[steps onto soapbox]
Here is the thing. Like I said before... I am not a fan of peltiers due to the heat disipation problems thus the meltdowns. Why then is Thermaltake looking into this as a solution to use with the public?
What is it that they are trying to do with them? Why the reintroduction of this form of cooling?
I think that with the right design that it could be a viable cooling solution. Now would I still rather have a water or air cooling unit. Most likely. But this could have some promise.
The 0.17C/W is a nice figure at 75W.
Think about it from this direction... As dies get smaller it will continue to become harder to cool them with the conventional cooling methods that we have now. First you have a shrinking surface area. So it is getting harder to disipate the heat of the die across to the heatsink. Secondly you have increasing masses for HSFs on an ever shrinking die. You now have higher chances of damaging that die.
So I think what they are after is getting a way to get more heat off the die, onto a larger surface area, and then onto a HSF combo. Same idea as from the begining. But I think that as the dies shrink in size we will need better ways to get the heat away from them.
Again I am not saying that this is the best soluton but I would like to see some sites review this product. I would love to see Tom, Anand or Kyle put it on any one of their die simulators and crank it up to 125W. See if this thing fails. If it doesn't, then it could be a viable solution now and going forward. Would you not agree? I don't want to pass final judgement on it until I see it in action.
There has to be a reason that they have put it throught the UL, FCC, CE, and VCCI saftey approval process.
[Steps down from soapbox]
Back to you...
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