<font color=blue>ok, smith answered this, sort of, but here is something widely known to any mechanical engineer. In heat transfer between a fluid (air counts too) and a solid (convection), laminar flow is bad. Reason is semi-obvious - with laminar flow, air than has already been heated continues to flow slowly along the surface. Turbulent flow is better. What is less obvious is tht turbulent flow experiences less friction as well.
Anyway, solid to solid heat transfer (conduction) is exact opposite. Absolutely minimumizing the gap/maximizing direct contact is the goal.
If one is using poor heat conductive adhesives, obtaining a mirror smooth finish is can be really helpful as the Aluminum would have a better coefficient of conductive heat transfer. However, if one is using Artic Silver II, the silver paste has a better thermal conductivity level than the Aluminum. Assuming (remember what happens when you assume) you fill the gaps of the heat sink with the paste well enough, spending 3 hours on seeing yourself with the bottom of you heatsink may not be worth it. Besides, just how perfectly flat is the chip?
Best solution is to Lapp some and then use the paste.
<i><font color=blue>on company time....</i>