I'm looking across the boards for anyone with experience breaking the bond between two components that were cured with Arctic Silver Thermal Adhesive bond.
If you have ever attempted to do this, and either succeeded or failed, please post me your details and experience here.
It would be greatly appreciated because I am required to RMA a Radeon that has heatsinks bonded to the mem chips with Arctic Silver Thermal Adhesive, and now need to remove the sinks.
MeTaSpARKs
MeTaSpARKs
If you have ever attempted to do this, and either succeeded or failed, please post me your details and experience here.
It would be greatly appreciated because I am required to RMA a Radeon that has heatsinks bonded to the mem chips with Arctic Silver Thermal Adhesive, and now need to remove the sinks.
MeTaSpARKs
MeTaSpARKs