Archived from groups: alt.comp.periphs.mainboard.asus (More info?)

I have the P4c800e-Deluxe Mobo w/ P4 3.0 processor. I just installed a
Zalman cnfs7000b to replace the stock HSF and my CPU temp actually rose
2-4 deg C. I used the original arctic silver compaund. I read on the
Arctic Silver site something to the effect that it takes 200 hrs to
reach full benefit. Also on their usage instructions, it said that the
compound only needs to be on the part of the die in the center where the
core is. This is the way I applied it. Is that wrong or as time goes
by will I see a decrease in the temp. Any help greatly appreciated. BTW
, ambient temp is 30 deg C. Case is Coolermaster ATCS bought in 2000 or so.

Archived from groups: alt.comp.periphs.mainboard.asus (More info?)

In article <%_HSe.9547$qY1.8201@bgtnsc04-news.ops.worldnet.att.net>, Fuzzy
<vader@star_wars.com> wrote:

> I have the P4c800e-Deluxe Mobo w/ P4 3.0 processor. I just installed a
> Zalman cnfs7000b to replace the stock HSF and my CPU temp actually rose
> 2-4 deg C. I used the original arctic silver compaund. I read on the
> Arctic Silver site something to the effect that it takes 200 hrs to
> reach full benefit. Also on their usage instructions, it said that the
> compound only needs to be on the part of the die in the center where the
> core is. This is the way I applied it. Is that wrong or as time goes
> by will I see a decrease in the temp. Any help greatly appreciated. BTW
> , ambient temp is 30 deg C. Case is Coolermaster ATCS bought in 2000 or
> so.

Examine the bottom of the Zalman 7000 and the top of your processor.
The heatsink compound should be used to fill any air gap that forms
when the two surfaces mate. The more surface area engaged in heat
transfer, the more effective the Zalman will be.

In terms of the quantity of compound to apply, first apply a quantity
the size of a pin head, to the processor. Press the heatsink into
place, and see how much that quantity of compound spreads. You want
enough compound, so that it coats the surface, plus just a little
more, so that the visible gap between the two surfaces is wetted
with compound. You don't want so much, that it squirts out when
you crank up the screws on the 7000. Priming the surfaces with
compound first, helps to fill the interstices with compound.

The purpose of the thermal compound, is to displace air, not
build an "Oreo cookie". If the thermal grease is too thick,
that will reduce the effectiveness of the heatsink. In order
to displace the air, you need enough compound so that the
gap is filled, but not overfilled.

In terms of the pressure applied by the 7000, you'll find the
screws tighten pretty easily, until the last couple of turns.
It is during those turns, that the motherboard is deflected
(bent) by the compression forces. A little force is necessary,
to ensure contact between the surfaces, and in the event the
computer receives a small mechanical shock, that the surfaces
don't separate. Thermal compound requires less retention force
than is used for a thermal pad, and that is why the Zalman
doesn't have to apply as much force as a Intel retail HSF.

For the 7000 to be effective, you do need a good flow of air
through the case. One poster here, suggested he got quite
an improvement, by using a bigger computer case, that had
more room between the 7000 HSF and the PSU. I got some improvement
on my Antec Sonata, by removing a restrictive plastic grill from
the front of the computer case. Some simple techniques like
that can buy you 5-7C improvement. I recommend at least
one exhaust fan on the back of the case, and one inlet fan
on the front of the case, which roughly balances the CFMs
entering and leaving the computer case. The PSU fan
doesn't count as a fan, due to its insignificant
contribution.

HTH,
Paul