Which thermal paste

If its for the stock hsf then you should use the stock stuff that comes pre-applied to the bottom of the hsf, it works better then other paste when used with the stock cooler.

No it doesnt, that is complete false. It actually performs SEVERAL degrees over AS5 or Ceramique.

@theOP:
Since you arent lapping either of them would work fine. Ceramique would be better than AS5 but not by a important margin (~1c-0.5c)

I am planning on oc a E6400 to around 3.0 - 3.2ghz. If i use the ceramique with the stock hs fan do u think it will be ok. The case is an ANtec 900

Both are good and doesn't have big difference. Just make sure you have good paper thin uniform layer for optimum heat transfer.

Dario knows nothing about thermal paste...

For 400Mhz FSB youll need an aftermarket HSF if you want comfortable temps. You can get a ACF7 that comes with TX-1 pre-applied (pretty much the same as Ceramique) or a Hyper TX or a Hyper 6+ (sale on the egg), any of them for $30.

They might not catch the obivious sarcasm and get confused...

Was giving you half an hour to respond and if no dice, edit the post and say you are a god among men.

We can still pretend I didnt reply  

The next question that should be asked (even though I am sure it has been asked in other threads)... which application method should people use for thermal paste, the blob or the spread?

why use high end thermal paste on a stock heatsink?
if using the stock heatsink, use the thermal pad on it,
if using aftermarket cooler, you can use both artic silver or ceramic.
if you want to overclock, a aftermarket cooler is recommended.
succes

For single core CPU use the blurb as its the easiest and most effective (even for anything if youre lazy/non-skilled).
But for a C2D use a credit card of something to spread it, dont mind the edges too much as theyll get their share once the HSF is in its place.