevent such movement.
Here's a comparison according to thermal conductivity:
Indium - 81.8 W/mk (2nd Generation and earlier processors used Indium solder)
Liquid Metal TIM - Die to IHS:
Thermal Grizzly Conductonaut - 73.0 W/mk (Newest Product)
CoolLaboratory Liquid Ultra - 38.4 W/mk
CoolLaboratory Liquid Pro - 32.6 W/mk
Typical Silicon TIM - Cooler to IHS:
Thermal Grizzly Kryonaut - 12.5 W/mk
Arctic Silver 5 - 9.0 W/mk
Gelid GC Extreme: 8.5 W/mk
Arctic Cooling MX4 - 8.5 W/mk
Silicon Lottery - https://siliconlottery.com/collections/all/products/delid - is a reputable company that tests, bins and sells overclocked, delidded "K" CPU's. They also offer reasonably priced professional delidding services, and give the following figures on how much Core temperatures at 100% workload are typically improved by delidding:
7th Generation ... Kaby Lake X - 12° to 25°C
7th Generation ... Kaby Lake - 12° to 25°C
6th Generation ... Skylake X - 10°C to 20°C
6th Generation ... Skylake - 8°C to 18°C
5th Generation ... Broadwell - 8°C to 18°C
4th Generation ... Devil's Canyon - 7°C to 15°C
4th Generation ... Haswell - 10°C to 25°C
3rd Generation ... Ivy Bridge - 10°C to 25°C
Silicon Lottery's current TIM of choice for delidding is Thermal Grizzly Conductonaut. Prior to using this product, Silicon Lottery used CoolLaboratory Liquid Ultra.
Also, here's a fascinating read: The Truth about CPU Soldering - https://overclocking.guide/the-truth-about-cpu-soldering/
If you're interested in learning more about processor temperatures, please read this Sticky: Intel Temperature Guide - http://www.tomshardware.com/forum/id-1800828/intel-temperature-guide.html
CT
Liquid metal TIM (Thermal Interface Material) is corrosive to aluminum, which is used on many Direct Touch Heatpipe coolers to secure the pipes at the cooler's base. Many high-end air coolers instead have a nickel coated solid copper base.
Liquid metal TIM is not corrosive to the Die or the IHS (Integrated Heat Spreader), which is nickel coated copper, including the underside of the IHS that faces the Die. Since the surface of your H-60 is copper, it would not be corroded by liquid metal TIM, however, minor discoloration may be observed after cleaning.
Moreover, typical silicon TIM used between the IHS and cooler will not perform properly when used between the IHS and Die, due to a problem called "pumping" or "pump-out", where the TIM oozes out from between the surfaces due to thermal cycling. The result is that frequent TIM reapplications are needed, because core temperatures gradually increase as the TIM fails over relatively brief periods of time.
Although Intel's TIM has inferior thermal conductivity compared to Indium solder, it's highly resistant to pump-out, as is liquid metal TIM. This is why only liquid metal TIM should be used for delidding.
Additionally, as your IHS moved during latch down, it no doubt smeared the MX4, rendering it less effective. This is why it's recommended that the IHS should be bonded in place, so as to prevent such movement.
Here's a comparison according to thermal conductivity:
Indium - 81.8 W/mk (2nd Generation and earlier processors used Indium solder)
Liquid Metal TIM - Die to IHS:
Thermal Grizzly Conductonaut - 73.0 W/mk (Newest Product)
CoolLaboratory Liquid Ultra - 38.4 W/mk
CoolLaboratory Liquid Pro - 32.6 W/mk
Typical Silicon TIM - Cooler to IHS:
Thermal Grizzly Kryonaut - 12.5 W/mk
Arctic Silver 5 - 9.0 W/mk
Gelid GC Extreme: 8.5 W/mk
Arctic Cooling MX4 - 8.5 W/mk
Silicon Lottery - https://siliconlottery.com/collections/all/products/delid - is a reputable company that tests, bins and sells overclocked, delidded "K" CPU's. They also offer reasonably priced professional delidding services, and give the following figures on how much Core temperatures at 100% workload are typically improved by delidding:
7th Generation ... Kaby Lake X - 12° to 25°C
7th Generation ... Kaby Lake - 12° to 25°C
6th Generation ... Skylake X - 10°C to 20°C
6th Generation ... Skylake - 8°C to 18°C
5th Generation ... Broadwell - 8°C to 18°C
4th Generation ... Devil's Canyon - 7°C to 15°C
4th Generation ... Haswell - 10°C to 25°C
3rd Generation ... Ivy Bridge - 10°C to 25°C
Silicon Lottery's current TIM of choice for delidding is Thermal Grizzly Conductonaut. Prior to using this product, Silicon Lottery used CoolLaboratory Liquid Ultra.
Also, here's a fascinating read: The Truth about CPU Soldering - https://overclocking.guide/the-truth-about-cpu-soldering/
If you're interested in learning more about processor temperatures, please read this Sticky: Intel Temperature Guide - http://www.tomshardware.com/forum/id-1800828/intel-temperature-guide.html
CT
CompuTronix :
jdq1412,
Liquid metal TIM (Thermal Interface Material) is corrosive to aluminum, which is used on many Direct Touch Heatpipe coolers to secure the pipes at the cooler's base. Many high-end air coolers instead have a nickel coated solid copper base.
Liquid metal TIM is not corrosive to the Die or the IHS (Integrated Heat Spreader), which is nickel coated copper, including the underside of the IHS that faces the Die. Since the surface of your H-60 is copper, it would not be corroded by liquid metal TIM, however, minor discoloration may be observed after cleaning.
Moreover, typical silicon TIM used between the IHS and cooler will not perform properly when used between the IHS and Die, due to a problem called "pumping" or "pump-out", where the TIM oozes out from between the surfaces due to thermal cycling. The result is that frequent TIM reapplications are needed, because core temperatures gradually increase as the TIM fails over relatively brief periods of time.
Although Intel's TIM has inferior thermal conductivity compared to Indium solder, it's highly resistant to pump-out, as is liquid metal TIM. This is why only liquid metal TIM should be used for delidding.
Additionally, as your IHS moved during latch down, it no doubt smeared the MX4, rendering it less effective. This is why it's recommended that the IHS should be bonded in place, so as to prevent such movement.
Here's a comparison according to thermal conductivity:
Indium - 81.8 W/mk (2nd Generation and earlier processors used Indium solder)
Liquid Metal TIM - Die to IHS:
Thermal Grizzly Conductonaut - 73.0 W/mk (Newest Product)
CoolLaboratory Liquid Ultra - 38.4 W/mk
CoolLaboratory Liquid Pro - 32.6 W/mk
Typical Silicon TIM - Cooler to IHS:
Thermal Grizzly Kryonaut - 12.5 W/mk
Arctic Silver 5 - 9.0 W/mk
Gelid GC Extreme: 8.5 W/mk
Arctic Cooling MX4 - 8.5 W/mk
Silicon Lottery - https://siliconlottery.com/collections/all/products/delid - is a reputable company that tests, bins and sells overclocked, delidded "K" CPU's. They also offer reasonably priced professional delidding services, and give the following figures on how much Core temperatures at 100% workload are typically improved by delidding:
7th Generation ... Kaby Lake X - 12° to 25°C
7th Generation ... Kaby Lake - 12° to 25°C
6th Generation ... Skylake X - 10°C to 20°C
6th Generation ... Skylake - 8°C to 18°C
5th Generation ... Broadwell - 8°C to 18°C
4th Generation ... Devil's Canyon - 7°C to 15°C
4th Generation ... Haswell - 10°C to 25°C
3rd Generation ... Ivy Bridge - 10°C to 25°C
Silicon Lottery's current TIM of choice for delidding is Thermal Grizzly Conductonaut. Prior to using this product, Silicon Lottery used CoolLaboratory Liquid Ultra.
Also, here's a fascinating read: The Truth about CPU Soldering - https://overclocking.guide/the-truth-about-cpu-soldering/
If you're interested in learning more about processor temperatures, please read this Sticky: Intel Temperature Guide - http://www.tomshardware.com/forum/id-1800828/intel-temperature-guide.html
CT
Liquid metal TIM (Thermal Interface Material) is corrosive to aluminum, which is used on many Direct Touch Heatpipe coolers to secure the pipes at the cooler's base. Many high-end air coolers instead have a nickel coated solid copper base.
Liquid metal TIM is not corrosive to the Die or the IHS (Integrated Heat Spreader), which is nickel coated copper, including the underside of the IHS that faces the Die. Since the surface of your H-60 is copper, it would not be corroded by liquid metal TIM, however, minor discoloration may be observed after cleaning.
Moreover, typical silicon TIM used between the IHS and cooler will not perform properly when used between the IHS and Die, due to a problem called "pumping" or "pump-out", where the TIM oozes out from between the surfaces due to thermal cycling. The result is that frequent TIM reapplications are needed, because core temperatures gradually increase as the TIM fails over relatively brief periods of time.
Although Intel's TIM has inferior thermal conductivity compared to Indium solder, it's highly resistant to pump-out, as is liquid metal TIM. This is why only liquid metal TIM should be used for delidding.
Additionally, as your IHS moved during latch down, it no doubt smeared the MX4, rendering it less effective. This is why it's recommended that the IHS should be bonded in place, so as to prevent such movement.
Here's a comparison according to thermal conductivity:
Indium - 81.8 W/mk (2nd Generation and earlier processors used Indium solder)
Liquid Metal TIM - Die to IHS:
Thermal Grizzly Conductonaut - 73.0 W/mk (Newest Product)
CoolLaboratory Liquid Ultra - 38.4 W/mk
CoolLaboratory Liquid Pro - 32.6 W/mk
Typical Silicon TIM - Cooler to IHS:
Thermal Grizzly Kryonaut - 12.5 W/mk
Arctic Silver 5 - 9.0 W/mk
Gelid GC Extreme: 8.5 W/mk
Arctic Cooling MX4 - 8.5 W/mk
Silicon Lottery - https://siliconlottery.com/collections/all/products/delid - is a reputable company that tests, bins and sells overclocked, delidded "K" CPU's. They also offer reasonably priced professional delidding services, and give the following figures on how much Core temperatures at 100% workload are typically improved by delidding:
7th Generation ... Kaby Lake X - 12° to 25°C
7th Generation ... Kaby Lake - 12° to 25°C
6th Generation ... Skylake X - 10°C to 20°C
6th Generation ... Skylake - 8°C to 18°C
5th Generation ... Broadwell - 8°C to 18°C
4th Generation ... Devil's Canyon - 7°C to 15°C
4th Generation ... Haswell - 10°C to 25°C
3rd Generation ... Ivy Bridge - 10°C to 25°C
Silicon Lottery's current TIM of choice for delidding is Thermal Grizzly Conductonaut. Prior to using this product, Silicon Lottery used CoolLaboratory Liquid Ultra.
Also, here's a fascinating read: The Truth about CPU Soldering - https://overclocking.guide/the-truth-about-cpu-soldering/
If you're interested in learning more about processor temperatures, please read this Sticky: Intel Temperature Guide - http://www.tomshardware.com/forum/id-1800828/intel-temperature-guide.html
CT
Thanks for all the info. My LM arrives tomorrow and i have already upgraded cooling to h100i v2 which lowered temps to 60c under load at 4.9ghz 1.260v. Hoping to see a big drop in temps once i apply the liquid metal.
- Nov 13, 2006
- 6,374
- 279
- 38,240
Deviations in Core temperatures are normal and expected.
From the Temp Guide:
" ... Intel’s specification for Digital Thermal Sensor (DTS) accuracy is +/- 5°C. This means deviations between the highest and lowest Cores can be up to 10°C. Deviations on processors using Turbo Boost might exceed 10°C by a few degrees ... "
It's recommended that LM needs to be very carefully and evenly applied to both surfaces; the Die and the underside of the IHS, which hopefully you did. If the LM is applied unevenly, then deviations in Core temperatures will be more pronounced.
Core temperatures should be tested using Prime95 Small FFT's, but only with version 26.6 - http://www.mersenneforum.org/showthread.php?t=15504
The reasons why are explained in the Temp Guide in Section 10, and illustrated in Section 11.
CT
From the Temp Guide:
" ... Intel’s specification for Digital Thermal Sensor (DTS) accuracy is +/- 5°C. This means deviations between the highest and lowest Cores can be up to 10°C. Deviations on processors using Turbo Boost might exceed 10°C by a few degrees ... "
It's recommended that LM needs to be very carefully and evenly applied to both surfaces; the Die and the underside of the IHS, which hopefully you did. If the LM is applied unevenly, then deviations in Core temperatures will be more pronounced.
Core temperatures should be tested using Prime95 Small FFT's, but only with version 26.6 - http://www.mersenneforum.org/showthread.php?t=15504
The reasons why are explained in the Temp Guide in Section 10, and illustrated in Section 11.
CT
lumineZ
Honorable
- Jul 25, 2017
- 1,803
- 21
- 13,165
Nothing to worry about, you have just been alittle unlucky with how you did apply the LM.
Mine stay within 2-3 degree celcius IF all cores are being used.
Overall the temps @ 61 celcius with that clock and Vcore are spot on IF you get this temp during a stress test.
During gaming you should see temps in the range of 48 - 55 celcius if your cooler is good enough.
Mine stay within 2-3 degree celcius IF all cores are being used.
Overall the temps @ 61 celcius with that clock and Vcore are spot on IF you get this temp during a stress test.
During gaming you should see temps in the range of 48 - 55 celcius if your cooler is good enough.
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