Worse temps even after delidding (i7 4770K)

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Mac n Cheese

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I recently delidded my cpu and it is still the same. Idle temps are still at the mid 40's and when I stress test it, one core even reaches 100 degrees jesus. The paste I used is the Thermaltake TG2. What did I do wrong? I mean I'm using a Corsair H100i v2 and can't get past 4.4 ghz @ 1.27v without BSOD.
 
Solution
CompuTronix
Mac n Cheese,

When typical silicon TIM is used between the IHS and the Die, it will not perform properly due to a problem called "pumping" or "pump-out", where the TIM oozes out from between the surfaces due to thermal cycling. The result is that frequent TIM reapplications are needed, because core temperatures gradually increase as the TIM fails over relatively brief periods of time.

Although Intel's TIM has inferior thermal conductivity compared to Indium solder, it's highly resistant to pump-out, as is liquid metal TIM. This is why only liquid metal TIM should be used for delidding.

Additionally, if your IHS moved during latch down, it no doubt smeared your TG2, thereby rendering it less effective. This is why...
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Mac n Cheese

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I can hear the pump. I will definitely try to reseat the cooler. One thing to keep in mind is that I did not relid my chip. I'm running it with the IHS held by the motherboard retention clip.
 
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CompuTronix

CompuTronix

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Mac n Cheese,

When typical silicon TIM is used between the IHS and the Die, it will not perform properly due to a problem called "pumping" or "pump-out", where the TIM oozes out from between the surfaces due to thermal cycling. The result is that frequent TIM reapplications are needed, because core temperatures gradually increase as the TIM fails over relatively brief periods of time.

Although Intel's TIM has inferior thermal conductivity compared to Indium solder, it's highly resistant to pump-out, as is liquid metal TIM. This is why only liquid metal TIM should be used for delidding.

Additionally, if your IHS moved during latch down, it no doubt smeared your TG2, thereby rendering it less effective. This is why it's recommended that the IHS should be bonded in place, so as to prevent such movement.

Here's a comparison according to thermal conductivity:

Indium - 81.8 W/mk (2nd Generation and earlier processors used Indium solder)

Liquid Metal TIM - Die to IHS:

Thermal Grizzly Conductonaut - 73.0 W/mk (Newest Product)
CoolLaboratory Liquid Ultra - 38.4 W/mk
CoolLaboratory Liquid Pro - 32.6 W/mk

Typical Silicon TIM - Cooler to IHS:

Thermal Grizzly Kryonaut - 12.5 W/mk
Arctic Silver 5 - 9.0 W/mk
Gelid GC Extreme: 8.5 W/mk
Arctic Cooling MX4 - 8.5 W/mk

Silicon Lottery - https://siliconlottery.com/collections/all/products/delid - is a reputable company that tests, bins and sells overclocked, delidded "K" CPU's. They also offer reasonably priced professional delidding services, and give the following figures on how much Core temperatures at 100% workload are typically improved by delidding:

7th Generation ... Kaby Lake X - 12° to 25°C
7th Generation ... Kaby Lake - 12° to 25°C
6th Generation ... Skylake X - 10°C to 20°C
6th Generation ... Skylake - 8°C to 18°C
5th Generation ... Broadwell - 8°C to 18°C
4th Generation ... Devil's Canyon - 7°C to 15°C
4th Generation ... Haswell - 10°C to 25°C
3rd Generation ... Ivy Bridge - 10°C to 25°C

Silicon Lottery's current TIM of choice for delidding is Thermal Grizzly Conductonaut. Prior to using this product, Silicon Lottery used CoolLaboratory Liquid Ultra.

Also, here's a fascinating read: The Truth about CPU Soldering - https://overclocking.guide/the-truth-about-cpu-soldering/

If you're interested in learning more about processor temperatures, please read this Sticky: Intel Temperature Guide - http://www.tomshardware.com/forum/id-1800828/intel-temperature-guide.html

CT :sol:
 
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Solution
lumineZ

lumineZ

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Jul 25, 2017
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CompuTronix sayd it all.

But I will add one small thing...

TG2 is not ment to be used between the CPU die and IHS.
Same fault people have done using the MX4.

So between CPU die and IHS = Liquid metal
Between IHS and CPU cooler = Regular thermal paste
 
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M

Mac n Cheese

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Jul 17, 2017
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Oh so that's why :(. Is it safe to run without the IHS? Also, may I know where to order the clu liquid metal stuff? It isn't widely available in our country and would like to keep shipping fees minimal :D (I live in the Philippines) Oh yeah I almost forgot. If I were to relid my chip, what seal should I use?
 
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CompuTronix

CompuTronix

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lumineZ

lumineZ

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Jul 25, 2017
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Hard to say since I dont live in Philippines.


But as a sidenote when you are going to relid the IHS.
Make sure not to use to mutch. If you do you will raise the IHS from the CPU die and that also is very bad thermal wise.
Just apply a very very thin layer with a toothpick to the edges of the IHS and and nothing on the PCB.
You can read about this in the link that CompuTronix posted about Intel Temperature Guide
 
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