I keep hearing these horror stories about people trying to get HSF off and pulling there CPU's out. I'm starting to get a little worried, as I mentioned in the folding thread I am getting AS5 and a new HSF for comp in sig. I've read you should max your CPU to make it hot then turn it off and remove the HSF. Is this not right or are people not looking before they do this?
From personal experience I had an HP (the 2.4 Celery) that sat as a doorstop (best use for an Intel, relax personal opinion) for 3 months and the HSF came off with no effort, so I'm pretty sure my HSF will come off fine.
Just wondering whats up with all the yanked chips?
EDIT: on an unrelated subject I just noticed my HP 2.4 celery had 2 of the 4 wires on the 4pin line cut. At first I thought "Damn kitties" but its too clean and appears to be cut with wire snips anyone with an HP/Compaq celery from 4Q 2003/ 1Q 2004 seen something similar??? (it runs 10C cooler since I spliced the wires).
From personal experience I had an HP (the 2.4 Celery) that sat as a doorstop (best use for an Intel, relax personal opinion) for 3 months and the HSF came off with no effort, so I'm pretty sure my HSF will come off fine.
Just wondering whats up with all the yanked chips?
EDIT: on an unrelated subject I just noticed my HP 2.4 celery had 2 of the 4 wires on the 4pin line cut. At first I thought "Damn kitties" but its too clean and appears to be cut with wire snips anyone with an HP/Compaq celery from 4Q 2003/ 1Q 2004 seen something similar??? (it runs 10C cooler since I spliced the wires).