New Build, Slight Problem with Heatsink & Memory

Tom's Hardware Forums » Homebuilt Systems » New System Build » New Build, Slight Problem with Heatsink & Memory

New Build, Slight Problem with Heatsink & Memory

Show comments: By default All Good ratings Poor ratings

Word : Username : Filter :
Bottom
Author	Thread : New Build, Slight Problem with Heatsink & Memory

thatguy2001

Profile: newbie

More Information

06-22-2008 at 09:29:03 AM

Hey Guys

I have just built a new PC with a Gigabyte GA-X48-DS4 Mobo, a Q9450 and Corsair TWIN2X4096-6400C4DHX 4GB (2x XMS2 2GB) PC-6400 (800MHz) 4-4-4-12, and an Arctic Cooler Freezer Pro 7.

I have just one problem. When I install the heatsink and then try and put the Ram into Banks 1 & 3, the heatsink on the Ram in Bank 1 touches the Arctic Freezers plastic frame around the Fan. Is this a bad thing? Would there be any problems leaving it like this?

At the moment, because of this, I have put the Ram into banks 2 & 4 and everything works great. I wanted to upgrade to 8 GB however and I was wondering if the issue I have above would be much of a problem. I guess I am worried about the plastic on the Arctics Fan (the frame only, not the actual fan) might melt. Do you think this would happen.

I can easily put the Ram into bank 1 as it only just rests against the plastic.

Thanks.

P.S: If anyone is using the same CPU and Mobo could you tell me what setting to change in the Bios to overclock it a little. To perhaps 3.0 or 3.2 GHz. Thanks. I am trying to learn about Overclocking but most of it is just going straight over my head. I just don't know what settings you actually change in the Bios to increase the speed.

Thanks.

Related Product

akhilles

Profile: Forum Veteran

More Information

06-22-2008 at 03:32:42 PM

Hide

Won't be a problem.

Tom's Hardware Forums » Homebuilt Systems » New System Build » New Build, Slight Problem with Heatsink & Memory

Go to:

Forum map
MyDiscussions.Net Forum, Version 2007.1
© 2000-2006 No1Dev

Page generated in 0.362 seconds

Google Ads

IBM promises cooler chips with capillary-action and water jets

Published on October 27, 2006

IBM's Zurich labs have developed a new heatsink and water-cooling that promises to cool chips up to six times better than conventional air cooling. The heatsink contains tiny channels similar to the capillaries you would see in tree leaves and in human circulator systems. The channels allow either water or heatsink compound to spread more uniformly and thereby dissipate more heat. Read more

Samsung ships 900 MHz GDDR3 memory

Published on December 13, 2005

Samsung today said that is mass-producing what the firm claims is the world's fastest graphics memory: Clocked at 900 MHz, the GDDR3 memory chips are 50 percent faster than the previous generation 600 MHz memory. Read more