New build high temps playing games 8700k

Case air flow?

Here's the operating range for Core temperature:

Core temperatures above 85°C aren't recommended.

Core temperatures increase and decrease with Ambient temperature.

Core temperatures below 80°C are preferred.

Q: Which version of Prime95?
Q: What is your Ambient (room) temperature?

You cooler is a mid-low end unit, which is not nearly enough for the 8700K. Without delidding, that processor needs at least high-end big air, or 240mm to 280mm liquid cooling.

CT

i'll ask the obvious question - what are you using to monitor temps? If it's the Asus AI Suite III, try HWMonitor (CPUID)

Reason I ask about case air flow is this " I ran prime95 and with all cores firing at 100% it wasn't getting nearly as high as when I have some games open."

This leads me to believe cpu cooler is pulling in gpu heated air, making matters worse considering how hot these CPU's run.

I Agree as has been pointed out that a better cooler is needed, but without adequate cool air to work with even a NH-D15 will under perform. The case you are using is known to have bad airflow.

What is vcore under load?

Honestly, I'm surprised that your temps are as good as you say they are.

To give you an Idea of the effectiveness of a delid, Noctua NH-D15S and great airflow. I run mine at 5.0 with a core voltage of 1.376, in Prime I get temps of about 73c with an ambient of 21c. With AVX enabled in Prime about 10c higher.

"The CPU core voltage (VCORE) is the power supply voltage supplied to the CPU (which is a digital circuit), GPU, or other device containing a processing core. The amount of power a CPU uses, and thus the amount of heat it dissipates, is the product of this voltage and the current it draws. In modern CPUs, which are made using CMOS, the current is almost proportional to the clock speed, the CPU drawing almost no current between clock cycles."
https://en.wikipedia.org/wiki/CPU_core_voltage

Trying to improve a case that has bad airflow can become a rabbit hole very fast. The front panel on that case is restrictive. Adding more and more powerful fans is what is often recommended. Then modding.

AIO or air coolers have the exact same fresh, cool air requirements. And an AIO isn't going to be better that a quality big air cooler like the D15. Research this, I mean really research!

As a test to really see if airflow is a problem run the same tests under the same conditions, with case side panel off and a house fan blowing into case. If you get a good temp drop on CPU, GPU then you will know.

Don't run Prime 95, use version 26.6. http://www.mersenneforum.org/showthread.php?t=15504

Vcore means Core voltage. Too much Vcore drives Core temperatures high, and too little causes instabilities.

Do not use any Prime95 versions later than 26.6.

2nd through 8th Generation i3, i5 and i7 CPU's have AVX (Advanced Vector Extension) Instruction Sets. Prime95 versions later than 26.6 run AVX code on the CPU's Floating Point Unit (FPU) which causes unrealistic temperatures up to 20°C higher.

While version 26.6 is a 100% workload, later versions such as 29.4 are nearly a 130% workload.

AVX can be disabled in Prime95 versions later than 26.6 by inserting "CpuSupportsAVX=0" into the "local.txt" file in Prime95's folder. However, since Core temperatures will be the same as 26.6, it's easier to just use 26.6.

Download and run 26.6 Small FFT's for just 10 minutes. Your Core temperatures will by much lower.

• Prime95 v26.6 - http://www.mersenneforum.org/showthread.php?t=15504

CT

The TIM Problem

Core i 3rd through 8th Generation processors are very sensitive to small increases in voltage and frequency, and are more difficult to cool than earlier processors, so high-end air or liquid cooling is crucial. Here's why:

(1) The 3rd through 8th Generation processors are "small Die" processors which have significantly less surface area in contact with the Integrated Heat Spreader (IHS) than "large Die" 2nd Generation and earlier processors.

(2) 3rd through 8th Generation processors have more transistors densely packed into their small Die than large Die 2nd Generation and earlier processors.

(3) 3rd through 8th Generation mainstream processors use Thermal Interface Material (TIM) between the Die and IHS. "Indium" solder, which has good thermal conductivity, was instead used in 2nd Generation and earlier mainstream Desktop processors.

Since the material which seals the perimeter of the IHS to the Substrate is slightly too thick, this tends to increase the space between the Die and IHS, which can also cause the TIM to compress unevenly. The effect is increased Core temperatures, with some processors showing wide deviations between Cores, or one Core which runs much hotter than it's neighbors.

This has encouraged some users to "delid" or remove their processor's IHS and replace Intel's TIM with liquid metal TIM, allowing thermal conductivity much closer to Indium solder. Typical results are dramatically lower Core temperatures with less deviation between Cores.

Beware that delidding will void your warranty, and if not performed carefully, can damage or destroy your processor.

Instead of manually delidding by hand, you can safely delid by using a "delidding tool" such as the Rockit 88 - https://rockitcool.myshopify.com/

Silicon Lottery - https://siliconlottery.com/collections/all/products/delid - is a company that tests, bins and sells delidded "K" CPU's. They also offer professional delidding services, so you can simply send in your CPU, and they'll delid it for you.

To illustrate how bad Intel's TIM problem really is, Silicon Lottery gives the following figures on how much Core temperatures at 100% workload are improved by delidding:

8th Generation ... Coffee Lake - 12° to 25°C
7th Generation ... Kaby Lake X - 12° to 25°C
7th Generation ... Kaby Lake - 12° to 25°C
6th Generation ... Skylake X - 7°C to 20°C
6th Generation ... Skylake - 8°C to 18°C
5th Generation ... Broadwell - 8°C to 18°C
4th Generation ... Devil's Canyon - 7°C to 15°C
4th Generation ... Haswell - 10°C to 25°C
3rd Generation ... Ivy Bridge - 10°C to 25°C

Shown below are the thermal characteristics between different Generations of soldered and TIM’d processors:

Core temperatures on earlier processors with Indium solder between the Die and IHS are consistently within 5°C above IHS temperature, which indicates good thermal conductivity. However, Core temperatures on later Generations with TIM between the Die and IHS are up to 25°C above IHS temperature, which indicates relatively poor thermal conductivity and uniformity.

Sloppymop,

Delidding has, by far, the most profound impact on decreasing Core temperatures. Ever since Intel began using TIM with their 3rd Generation Ivy Bridge processors, I've been delidding every i7 and i5 "K" processor in my builds, as well as my personal rigs. The results are always very impressive and convincing.

You might want to consider sending you CPU to Silicon Lottery. They do a great job and warranty their work. You can also have them "bin" your CPU, which means they test it for maximum stable overclock, and provide you with the BIOS settings to do it yourself. Check out their website: Silicon Lottery - https://siliconlottery.com/collections/all/products/delid

CT

Your vcore is pretty high for stock. If this were my computer I would start there while I wait for new cooler.

There are many guides that will explain this, this is the one. I like to recommend its for Kaby Lake. However it covers most of the basics and then some. Its an overclocking guide so keep that in mind, look to this guide to explain some of the settings and what they do. http://edgeup.asus.com/2017/kaby-lake-overclocking-guide/

As a starting point, I would lower vcore to 1.3 and then test for heat improvement. And then stability.

If your stable than you can try to lower core voltage more, once again test for stability.

Prime95 ver. 26.6 small fft to test for heat.

Then prime95 ver, 26.6 blend for system stability.

The next step is to test for AVX stability, the following tests are more realistic than tests like OCCT and Prime 95 with AVX and FMA3.

Realbench and x264 stability test.

They can be found here, http://www.overclock.net/forum/intel-cpus/1621347-kaby-lake-overclocking-guide-statistics.html

This also a guide that I have used, scoll down for an explination on stability testing and links to the tests.

Evo 212 isn't great, but it's not going to account for THAT high of temperatures.

I have a 750D Airflow and a Corsair H115i set to exhaust (as opposed to intake) out of the top of the case and my 8700k runs at 50C tops in games. My Prime95 tops out at about 66C. The H115i is good it aint THAT good. The case airflow is fantastic that's why temps are so low. My 1080 Ti tops out about 60-61C on really big gaming loads and even with that blowing right into the case the CPU manages to stay under 50C for gaming.

I have two front fans for intake, the two top fans for the radiator set to exhaust, and the single fan at the back set to exhaust. They're actually even only set at 700rpm but the case does a great job of moving air more airflow isn't even needed.


I think case airflow is the culprit here.

EDIT: I also have a Seasonic Prime Titanium 850W, at my loads it is producing almost NO heat (its got something like 96% efficiency at 50% load which is what I run it at), you might check your PSU see if it is producing a lot of heat, in a lower airflow case that will contribute to the high CPU temps.