When I bought my 850MV main board and P4, after mounting the heatsink on I noticed that so much pressure was applied to the cpu, that it actually created a bow in the board. where it dips just very slightly. Intel tech support said this is normal, if this bowing ever causes my board to break they better be sending me a new board overnight deliverly.
How much time does intel put not HSF research, this always seems to be the cheapest looking part out of the CPU design and mainboard design.
Should I be concerned ?
How much time does intel put not HSF research, this always seems to be the cheapest looking part out of the CPU design and mainboard design.
Should I be concerned ?