Samsung Develops 16-Chip Stack Package Memory

[dasickninja]

These chips are made with frickin' laser beams

Samsung Electronics announced that it has developed the industry’s first process to enable production of a 16-chip multi-chip package (MCP) of memory. Samsung’s new 16-chip MCP technology, when applied to 8Gb NAND flash chips, can enable up to a 16GB MCP solution.

Advanced multi-chip package technology requires a combination of key processes such as wafer thinning, redistribution layer, chip sawing and wire bonding.

To increase the number of chips stacked vertically, Samsung introduced wafer-thinning technology that eliminates 24/25th of the thickness of each fabricated wafer to reduce the overall thickness to only 30-microns. This is just 65 percent the thickness of the 45-micron 10-chip MCP wafer Samsung developed in 2005 and similar to the size a human cell, which measures 20 to 30 microns.

http://dailytech.com/article.aspx?newsid=4797

Interesting development in the solid state memory field.

 

[rwaritsdario]

The upcoming competitor for Micron D9s?

 

[dasickninja]

Could just be.

 

[chuckshissle]

Well just like a double whopper hamburger for an ever more performance hungry consumers. I guess this is very useful for Vista since it uses 64-bit and is more ram hog.

 

[13thmonkey]

aren't samsung developing the 'fusion' HDD's look like this is a precursor technology for that.

 

[rwaritsdario]

Could just be.

Hehe, itll be fun to hunt down more than one type of chips!