IBM doubles CPU cooling capabilities

[sweetpants]

I wasn't sure if this had been posted before but I thought I would post it, tis a very good read

http://arstechnica.com/news.ars/post/20070325-ibm-doubles-cpu-cooling-capabilities-with-simple-manufacturing-change.html

 

[apt403]

That Ars article hasnt been posted before as far as I know, but the article on IBM's site has.

 

[sweetpants]

That Ars article hasnt been posted before as far as I know, but the article on IBM's site has.

My bad, oh well... If anyone wants to take a gander have at it

 

[1Tanker]

I wasn't sure if this had been posted before but I thought I would post it, tis a very good read

Interesting]http://arstechnica.com/news.ars/post/20070325-ibm-doubles-cpu-cooling-capabilities-with-simple-manufacturing-change.html

Interesting idea, but by adding "more" trenches(areas to be filled with thermal-paste), i would have thought the efficiency would go down....as they're relying more on the TIM. If you have a "groove", the groove IMO would fill with more thermal paste.... and the thicker it is, the less heat it would conduct away from the IHS. Does anyone else feel this way, or am i looking at it from the wrong perspective? :|

 

[sweetpants]

I wasn't sure if this had been posted before but I thought I would post it, tis a very good read

Interesting]http://arstechnica.com/news.ars/post/20070325-ibm-doubles-cpu-cooling-capabilities-with-simple-manufacturing-change.html

Interesting idea, but by adding "more" trenches(areas to be filled with thermal-paste), i would have thought the efficiency would go down....as they're relying more on the TIM. If you have a "groove", the groove IMO would fill with more thermal paste.... and the thicker it is, the less heat it would conduct away from the IHS. Does anyone else feel this way, or am i looking at it from the wrong perspective? :|

That's what I was looking at it... but I think what it's supposed to do is keep the the very small peices of metal from clumping together, instead of making the magical cross jobby.

 

[CompTIA_Rep]

What happened to the idea of laser etching metal on a nano-scale turning it 1.) black, and 2.) increasing surface area which increases heat dissipation?