I would like first of all to express my satisfaction as a frequent reader of THG, to the writer of the China Dispatch article concerning the manufacturing procedure of a pc case, and to all members of the THG team that helped in its creation. I have been reading THG articles frequently for quite some time now, and in most cases have found them very helpful and interesting to say the least. But the China Dispatch article has made for me the biggest difference of all. I was, without exaggerating, astonished while reading the contents of the article, as I am too, in the case manufacturing field and yet found myself reading details on the manufacturing procedure that wasn't even aware of. For that, I should once more express my gratitude to all makers of this truly unique work.
Getting to the point now, I'd like to say that I would very much like to obtain all relevant information to the subject of this article and if possible, anything that you may have written or noted down (pictures included) on all 300 manufacturing steps that are mentioned in the article. Such information would be extremely useful and crucial to my work and I would like to thank you in advance for reading this post and replying here in the forum or through pm/email, if you feel that would be a more appropriate way of contacting me.
Glad that you enjoyed the article. It was a tough article to write due to the detail and of course the weather which was in the 90s each day that I was in China.
I enjoyed writing the article and I could not have done it without all of the help from the team at Chenbro.
I am sorry to say that pretty much everything that I had went into the article. I didn't really take any extra pictures or notes on this one as timing was very tight as I wrote the entire thing on the road while in China and on my way back to the US.
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