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Assistance with final offsets and tweaks please

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 Thread : Assistance with final offsets and tweaks please
 
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Ambient = 22C
Chipset = 965P
C2D = E4300
CPU Cooler = Scythe Andy Samurai Master (1500rpm)
Frequency = 9x333 = 2987.9 MHz
Load = TAT 100% load both cores
Motherboard = Gigabyte GA-965P-DS3 Ver. 2
Vcore = 1.35v max 1.325v as tested

Offset of +15C applied to Core0 and Core1
Temp 2, no offset applied
Temp 3 reads -2C (but it always reads this and even if I drop the room temp down to 18C and all other temps drop it doesn't change) Ambient temp was derived with a regular thermometer at fan inlet on side panel.

Idle: Case Cover OFF (Case Cover On)
TAT
CPU0 48C (50C)
CPU1 45C (48C)

SpeedFan:
Temp2 24C (28C)
Core0 42C (44C)
Core1 39C (42C)

Core Temp 0.95
Core0 42C (45C)
Core1 39C (43C)

100% Load: All these readings are with the Case Cover On
TAT
CPU0 70C
CPU1 68C

SpeedFan:
Temp2 57C
Core0 69C
Core1 67C

Core Temp 0.95
Core0 70C
Core1 68C

Points of interest. Temps rise almost 8C when I put the side cover on. The Fan inlet for the CPU fan is only about 80mm so the 12cm Scythe fan is partially obstructed. I have the fan running at 1500 rpm (max)

Should I / would enlarging the fan inlet opening address this ?

What is considered a normal temperature differential between cores ? (I am seeing peaks of 6-8C difference with Core0 being hotter)

Did I overshoot the offset in speedfan considering the discrepancy in readings (see cover off image)?

Have a reached a point that I should consider this done and settle in at this clocking and voltage?

Any other suggestions?


Case Cover OFF @ 100% Load:
http://i129.photobucket.com/albums/p227/wchp/CPUScytheHeatSink.jpg

Case Cover On @ 100% Load:
http://i129.photobucket.com/albums/p227/wchp/CPUSchtheWithCoverOn.jpg

Case Cover On @ Idle (almost 9-11% util)
http://i129.photobucket.com/albums/p227/wchp/CPUScytheCaseCoverOn.jpg

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wchp, sorry I wasn't able to respond to this problem from your PM and previous 2 threads. Every time I started an answer I was interupted by annoyances like attending to my profession, and sometimes my C2D temperature help desk became overwhelmingly busy. Just bad timing on my behalf, so let's get on with it and analyze your temps...

Quote :

Ambient = 22C inlet
Chipset = 965P
C2D = E4300
CPU Cooler = Scythe Andy Samurai Master (Max rpm)
Frequency = 3.0 GHz
Load = TAT 100%
Motherboard = Gigabyte GA-965P-DS3 Ver. 2
Vcore = 1.35v

Offset of +15C applied to Core0 and Core1
Temp 2, no offset applied

Idle: Cover On
TAT 50C

SpeedFan:
Temp2 28C
Core 44C

Core Temp 45C

Load: Cover On
TAT 70C

SpeedFan:
Temp2 57C
Core 69C

Core Temp 70C

Temps rise almost 8C side cover on.

Should I / would enlarging the fan inlet opening address this ?



Obviously you have some cooling work to do on your case. My case is completely sealed, so that other than very small leaks, air has only 1 way in through the single 120mm intake, and 3 ways out; through the PSU, the 2 X 60mm case exhaust, and the graphics card exhaust. Cover off - temps increase, cover on - temps decrease, so cooling is excellent. Even with the graphics fan at 100%, there's always a slight positive pressure inside the case.

Quote :

What is considered a normal temperature differential between cores ? (I am seeing peaks of 6-8C difference with Core0 being hotter)



From the Guide:

Quote :

Troubleshooting

(B) Offsets between Core 0 / Core 1 of ~ 3c are normal.



If your core offsets are noticed at an unbalanced semi-idle, then it's of no concern.

Quote :

Did I overshoot the offset in speedfan considering the discrepancy in readings (see cover off image)?



No, you've tweaked it correctly.

Quote :

Have a reached a point that I should consider this done and settle in at this clocking and voltage?



If your system will be in a relatively controlled environment during the summer months, then yes. If not, then I recommend that you follow through with improving your case cooling. Also, check your CPU for flatness, since your Delta is borderline spec, and there are many E4300's out there being reported with concave Integrated Heat Spreaders. If this is the situation, then lapping may be required. Between case cooling and lapping, you may be able to reach 3.2 Ghz with good temps.

Hope this helps, and again, sorry for the delay in getting around to you.

Comp 8)


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