Archived from groups: alt.comp.periphs.mainboard.asus (
More info?)
"Leythos" <void@nowhere.lan> wrote in message
news:ZyK_d.2205$rL3.2000@fe2.columbus.rr.com...
> On Fri, 18 Mar 2005 23:25:39 +0000, signmeuptoo wrote:
>>
>> Can't be true, too many sites have tested products such as the Arctic
>> Silver and Shin-Etsu MicroSi products to be vastly superior when
>> installed
>> in accordance with proper procedure as posted on the Arctic Silver
>> website
>> and when no fingerprints or other contamination exists.
>>
>> High performance thermal materials often improve over a curing time where
>> they form a type of structural and chemical bond between the CPU and HSF
>> surfaces.
>>
>> One can argue all that they want that all thermal compounds are the same,
>> but too many sites (sorry, I have read them but I have not kept the links
>> to them, do your own research) have "proven" AS and S-E M to be superior,
>> and worth the tiny expenditure that they require.
>
> Actually, since most of them don't dry out in the first year, it's a close
> call for most testing. Sure, they lose some of their gunk, but as thin as
> the layer is (as it should be) it's not that big a difference. Don't
> believe everything you read, do some testing yourself - I have.
>
>> You have to understand that products like Shin-Etsu and Arctic Silver are
>> designed by teams of scientific minds using chemical and other
>> engineering
>> to accomplish the ideal particle composition, particle size, particle
>> variation, and so on. Too many Overclockers are proving to themselves
>> that
>> better results in thermal conductivity can be had through AS or S-E for
>> me
>> to believe that it doesn't make a difference.
>
> I love AS, and I use it a lot, also use the stuff that Intel sends with
> their CPU's in the syringe, it more about properly applying it than the
> small differences in the composition at the two ends - meaning that cheap
> is always low quality and expensive is always high quality, and that cheap
> means less heat transfer and more expensive means better transfer. Now, if
> you have some nice AS5 and apply it wrong it could yield worse results
> than properly applied cheap HSP.
>
I just purchased a new Intel boxed processor and I noticed they no longer
come with a
syringe with thermal paste. There now is a pad of paste on the bottom of
the HSF.
I assume this is ok to use as I did!! Unfortunately the new processor was
DOA and have
to send it back for replacement
Gary
>> ALSO, Cheap thermal compounds like you find at Radio Shack tend to dry up
>> and turn crumbly and cannot hold up to the temps that today's CPUs pass
>> out. So, IMHO, you cannot tell me that I shouldn't use my syringes of
>> both
>> Shin-Etsu MicroSi and Arctic Silver Ceramique. They didn't cost that
>> much
>> and they work fabulous in numerous ways.
>
> I never said you should or should not use anything, in fact, if you read
> my post, you would see that I said that most of them are the same and that
> the only problem is people not applying it properly.
>
> Oh, they only work in one way - to create a better conduction of heat
> between the CPU and the Heat Sink. Thinner is much better as it really
> only needs to fill the micro-grain differences in the machined surfaces,
> if the HS has a uneven surface you should refinish it or get a new one.
>
>
>> On Fri, 18 Mar 2005 14:12:52 GMT, Leythos wrote:
>>
>>> On Fri, 18 Mar 2005 12:52:28 +0000, Ben Pope wrote:
>>>>
>>>> And you can decisively say that 12°C is the improvemnt in only the
>>>> thermal compound?
>>>
>>> I've been doing systems since before the 8086 was invented and using
>>> heat-sinks for several decades. It's my experience that most of the HSP
>>> is
>>> about the same across the board, that it's almost always a difference in
>>> installation procedures that cause variances. Most people don't have a
>>> clue as to how to apply HSP.
>
>
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