Looks good to me, your ambient temps may impact the core temp. Also, you have a low Upper VID chip, that means your heat will be a little warm off the top. (Or can be.)
Since you lapped the TRUE, now all you need to do it give it a few small twists while its mounted on the chip. (Or at least my TRUE when fully attached can move a bit.) Then next time you pull the heat sink off you can look for corner scratches on the heatsink.
Usually the q6x00 series has raised corners. I even read the intel thermal solutions guide for manufactures. Intel relies on the weight of the heat sink and the force of the 775 socket to "warp" the chip into some semblance of flatness!
So when ya pull it off, since it was lapped, you'll easily be able to tell if the shape of the chip is raised on a corner or more. (usually 2 corners, one side, is raised.) And it takes a while of lapping to correct this flaw in the IHS design.
Oh, plan on OCing the thing?
--Lupi