"Now if the 4870x2 was actually notably faster than the 280 for about the same price, then I might even take a chance on it. However, that won't be the case."-robx46
Short answer, no
The heat would cause the very delicate joins within the CPU to melt/fuse (this isn't even counting the damage to the silicon that you could do) However if you are looking for a permanent solution for attaching a HSF to the CPU, look at this: http://www.newegg.com/Product/Prod [...] 6835100005 Thermal Adhesive.
2) Yes I believe you could but it would have to be a somewhat mild solder (not with a propane torch!). Maybe a tube of multicore electronics solder? You would have to get some thermal paste between the cpu and heatsink though for it to be functional, and I am not sure how that part would work.
Short answer, no
The heat would cause the very delicate joins within the CPU to melt/fuse (this isn't even counting the damage to the silicon that you could do) However if you are looking for a permanent solution for attaching a HSF to the CPU, look at this: http://www.newegg.com/Product/Prod [...] 6835100005 Thermal Adhesive.
Damaging silicon is a rather hard thing to do. You can break it, but it needs extreme heat to actually damage the structure of the silicon itself, you would melt the metal inside the silicon long before you melted the silicon itself. To head off any arguments on this point. I am a silicon crystal grower, and currently work for Solarworld where we make silicon crystals for solar panels. We have to heat the silicon to approximately 1300 degrees celcius in order to make it molten. We use the charkozsky method for making our crystals that are 155 mm in diameter. We have the capability of making processor grade silicon crystals, but there is more money in the Solar side of things these days then the processor side. Anywho hope that clarifies any misconceptions.
2) Yes I believe you could but it would have to be a somewhat mild solder (not with a propane torch!). Maybe a tube of multicore electronics solder? You would have to get some thermal paste between the cpu and heatsink though for it to be functional, and I am not sure how that part would work.
Sorry it would not work, both surfaces have to be at solder temp for it to bond...and the very lowest solder melt's at...ready...
183 °C or 361.4 F
Some of us soldered for a living, and were taught by an aerospace engineer....and ain't no way to be delicate when you'd have to bring a relativley huge mass up to that temp.
Plus there is no guarantee that the solder would bond, depending on the 2 metals and or fluxes used.
"Now if the 4870x2 was actually notably faster than the 280 for about the same price, then I might even take a chance on it. However, that won't be the case."-robx46
"Now if the 4870x2 was actually notably faster than the 280 for about the same price, then I might even take a chance on it. However, that won't be the case."-robx46
Thats why i said the metal inside the silicon itself would melt before the silicon lost structure, also including gates and such, but the integerity of the silicon itself would still be there. Silicon makes a great insulator for electricity, but heat not so great.
"Now if the 4870x2 was actually notably faster than the 280 for about the same price, then I might even take a chance on it. However, that won't be the case."-robx46
Thats why i said the metal inside the silicon itself would melt before the silicon lost structure, also including gates and such, but the integerity of the silicon itself would still be there. Silicon makes a great insulator for electricity, but heat not so great.
"Now if the 4870x2 was actually notably faster than the 280 for about the same price, then I might even take a chance on it. However, that won't be the case."-robx46
Sorry it would not work, both surfaces have to be at solder temp for it to bond...and the very lowest solder melt's at...ready...
183 °C or 361.4 F
Some of us soldered for a living, and were taught by an aerospace engineer....and ain't no way to be delicate when you'd have to bring a relativley huge mass up to that temp.
Plus there is no guarantee that the solder would bond, depending on the 2 metals and or fluxes used.
Funny you mention aerospace engineering, I am an aerospace engineer. :-)
I believe there are techniques that aren't so heat intensive. Did you know that all PCB's are soldered at some point in manufacturing? It is called wave soldering. http://en.wikipedia.org/wiki/Wave_soldering
I assure you it is possible, my only question is how practical this would be.
Funny you mention aerospace engineering, I am an aerospace engineer. :-)
I believe there are techniques that aren't so heat intensive. Did you know that all PCB's are soldered at some point in manufacturing? It is called wave soldering. http://en.wikipedia.org/wiki/Wave_soldering
I assure you it is possible, my only question is how practical this would be.
Yes, I know what wave soldering and SMT is:
I also know that that bringing a discreet component lead up to temp is not the same as bringing a large mass up to temp, besides the fact that the large mass is designed to cool off as fast as possible. And that doesent take into account the smaller surface area and mass of the cpu. Guess which one is gonna take the heat...
There may be ways to do it, I believe Intel has tried it underneath their spreaders, but it's not gonna be done at home without cooking it.
"Now if the 4870x2 was actually notably faster than the 280 for about the same price, then I might even take a chance on it. However, that won't be the case."-robx46
