Hi - I have a strange question, I suppose, about improving the Scythe Ninja's heat transfer ability from the CPU contact plate to the heat pipes.
Looking at the close up pic I took -
I have indicated with red 4 arrows, spaces between the 3 heatpipes, under the CPU contact plate. If the Ninja is viewed from 90degree to this angle, ie. side on this, there are also several gaps between the other 3 heatpipes that sit on the 3 that touch the plate.
If I understand the science correctly, heat is transferred better through a solid block of copper than it is through air, yet the heatpipes actually have only a small amount of contact area with the copper contact plate and the aluminium heatsink on the other side. A large proportion of the heatpipe surface area is exposed to the air, in the confined spaces between the heatsink and the contact plate.
I am thinking that this heatpipe enclosure should be fully filled with heat transferring material, in order to make it more efficient. Since I can't melt copper and pour it in the spaces, I wonder if filling the spaces with thermal compound will improve the heat transfer capability of the heatpipes?
cheers,
Jason
Looking at the close up pic I took -
I have indicated with red 4 arrows, spaces between the 3 heatpipes, under the CPU contact plate. If the Ninja is viewed from 90degree to this angle, ie. side on this, there are also several gaps between the other 3 heatpipes that sit on the 3 that touch the plate.
If I understand the science correctly, heat is transferred better through a solid block of copper than it is through air, yet the heatpipes actually have only a small amount of contact area with the copper contact plate and the aluminium heatsink on the other side. A large proportion of the heatpipe surface area is exposed to the air, in the confined spaces between the heatsink and the contact plate.
I am thinking that this heatpipe enclosure should be fully filled with heat transferring material, in order to make it more efficient. Since I can't melt copper and pour it in the spaces, I wonder if filling the spaces with thermal compound will improve the heat transfer capability of the heatpipes?
cheers,
Jason