http://www.tomshardware.com/2008/04/14/ibm_finds_more_performance_and_less_power_in_32_nm_chips_/
IBM said that High-K Metal Gate (HKMG) has been integrated into the 32 nm production process at its 300 mm semiconductor fabrication facility in East Fishkill, New York. With first silicon on hand, the company and its partners Chartered, Freescale, Infineon, Samsung, STMicroelectronics and Toshiba ...
No AMD ??
Odd.
Note the ref to SOI at the end but this is nevertheless not a good sign for the little battler.
Intel already have this in their 45nm process ...
I would have thought AMD would have been part of this partnership.
So what gives?
IBM said that High-K Metal Gate (HKMG) has been integrated into the 32 nm production process at its 300 mm semiconductor fabrication facility in East Fishkill, New York. With first silicon on hand, the company and its partners Chartered, Freescale, Infineon, Samsung, STMicroelectronics and Toshiba ...
No AMD ??
Odd.
Note the ref to SOI at the end but this is nevertheless not a good sign for the little battler.
Intel already have this in their 45nm process ...
I would have thought AMD would have been part of this partnership.
So what gives?