$8.00 HDTV receiver chip! Casper?

Archived from groups: alt.tv.tech.hdtv (More info?)

This chip is rumored to have "Casper" technology. Does anyone out
there know anything of significance about this chip? Is so, please
tell us. Bob?

IB
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http://www.st.com/stonline/press/n [...] p1568h.htm

Single chip demodulator supports ATSC and cable standards, and
integrates OOB tuner for high-end 'cable ready' digital TVs

Geneva, January 6, 2005 - STMicroelectronics (NYSE: STM), one of the
world's leading suppliers of System-on-Chip (SoC) solutions for digital
TV and the largest supplier of silicon chips for set-top boxes*, has
introduced a single-chip, fully integrated digital demodulator - the
STV0370 - which is designed to be the front-end device in advanced
interactive cable-ready digital TV receivers, and in terrestrial and
cable set-top boxes (STBs) in the USA.

The new multistandard chip supports ATSC (Advanced Television Systems
Committee) standard A/53 Annex D (8VSB2) for use in digital terrestrial
receivers, as well as the ITU-T J.83/B (US Cable) specification for
cable TV. In addition its support for downstream interactive OOB (Out
of Band) QPSK modulation and fully integrated superheterodyne down
conversion tuner, which eliminates the need for external OOB tuner
circuitry, will allow TV receivers that use the chip to be labeled
'digital cable ready' under FCC (Federal Communications Commission)
regulations.

Combining this cost-effective digital demodulator with ST's
industry-leading STi7710 STB decoder - a highly-integrated HDTV (High
Definition TV) solution which implements HDCP security for its DVI/HDMI
display interfaces, and features on-chip AAC audio and a hi-speed USB
interface - creates for manufacturers the lowest cost platform
available on the market which is able to meet the requirements of
multiple high definition (HD) Digital TV standards worldwide.

"The STV0370 is ST market best in class HD demodulator designed for the
US HDTV applications, enabling NIM manufacturer and STB makers the
ability to cost reduce their system while giving viewers the advanced
features they now expect as standard within the new fast growing HD
market" said Armando Caltabiano, Retail Multimedia and Satellite
Division General Manager. The STV0370 and STi7710 US TV platform is
likely to enjoy the same success that the STV0361 plus STi5518
combination have achieved in European DVB-T with current 92 per-cent
market share."

The chip is extremely robust against multi-path signals and echoes,
offering enhanced indoor and outdoor antenna reception. It supports the
CEA Antenna Control Interface Standard (EIA/CEA-909, parts A and B)
which allows viewers to use Smart Antenna technology to optimize
reception by electronically adjusting the antenna gain, polarization,
and beam direction, rather than by physical positional adjustment.

For easy control by system software the STV0370 is managed through a
2-wire I2C interface. Its high level of integration minimizes overall
parts and assembly costs for manufacturers; on-chip features include
high-performance 10-bit and 8-bit analog to digital converters (ADCs),
integrated SRAM for byte interleave processing so that no external
memory is required, and dedicated I2C repeaters for tuner control to
improve RF performance and increase digital noise immunity.

The new chip is produced using ST's state-of-the-art 90nm process
technology, ensuring lower cost through the use of a smaller sized die,
and reduced power consumption. It is supplied in a low-cost, small
footprint LQFP 128-pin package with exposed paddle, and is available
now in sample quantities. Full production of the device, priced at
US$8.00 for large volumes, is planned for Q1 2005.

About STMicroelectronics

STMicroelectronics is a global leader in developing and delivering
semiconductor solutions across the spectrum of microelectronics
applications. An unrivalled combination of silicon and system
expertise, manufacturing strength, Intellectual Property (IP) portfolio
and strategic partners positions the Company at the forefront of
System-on-Chip (SoC) technology and its products play a key role in
enabling today's convergence markets. The Company's shares are traded
on the New York Stock Exchange, on Euronext Paris and on the Milan
Stock Exchange. In 2003, the Company's net revenues were $7.24 billion
and net earnings were $253 million. Further information on ST can be
found at www.st.com.

1 IDC Worldwide Digital Set-Top-Box Semiconductor Vendor Shares -
November 2004
2 8VSB: 8-level Vestigial Sideband Modulation, the RF modulation format
approved by the FCC for the ATSC HDTV digital television standard.