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Samsung Develops 16-Chip Stack Package Memory

  • Memory
  • Chip
  • Samsung
Last response: in Memory
November 4, 2006 5:22:34 PM

These chips are made with frickin' laser beams

Samsung Electronics announced that it has developed the industry’s first process to enable production of a 16-chip multi-chip package (MCP) of memory. Samsung’s new 16-chip MCP technology, when applied to 8Gb NAND flash chips, can enable up to a 16GB MCP solution.

Advanced multi-chip package technology requires a combination of key processes such as wafer thinning, redistribution layer, chip sawing and wire bonding.

To increase the number of chips stacked vertically, Samsung introduced wafer-thinning technology that eliminates 24/25th of the thickness of each fabricated wafer to reduce the overall thickness to only 30-microns. This is just 65 percent the thickness of the 45-micron 10-chip MCP wafer Samsung developed in 2005 and similar to the size a human cell, which measures 20 to 30 microns.

Interesting development in the solid state memory field.

More about : samsung develops chip stack package memory

November 4, 2006 5:43:53 PM

The upcoming competitor for Micron D9s?
November 4, 2006 8:24:17 PM

Could just be.
November 4, 2006 8:58:30 PM

Well just like a double whopper hamburger for an ever more performance hungry consumers. I guess this is very useful for Vista since it uses 64-bit and is more ram hog.
a b } Memory
November 4, 2006 9:01:12 PM

aren't samsung developing the 'fusion' HDD's look like this is a precursor technology for that.
November 4, 2006 9:27:56 PM

Could just be.

Hehe, itll be fun to hunt down more than one type of chips!