Samsung Electronics announced that it has developed the industry’s first process to enable production of a 16-chip multi-chip package (MCP) of memory. Samsung’s new 16-chip MCP technology, when applied to 8Gb NAND flash chips, can enable up to a 16GB MCP solution.
Advanced multi-chip package technology requires a combination of key processes such as wafer thinning, redistribution layer, chip sawing and wire bonding.
To increase the number of chips stacked vertically, Samsung introduced wafer-thinning technology that eliminates 24/25th of the thickness of each fabricated wafer to reduce the overall thickness to only 30-microns. This is just 65 percent the thickness of the 45-micron 10-chip MCP wafer Samsung developed in 2005 and similar to the size a human cell, which measures 20 to 30 microns.